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MHI0402C3N3ST-T

Description
Fixed Inductors 0402 Package 3.3 nH
CategoryPassive components    inductor   
File Size494KB,4 Pages
ManufacturerAEM [ American Electronic Materials]
Environmental Compliance
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MHI0402C3N3ST-T Overview

Fixed Inductors 0402 Package 3.3 nH

MHI0402C3N3ST-T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAEM [ American Electronic Materials]
package instruction0402
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0402
structureMultilayer Chip
core materialCeramic
DC Resistance0.22 Ω
Nominal inductance(L)0.0033 µH
Inductor typeGENERAL PURPOSE INDUCTOR
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package height0.5 mm
Package length1 mm
Package formSMT
Package width0.5 mm
method of packingTR
Minimum quality factor (at nominal inductance)8
Maximum rated current0.3 A
self resonant frequency6000 MHz
seriesMHI
Base Number Matches1
AEM Components Co., Ltd
Multilayer Ceramic Inductors
Features
Monolithic structure with high reliability
Standard EIA/EIAJ chip sizes such as 0402/1005 and 0603/1608
High quality ceramic material and unique manufacturing processes
providing high Q at high frequencies and high self-resonant
frequencies
Superior termination bonding strength
Nickel barrier with solder overplated termination offering excellent
solderability and solder leach resistance, suitable for both wave
and reflow soldering processes
Operating Temperature
-40º — +125º
C
C
Product Identification
MHI 0603 C 1N8 S T - T
(1) (2) (3) (4) (5) (6) (7)
(1)
(2)
(3)
(4)
Series code :
MHI: Multilayer Ceramic Inductor
Dimensions: L x W inches
The first two digits: L (length)
The last two digits: W (width)
Characteristic code: C
Value code: Inductance
N — decimal point for nH
Example: 1N8 = 1.8 nH
R — decimal point for µH (1000 nH)
Example: R12 = 0.12 µH = 120 nH
Tolerance code:
J =±
5%
K =±
10%
S = ± nH
0.3
Package code:
T = Tape & Reel
B = Bulk
Termination plating code:
T = 100% Sn plating Terminations
(Sn/Pb plating no longer available)
Applications
High frequency equipment including cellular phones, pagers, radar
detectors, computer communications, etc
(5)
Recommended PC Board Land Patterns
CHIP SIZE
EIA/EIAJ
0402(1005)
0603(1608)
L
INCH (mm)
0.063 (1.60)
0.102 (2.60)
G
INCH (mm)
0.016 (0.40)
0.022 (0.55)
H
INCH (mm)
0.024 (0.60)
0.037 (0.94)
(6)
(7)
Shape and Dimensions
G
H
SILVER
METALLIZATION
T
SOLDER
W
NICKEL
L
L
ELECTRODE
BW
SIZE
EIA/EIAJ
0402/1005
0603/1608
LENGTH (L)
INCH (mm)
0.039 ± 0.004
(1.00 ± 0.10)
0.063 ± 0.006
(1.60 ± 0.15)
WIDTH (W)
INCH (mm)
0.020 ± 0.004
(0.50 ± 0.10)
0.031 ± 0.006
(0.80 ± 0.15)
THICKNESS (T)
INCH (mm)
0.020 ± 0.004
(0.50 ± 0.10)
0.031 ± 0.006
(0.80 ± 0.15)
TERMINATION (BW)
INCH (mm)
0.010± 0.004
(0.25 ± 0.10)
0.014 ± 0.006
(0.36 ± 0.15)
20
458 Shenhu Road, Suzhou Industrial Park Jiangsu, P.R. China
www.aemchina.com
Phone: 86-512-62580028, Fax: 86-512-62580018
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