DL 300 DL1200
FAST RECOVERY HIGH VOLTAGE 25mA
MINIATURE SILICON RECTIFIERS
SMALL SIZE MOLDED PACKAGE
PRV 3,000 TO 12,000 VOLTS
1.0 INCH MIN. LEADS
LOW LEAKAGE
EDI
Type
DL300
DL500
DL800
DL1000
DL1200
PRV
Volts
3,000
5,000
8,000
10,000
12,000
ELECTRICAL CHARACTERISTICS (at T
A
=25
o
C Unless Otherwise Specified)
Average Rectified Forward Current @ 50 C, I
O
Max. Peak Surge Current, I
FSM
(8.3ms)
o
25 mA
3 Amp
Max. Reverse Recovery T
rr
(Fig.4)
Max. Forward Voltage Drop @25 m
A,
V
F
Max. DC Reverse Current @ PRV and 25 C, I
R
Max. DC Reverse Current @ PRV and 100 C, I
R
Ambient Operating Temperature Range, T
A
Storage Temperature Range, T
STG
NOTES:
o
o
150nanosec
26Volts
1
25
o
A
A
o
-55 C to +125 C
-55 C to +150 C
o
o
1.It is recommended that a proper heat sink be used on the terminals of this device between the body and
soldering point to prevent damage from excess heat.
2.If operated over 10,000v/inch in length, devices should be immersed in oil or ree - ncapsulated.
EDI reserves the right to change these specifications at any time without notice.
DL300
FIG.1
OUTPUT CURRENT vs AMBIENT TEMPERATURE
100
100
DL 1200
1.0SEC
FIG.2
NON- REPETITIVE SURGE CURRENT
0.1SEC
% RATED FWD CURRENT
% MAXIMUM SURGE
75
75
50
50
25
25
0
0
25
50
75
100
125
150
0
1
2
3
4
5
6
7 8 9 10
20
30
40 50 60
O
AMBIENT TEMPERATURE
C
CYCLES(60 Hz)
FIG.3
MECHANICAL
LEAD-SOLDER DIPPED COPPER
MARKING:CATHODE BAND
AND DEVICE TYPE
1.0Min Both Ends
.021 Dia.
.125 Dia.
.400
FIG.4
REVERSE RECOVERY TEST METHOD
RECOVERY WAVE FORM
T
rr
RECOVERY WA VE FORM
1000
NI
D.U.T.
0.1
+
I
F
=2MA
I
RR
=1MA
I
R
=5MA
-
WAVE FORMS
PULSE
GENERATOR
50
NI
SCOPE
CIRCUIT
ELECTRONIC DEVICES, INC.
DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
* YONKERS. NEW YORK 10710 914-965-4400
* FAX 914-965-5531
* 1-800-678-0828
Ee-mail:sales@edidiodes.com
*
Wwebsite:
http://www.edidiodes.com
PCB Design
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