Electrical / Environmental
RoH
il a
S
t
n
Comp
High Power Shielded Low Profile
Surface Mount Inductors
• Operating Temperature Range
• Temperature Rise, Maximum
-40°C to +180°C
50°C
Specifications
Inductance
100kHz, 0.1V
@ I
sat
@ 0 Adc
(
µ
H)
(
µ
H±20%)
Typ.
Min.
Typ.
1.00
1.33
1.94
0.83
1.50
2.10
1.30
1.50
1.20
1.60
0.70
1.20
5.00
10.0
1.20
2.00
0.63
0.93
1.28
0.488
0.80
1.12
0.80
0.97
0.92
1.15
0.40
0.80
3.60
6.80
0.80
1.20
0.70
1.16
1.60
0.61
1.00
1.40
1.00
1.20
1.02
1.44
0.52
0.90
4.30
8.00
1.00
1.60
DCR
(m
Ω
)
Typ.
2.53
3.38
4.71
1.75
2.16
3.48
2.16
4.00
1.75
2.13
1.05
1.68
6.50
12.0
1.37
2.20
(1)
Part
Number
HM70-101R0LF
HM70-201R3LF
HM70-201R9LF
HM70-25R80LF
HM70-301R5LF
HM70-302R0LF
HM70-321R3LF
HM70-351R5LF
HM70-401R2LF
HM70-401R6LF
HM70-50R70LF
HM70-501R2LF
HM70-505R0LF
HM70-50100LF
HM70-601R2LF
HM70-602R0LF
Notes:
I
sat
@ 25°C
(Adc)
16
16
12
18
16
12
16
18
18
20
30
24
7
7
20
15
(2)
Max.
2.90
3.74
5.42
2.01
2.48
4.00
2.48
4.50
1.80
2.36
1.26
2.00
8.00
15.0
1.58
2.60
Heating
Current
(Adc)
∆T=50°C
15
13
11
19
17
14
17
13
22
20
31
25
13
9
28
22
(3)
Core Loss
Factor
K1
9.07E-11
1.24E-10
1.24E-10
1.51E-10
1.40E-10
1.53E-10
1.66E-10
1.35E-10
1.80E-10
1.67E-10
1.99E-10
1.99E-10
2.21E-10
2.21E-10
2.21E-10
2.21E-10
(4)
K2
170.67
157.15
189.83
118.84
183.07
196.09
140.35
166.20
129.45
151.67
88.15
110.82
219.63
316.67
108.94
143.34
Fig.
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
(1) DC resistance is measured at 25°C
(2) The saturation current (I
sat
) is the current at which the inductance will be decreased by 20% from its initial (zero DC) value.
(3) The heating current is the DC current, which causes the component temperature to increase by approximately 50°C. This current is determined by
soldering the component on a typical application PCB, and then apply the current to the device for 30 minutes.
(4) Core Loss approximation is based on published core data:
Core Loss (Pfe) = K1 * (f)
1.338
* (K2∆I)
2.2546
Where: core loss in watt
f = frequency in kHz
K1 and K2 = core loss factor
∆I
= delta I across the component in Amp.
K2∆I = one half of the peak to peak flux density across the component in Gauss
Electrical Characteristics @ 25°C
(A) Case size 10, 20, 25, 30 & 40
2007/08 EDITION MAGNETIC COMPONENTS SELECTOR GUIDE
www.bitechnologies.com
We reserve the right to change specifications without prior notice
67
Electrical Characteristics @ 25°C (Cont’d)
(B) Case size 50 & 60
68
MAGNETIC COMPONENTS SELECTOR GUIDE 2007/08 EDITION
We reserve the right to change specifications without prior notice.
www.bitechnologies.com
Outline Dimensions (mm)
Figure 1
Top View
Bottom View
Top View
Figure 2
Bottom View
Recommended Solder
Pad Layout
Case size
10
20
25
30
32
35
40
50
60
A
9.00
9.00
9.00
9.00
9.00
10.7
11.0
13.5
14.0
B
10.5
10.5
10.5
10.5
10.5
10.25
12.6
12.9
13.0
C
3.70
4.50
5.00
5.20
5.60
4.20
5.20
5.50
5.80
D
4.80
4.80
4.80
4.80
4.80
5.60
6.20
6.50
6.50
E
1.70
1.70
1.70
1.70
1.70
1.70
2.30
2.30
2.30
F
6.00
6.00
6.00
6.00
6.00
6.00
7.50
7.50
7.50
G
8.30
8.00
8.30
8.00
8.00
10.6
10.7
13.5
14.0
H
2.30
2.00
2.30
2.00
2.00
5.60
3.70
6.50
6.50
I
6.00
6.00
6.00
6.00
6.00
6.20
7.50
7.50
7.50
J
2.80
2.80
2.80
2.80
2.80
2.10
3.10
3.00
3.00
K
3.00
3.00
3.00
3.00
3.00
2.50
3.50
3.50
3.50
Packaging
Standard:
Embossed Tape & Reel
Reel:
Diameter:
Capacity:
=
Case size 10,20,25,30,32 =
Case size 35,40,50,60
=
13” (330.2mm)
500 Units
400 Units
Ordering Information
Model Series
Case Size
Inductance Code:
First 2 digits are significant.
Last digit denotes the number
of trailing zeros. For values
below 10µH, “R” denotes the
decimal point.
HM70
50
1R2
LF
TR13
Lead-Free
TR - Tape & Reel Packing
13 - 13” reel
2007/08 EDITION MAGNETIC COMPONENTS SELECTOR GUIDE
www.bitechnologies.com
We reserve the right to change specifications without prior notice
69
Embedded System
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