1. OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2. I
rms
DC current for an approximate
ΔT
of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
3. I
sat
Amps Peak for approximately 10% rolloff @ 20°C
4. I
sat
Amps Peak for approximately 15% rolloff @ 20°C
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p =K*L*ΔI.
Bpp: (Gauss), K: (K factor from table), L: (Inductance in μH),
ΔI
(Peak to peak ripple
current in Amps).
6. Part number definition:
FP3 = product code and size
xxx = inductance value in μH
R = decimal point (if no “R” is present, then last character equals the number of zeros)
“-R” suffix = RoHS complaint
Dimensions–mm
RECOMMENDED PAD LAYOUT
2.80 ±0.25
(2x)
SCHEMATIC
1
3.00 Max
FP3
XXX
YWWL
2
6.70
Max
1.0 min.
(2x)
7.25
Max
7.50
1
2.50 (2x)
2.80 ±0.25
(2x)
2
4.50 (2x)
Part marking: FP3 (Product code and size), xxx=(inductance value in μH),
R=decimal point (if no “R” is present, then last character equals the number of zeroes, YWW=Date code, L=Location code
Packaging information (mm)
Supplied in tape and reel packaging, 1700 parts per 13” diameter reel
1.5 Dia
4.0
2.0
1.5 Dia
A
1
1.75
7.5
7.5
FP3
XXX
YWWL
16.0
+/-0.3
2
6.9
3.2
SECTION A-A
2
www.eaton.com/elx
A
12.0
Direction of Feed
FP3
High current, low profile inductors
Inductance characteristics
Technical Data
4118
Effective October 2015
OCL vs. Isat
100
90
80
% of OCL
70
60
50
40
30
20
10
0
0
20
40
60
80
100
120
140
160
180
200
% of Isat
Core loss
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
250
Frequency (kHz)
200
300
400
500
600
700
800
900
1000
Core Loss (W)
500
750
1000 1250 1500 1750 2000 2250
B p-p (Gauss)
Temperature rise vs. total loss
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
Temperature Rise (°C)
0.12
0.24
0.36
0.48
0.61
0.73
0.85
0.97
1.09
1.21
1.33
1.45
1.57
Total Loss (W)
www.eaton.com/elx
3
Technical Data
4118
Effective October 2015
FP3
High current, low profile inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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