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SDE6603-221M

Description
Fixed Inductors 220uH 20% SMD 6603
CategoryPassive components    inductor   
File Size533KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
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SDE6603-221M Overview

Fixed Inductors 220uH 20% SMD 6603

SDE6603-221M Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
package instruction2618
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time12 weeks
Samacsys DescriptionFixed Inductors 220uH 20% SMD 6603
uppercase and lowercase codes2618
structureRectangular
core materialFERRITE
DC Resistance3.11 Ω
Nominal inductance(L)220 µH
Inductor ApplicationsPOWER INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee4
Number of functions1
Number of terminals2
Maximum operating temperature105 °C
Minimum operating temperature-25 °C
Package height2.92 mm
Package length6.6 mm
Package formSMT
Package width4.45 mm
method of packingTR, EMBOSSED, 13 INCH
Maximum rated current0.2 A
self resonant frequency5.5 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceSilver/Nickel/Gold (Ag/Ni/Au)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency0.1 MHz
Tolerance20%
PL
IA
NT
Features
n
Unit height of 2.9 mm
Applications
n
DC/DC converters
n
Power supplies for:
OM
2R2
LE
AD
F
RE
E
*R
oH
S
n
Inductance range: 1 to 1000 μH
n
Rated current up to 2.9 A
n
RoHS compliant*
C
• Portable communication equipment
• Laptop computers
• Camcorders, HDTV
SRF
(MHz)
Typ.
130
115
90
70
50
45
35
30
20
15
14
11
9
6
5.5
5
4
3
2
SDE6603 Series - SMD Power Inductors
General Specifications
DCR
(W)
Max.
0.05
0.06
0.07
0.08
0.09
0.13
0.16
0.23
0.37
0.51
0.64
0.86
1.27
2.0
3.11
3.8
5.06
9.2
13.8
I rms
(A)
2.9
2.8
2.4
2.0
1.5
1.4
1.1
1.0
0.8
0.6
0.5
0.4
0.3
0.25
0.2
0.16
0.15
0.12
0.07
I sat
(A)
2.9
2.6
2.3
2.0
1.5
1.2
1.1
0.9
0.7
0.58
0.5
0.4
0.31
0.27
0.22
0.18
0.16
0.14
0.1
**K-
Factor
1000
867
684
520
448
371
302
245
200
160
137
70
57
45
38
30
26
22
18
Electrical Characteristics
Bourns Part No.
SDE6603-1R0M
SDE6603-1R5M
SDE6603-2R2M
SDE6603-3R3M
SDE6603-4R7M
SDE6603-6R8M
SDE6603-100M
SDE6603-150M
SDE6603-220M
SDE6603-330M
SDE6603-470M
SDE6603-680M
SDE6603-101M
SDE6603-151M
SDE6603-221M
SDE6603-331M
SDE6603-471M
SDE6603-681M
SDE6603-102M
Inductance
@ 100KHz
L (μH) ±20 %
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
470
680
1000
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Test Voltage ........................................0.1 V
Reflow Soldering ....... 230 °C, 50 sec max.
Operating Temperature...-25 °C to +105 °C
(Temperature rise included)
Storage Temperature ......-40 °C to +125 °C
Resistance to Soldering Heat
................................... 260 °C for 10 sec.
Moisture Sensitivity Level ......................... 1
ESD Classification (HBM)..................... N/A
Materials
Core ..................................................Ferrite
Wire ................................Enameled copper
Base ..............................................Ceramic
Adhesive .................................. Epoxy resin
Terminal ........................................Ag/Ni/Au
Rated Current..Ind. drop of 10 % typ. at Isat
Temperature Rise .......40 °C typical at Irms
Packaging ......... 2000 pcs. per 13-inch reel
Product Dimensions
6.60
(0.260)
MAX.
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple current,
A), determine core loss from
Core Loss vs. Flux Density
plot.
Core Loss vs. Flux Density
10000
4.45
(0.175)
MAX.
1.27
(0.050)
TYP.
1000
4.32
(0.170)
TYP.
Core Loss (mW)
100
10
1 MHz
600 KHz
500 KHz
300 KHz
200 KHz
100 KHz
50 KHz
3.90
(0.154)
TYP.
1.02
(0.040)
TYP.
2.92
(0.115)
MAX.
Recommended Layout
3.56
(0.140)
6.86
REF.
(0.270)
1
1.4
(0.055)
4.06
(0.160)
1.4
(0.055)
0.1
100
MM
DIMENSIONS:
(INCHES)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including
annex and RoHS Recast 2011/65/EU June 8, 2011.
Flux Density Bp-p (gauss)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
1000
10000

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