Multilayer Organic (MLO
TM
)
0805 CDMA Diplexer
MLO
TM
TECHNOLOGY
The 0805 diplexer is a best in class low profile
multilayer organic passive device that is based
on AVX’s patented multilayer organic high
density interconnect technology. The MLO
TM
diplexer uses high dielectric constant and low
loss materials to realize high Q passive printed
passive elements such as inductors and
capacitors in a multilayer stack up. The MLO
TM
diplexers can support multiple wireless
standards such as WCDMA, CDMA, WLAN,
and GSM and are less than 0.6mm in
thickness. These components are ideally
suited for band switching for dual band
systems. All diplexers are expansion matched
to FR4 thereby resulting in improved reliability
over standard Si and ceramic devices.
APPLICATIONS
Multiband applications including WCDMA,
WLAN, WiMax, GPS, and cellular bands
LAND GRID ARRAY
ADVANTAGES
•
•
•
•
Low Insertion Loss
Excellent Solderability
Low Parasitics
Low Profile
HOW TO ORDER
DP
Type
COMPONENT DIMENSIONS AND FUNCTIONS
7
Finish
7 = Au
T = NiSn
05
Size
A
Design
1920
Frequency
(MHz)
TR
Packaging
Tape & Reel
TR = 3 Kpcs
TR/500 = 500 pcs
Bottom View
0.20±0.10
(0.008±0.004)
0.64±0.05
(0.025±0.002)
Side View
1.28±0.20
(0.050±0.008)
0.95±0.05
(0.037±0.002)
0.04±0.04
(0.002±0.002)
0.25±0.10
(0.010±0.004)
QUALITY INSPECTION
Finished parts are 100% tested for electrical parameters
and visual characteristics.
0.20±0.10
(0.008±0.004)
2.12±0.20
(0.083±0.008)
0.44±0.10
(0.017±0.004)
0.55±0.10
(0.022±0.004)
Unit: mm (inches)
OPERATING TEMPERATURE
-40ºC to +85ºC
TERMINATION
Finishes available in Ni/Sn, Immersion Sn, Immersion Au
and OSP coatings which are compatible with automatic
soldering technologies which include reflow, wave
soldering, vapor phase and manual.
Terminal No.
1
2
3
4
5
6
Terminal Name
High Frequency Port
GND
Low Frequency Port
GND
Common Port
GND
ORIENTATION IN TAPE
Top View
PART NUMBER: DP05A19207TR
Specification @ 25ºC
Size [mm(inches)]
Height [mm(inches)]
Volume (mm^3)
Frequency Range (F1) (MHz)
Frequency Range (F2) (MHz)
Insertion Loss (F1, at Fc) (dB)
Insertion Loss (F2, at Fc) (dB)
Attenuation (F1) at (F2) (dB)
Attenuation (F2) at (F1) (dB)
VSWR (Input @ F1)
VSWR (Input @ F2)
VSWR (Lowband @ F1)
VSWR (Highband @ F2)
2.12 x 1.28 (0.083 x 0.050)
0.55 (0.021)
1.5
859±35
1920±70
-0.4
-0.6
-23
-23
1.4
1.3
1.4
1.4
6
5
4
1
2
3
6
5
4
1
2
3
POWER CAPACITY
4.5W Maximum
1
Multilayer Organic (MLO
TM
)
0805 WLAN/BT Diplexer
AUTOMATED SMT ASSEMBLY
The following section describes the guidelines for automated
SMT assembly of MLO
TM
RF devices which are typically Land
Grid Array (LGA) packages or side termination SMT pacages.
Control of solder and solder paste volume is critical for
surface mount assembly of MLO
TM
RF devices onto the PCB.
Stencil thickness and aperture openings should be adjusted
according to the optimal solder volume. The following are
general recommendations for SMT mounting of MLO
TM
devices onto the PCB.
SMT REFLOW PROFILE
Common IR or convection reflow SMT processes shall be
used for the assembly. Standard SMT reflow profiles, for
eutectic and Pb free solders, can be used to surface mount
the MLO
TM
devices onto the PCB. In all cases, a temperature
gradient of 3°C/sec, or less, should be maintained to prevent
warpage of the package and to ensure that all joints reflow
properly. Additional soak time and slower preheating time
may be required to improve the out-gassing of solder paste.
In addition, the reflow profile depends on the PCB density
and the type of solder paste used. Standard no-clean solder
paste is generally recommended. If another type of flux is
used, complete removal of flux residual may be necessary.
Example of a typical lead free reflow profile is shown below.
Tp
Ramp-up
T
L
tp
Critical Zone
T
L
to Tp
t
L
Temperature
Ts max
Ts min
ts
Preheat
Ramp-down
25
t 25ºC to Peak
Time
Figure A. Typical Lead Free Profile and Parameters
Profile Parameter
Ramp-up rate (Tsmax to Tp
Preheat temperature (Ts min to Ts max)
Preheat time (ts)
Time above T
L
, 217ºC (t
L
)
Peak temperature (Tp)
Time within 5ºC of peak temperature (tp)
Ramp-down rate
Time 25ºC to peak temperature
Pb free, Convection, IR/Convection
3ºC/second max.
150ºC to 200ºC
60 – 180 seconds
60 – 120 seconds
260°C
10 – 20 seconds
4ºC/second max.
6 minutes max.
9
Embedded System
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