EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-02-3323-G

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WBC-B0202AA-02-3323-G Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-02-3323-G - - View Buy Now

WBC-B0202AA-02-3323-G Overview

Resistor Networks & Arrays

WBC-B0202AA-02-3323-G Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
What is PCB
很多人都听说过"PCB"这个英文缩写名称。但是它到底代表什么含义呢?其实很简单,就是印刷电路板(Printed circuit board,PCB)。它几乎会出现在每一种电子设备当中。如果在某样设备中有电子零件,它们都是镶在大小各异的PCB上的。除了固定各种小零件外,PCB的主要功能是提供上头各项零件的相互电气连接。 随着电子设备越来越复杂,需要的零件自然越来越多,PCB上头的线路与零件也越来越密...
yuandayuan6999 PCB Design
Who can help me write the notes for the company's heating pad program? PIC, please...
As the title says, I want to increase the overall temperature. MCU: PIC16F716, 17,18 pins are connected to two temperature sensors, 1,13 pins are connected to two optocouplers to control the heating s...
sinping 51mcu
I would like to ask an expert to help me. This circuit has noise after it is printed. I have been working on it for several days but still cannot figure it out. Which position is not properly laid out? Thank you
I would like to ask an expert to help me. This circuit has noise after it is printed. I have been working on it for several days but still cannot figure it out. Which position is not properly laid out...
yangjianyuen PCB Design
The company wants to migrate the system and gave me a navigation dog test. I found that the CAB package cannot be run?
Navigation Dog: System: Windows Embedded CE6.0 Problem: 1. Double-click the .cab file, and it says there is no associated application. 2. The CF version in the system is 3.5. I use CF3.5 to develop so...
atpccb Embedded System
Reference book on porting from SXX32F103 to MH32F103A
The MH32F103A series microcontrollers are basically compatible with the SXX32F103 series, while enhancing many functions. There are some differences from the SXX32F103, which are detailed in this docu...
xinlinggo stm32/stm8
Dear seniors, can you give me some advice? — I want to find a part-time job after work
I graduated this year and have been working full-time in a company in Beijing. Currently, I can complete all the work during my working hours. However, I don’t want to be a developer for the rest of m...
Hellovictoria Talking about work

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1078  911  2012  827  674  22  19  41  17  14 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号