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70825L20PFI8

Description
TQFP-80, Reel
Categorystorage   
File Size208KB,21 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

70825L20PFI8 Overview

TQFP-80, Reel

70825L20PFI8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeTQFP
package instructionTQFP-80
Contacts80
Manufacturer packaging codePN80
Reach Compliance Codenot_compliant
ECCN codeEAR99
Is SamacsysN
Maximum access time20 ns
JESD-30 codeS-PQFP-G80
JESD-609 codee0
length14 mm
memory density131072 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals80
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX16
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP80,.64SQ
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.005 A
Maximum slew rate0.33 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1
IDT70825S/L
HIGH SPEED 128K (8K X 16 BIT)
SEQUENTIAL ACCESS
RANDOM ACCESS MEMORY (SARAM™)
x
Features
High-speed access
– Military: 35/45ns (max.)
– Commercial: 20/25/35/45ns (max.)
Low-power operation
– IDT70825S
Active: 775mW (typ.)
Standby: 5mW (typ.)
– IDT70825L
Active: 775mW (typ.)
Standby: 1mW (typ.)
8K x 16 Sequential Access Random Access Memory
(SARAM
)
– Sequential Access from one port and standard Random
Access from the other port
– Separate upper-byte and lower-byte control of the
Random Access Port
High speed operation
– 20ns t
AA
for random access port
– 20ns t
CD
for sequential port
– 25ns clock cycle time
x
x
x
x
x
x
x
x
x
x
x
Architecture based on Dual-Port RAM cells
Compatible with Intel BMIC and 82430 PCI Set
Width and Depth Expandable
Sequential side
– Address based flags for buffer control
– Pointer logic supports up to two internal buffers
Battery backup operation - 2V data retention
TTL-compatible, single 5V (+10%) power supply
Available in 80-pin TQFP and 84-pin PGA
Military product compliant to MIL-PRF-38535 QML
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Description
The IDT70825 is a high-speed 8K x 16-Bit Sequential Access
Random Access Memory (SARAM). The SARAM offers a single-chip
solution to buffer data sequentially on one port, and be accessed
randomly (asynchronously) through the other port. The device has a
x
Functional Block Diagram
A
0-12
CE
OE
R/W
LB
LSB
MSB
UB
CMD
I/O
0-15
13
Random
Access
Port
Controls
Sequential
Access
Port
Controls
8K X 16
Memory
Array
16
13
13
13
13
13
RST
SCLK
CNTEN
SOE
SSTRT
1
SSTRT
2
SCE
SR/W
SLD
SI/O
0-15
,
Data
L
Addr
L
Data
R
Addr
R
16
Reg.
13
16
RST
Pointer/
Counter
Start Address for Buffer #1
End Address for Buffer #1
Start Address for Buffer #2
End Address for Buffer #2
Flow Control Buffer
Flag Status
13
EOB
1
COMPARATOR
EOB
2
3016 drw 01
APRIL 2000
1
©2000 Integrated Device Technology, Inc.
DSC-3016/9
6.07

70825L20PFI8 Related Products

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Description TQFP-80, Reel Standard SRAM, 8KX16, 25ns, CMOS, PQFP80, TQFP-80 Standard SRAM, 8KX16, 35ns, CMOS, PQFP80, TQFP-80 TQFP-80, Tray Standard SRAM, 8KX16, 20ns, CMOS, PQFP80, TQFP-80 Standard SRAM, 8KX16, 20ns, CMOS, PQFP80, TQFP-80 Standard SRAM, 8KX16, 20ns, CMOS, PQFP80, TQFP-80 Standard SRAM, 8KX16, 35ns, CMOS, PQFP80, TQFP-80 Standard SRAM, 8KX16, 25ns, CMOS, PQFP80, TQFP-80
Is it lead-free? Contains lead Lead free Lead free Contains lead Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? incompatible conform to conform to incompatible conform to conform to conform to conform to conform to
Parts packaging code TQFP QFP QFP TQFP QFP QFP QFP QFP QFP
package instruction TQFP-80 TQFP-80 TQFP-80 TQFP-80 LQFP, TQFP-80 TQFP-80 TQFP-80 TQFP-80
Contacts 80 80 80 80 80 80 80 80 80
Reach Compliance Code not_compliant compliant compliant not_compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 20 ns 25 ns 35 ns 20 ns 20 ns 20 ns 20 ns 35 ns 25 ns
JESD-30 code S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80
JESD-609 code e0 e3 e3 e0 e3 e3 e3 e3 e3
length 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
memory density 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16 16 16 16
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 80 80 80 80 80 80 80 80 80
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C
organize 8KX16 8KX16 8KX16 8KX16 8KX16 8KX16 8KX16 8KX16 8KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 260 260 240 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) MATTE TIN MATTE TIN Tin/Lead (Sn85Pb15) Tin (Sn) MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 30 30 20 30 30 30 30 30
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Base Number Matches 1 1 1 1 1 1 1 - -
Other features - AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN - - - AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN
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