Company Name：
Digi International
Customer Part Number：
Pinrex Part Number：
Description：
984-63-052202
Mini PCI Express Socket
0.8Pitch 52P
3FL-3,NO.16,LANE 609,SEC.5,CHUNG HSIN ROAD
SAN CHUNG CITY,TAIPEI HSIEN,TAIWAN R.O.C.
TEL : (02) 2999-9001
本公司通過 QA
FAX : (02) 2999-9002
ISO9000 及 140001 認証
Scope:
This specification covers the requirements for product performance, test methods and quality
assurance provisions of Mini PCI Express.
Performance and Descriptions:
The product is designed to meet the electrical, mechanical and environmental performance
requirements specification. Unless otherwise specified, all tests are performed at ambient
environmental conditions.
ROHS:
All material in according with the ROHS environment related substances list controlled.
MATERIAL AND
INSULATOR
Material
FINISH
Housing: High Temperature Plastic UL94V-0
CONTACT
Material
Plating
Brass
Contact Plating: 3u” and 15u” selective gold.
Solder: Lead free.
SHELL OR COVER
Material
Plating
Latch: Stainless
OTHERWISE SPECIFIED
Voltage rating: 50VAC
Current: 0.5A
Operating Temperature: -55℃~+85℃
ELECTRICAL
Item
Contact resistance
Requirement
30 milliohms
Test Condition
Subject mated contacts assembled in housing to
closed circuit current of 10mA(max) at open circuit
voltage of 20mV voltage(Max).
Measured by applying 500VDC between adjacent
contacts of unmated connector.
Measured by applying 250VAC for one minute
between adjacent contacts of unmated connector
assemblies. MIL-STD-202 method 301
Insulation resistance
Dielectric Strength
500MΩ(Min)
No breakdown
Current leakage:
0.5mA
MECHANICAL
Item
Vibration test
Requirement
No electrical
discontinuity greater
than 1 microsecond.
ΔR=20mΩ Max
1.No electrical
discontinuity greater
than 1 microsecond
2.ΔR=20mΩ
Max.
No physical damage.
124pos.
51.5N(5.3Kgf) Max.
ΔR=20mΩ Max
Test Condition
Subject mated connectors to 10-55-10 Hz
traversed in 1 minute at 1.52mm amplitude 2 hours
each of 3 mutually perpendicular planes.
MIL-STD-202 method 201.
Subject mated connector to 50G’s，half-sine shock
pulses of 11 millisecond duration，3drops in each
direction applied along the 3 mutually perpendicular
planes total 18 drops.
MIL-STD-202 method 202.
Operation speed: 100mm/min measure the force
required to mate connectors.
Repeat insertion and extraction of PCB to and from
the connector with the turns to lock it and then
unlock it for 100 cycles.
Physical shock
PCB mating force
Durability
SOLDER ABILITY
Item
Solder ability
Resistance to
Soldering heat.
Requirement
Wet solder coverage:
95% Min.
No physical damage.
Test Condition
Solder temperature: 260±5℃
Immersion duration: 3±0.5sec.
ENVIRONMENTAL
Item
Humidity
Requirement
1.Contact resistance:
△R=20mΩ Max
2.Insulation resistance:
500mΩ Min.
3.No physical damage.
Thermal shock
1.Contact resistance:
△R=20mΩ Max.
No physical damage
Expose the mated connectors to
-55℃/30min
and 85℃/30min.
Repeat 5 cycles.
Test Condition
Expose the mated connectors to 40±2℃
Relative humidity 90~95% for 96 hours.
MIL-STD-202 method 103.
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