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The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
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When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
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Pure electric vehicles, structurally speaking, have components such as a power battery. In addition to the power battery, a small battery also powers some low-voltage electrical components and even...[Details]
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With the advent of the electric car era, the number of pure electric vehicles has increased significantly, but many car owners do not know how to properly maintain pure electric vehicles. In additi...[Details]
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Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
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A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
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Plug-in hybrid vehicles (PHEVs) utilize two powertrains. Their pure electric range is typically inferior to that of pure electric vehicles, often reaching less than half that. Currently, mainstream...[Details]
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The Radxa Cubie A7A is a single-board computer (SBC) powered by the Allwinner A733 octa-core Cortex-A76/A55 SoC, equipped with a 3 TOPS AI accelerator and up to 16GB of LPDDR5 memory.
Fo...[Details]
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At present, the most troubling thing about pure electric vehicles as new energy sources is not only the range anxiety, but also the disadvantage of long charging time. At present, ternary lithium b...[Details]
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EVTank predicts that all-solid-state batteries will achieve small-scale mass production in 2027 and large-scale shipments by 2030. Global solid-state battery shipments will reach 614.1GWh, of which...[Details]
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This new standardized, pre-integrated computing platform is designed to accelerate chip development, reduce development costs, and provide scalable software to power the AI-defined car.
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