SFP 1xN
UE75-A20-3000T
Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage
mounted to a host PCB.
Amphenol’s single port SFP connectors are rated up to 6 Gbps. The connector accepts multiple
transceivers per INF-8074i and combines, transmits, and receives functions in a low cost, compact, and
exible format. The cages have a two-piece construction with enhanced transceiver mating tabs
available in a press- t version or a solder tail version. Longer and shorter pins are available as custom
options. Single row versions (1xN) consist of SMT connectors used with a separate single row cage
(press- t or solder tail).
U77-A2114-2001
U77-A4114-2001
U77-A4113-0100
Speci cation Highlights
The interconnect system is comprised of a cage
assembly which is used with 20-position SFP
connectors complying with MSA Agreement INF-8074i.
General Characteristics
•
RoHS Compliant
•
Industry Standard Footprint
•
Industry Standard EIA-364
Mechanical Characteristics
•
Accepts Multiple Transceivers per INF-8074i
•
Compliant Press-Fit Pins or Solder Tails (1x1
Cages)
•
Durability: 250 Mating Cycles min
Electrical Characteristics
•
Hot Swappable
•
Operating Voltage: 3.3 V
•
Operating Current: 0.5 A
•
Differential Impedance: 100 Ω +/- 10 Ω
•
DWV: 300 V AC
•
Insulation Resistance: 1000 MΩ min
•
Contact Resistance: 70 mΩ max
•
Spring Fingers for Superior EMI Grounding
Packaging
•
Tape and Reel Packaging: Connector or Cage
•
Tray Packaging: Cage of all Sizes
•
Bulk Packaging: Dust Cover
8
Materials
•
Cage
o
Base Material: Copper Alloy
o
Plating: Nickel or Tin
o
Light Pipe: Optical Grade Polycarbonate
o
Heat Sink: Aluminum Alloy
o
Heat Sink Clip: Stainless Steel
o
Dust Cover: Thermoplastic
o
EMI Ground Tabs: Stainless Steel
•
Connector
o
Contact Base Material: Copper Alloy
o
Contact Plating: Gold on Mating Area, Gold
or Matte Tin on Termination
o
Housings: Glass Reinforced, Lead-Free Solder
Reflow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
•
Operating Temperature: -55°C to +85°C
•
Storage Temperature: -55°C to +105°C
Con gurations
(Rows x Ports per Row)
•
1x1
•
1x2
•
1x4
•
1x6
Options
•
Dust Cover
•
Light Pipe
•
Heat Sink (Standard Fin for Final Cage Combo)
•
Enhanced EMI Performance Cage
Ordering Information
U77-C6114-2011
U77-E1128-2001
SFP Connector
UE75
A
20
X
SERIES DESIGNATION (RoHS)
A
- R/A Single Surface Mount Connector
UE75
-
A 20
-
X 0 0 X X
J
- Tape and Reel Packaging (480 per Reel)
T
- Tape and Reel Packaging (500 per Reel)
PACKAGING
X
STYLE
20
- 20 Positions
NUMBER OF POSITIONS
CONTACT PLATING
0
- Non Lubricated
1
- Lubricant Added
0
- Standard
LUBRICANT OPTION
X
2
- 30 µ" Gold Plating on Mating Area; Gold Flash on Termination
3
- 30 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
5
- 15 µ" Gold Plating on Mating Area; Gold Flash on Termination
6
- 15 µ" Gold Plating on Mating Area; Matte Tin Plating on Termination
0
0
0
- Standard
OPTION 1
SFP Cage
U77
X
U77
-
X X X X X
-
X X X X
1
- Tray Packaging (ACC Re-Packed)
T
- Tape and Reel Packaging (for 1x1 Only)
SERIES DESIGNATION
A
- One Row
C
- One Row Cage; Light Pipe Combo (on Top)
E
- One Row Cage; Heat Sink Combo
F
- One Row Cage; 1 degree Angle (For 1x1 Only)
PACKAGING
X
STYLE
X
1
- Single in Row
2
- Inline 1x2
4
- Inline 1x4
6
- Inline 1x6
NUMBER OF PORTS IN ROW
0
- Standard
1
- Cage With Light Pipe on Top
8
- Cage with Half Moon Mid G-Pins
OPTION 1
X
0
- Without Dust Cover
D
- With Dust Cover (Shipped Loose)
DUST COVER OPTION
X
X
1
- Metal Grounding Tabs
2
- Inner and Outer Flexible Spring Fingers
CHASSIS GROUNDING
1
- Bright Tin (for Wave Solder)
2
- Nickel
3
- Matte Tin (for Reflow 245 degrees)
PLATING
X
X
1
- No Heat Sink / Light Pipe
2
- Heat Sink
3
- Light Pipe (for 1xN Cage Only)
HEAT SINK / LIGHT PIPE OPTION
X
- Various Options Available
Consult Sales or Website for Details
PCB MOUNTING OPTION
X
Telephone: (416)-291-4401
All speci cations are subject to change without notice.
Website: www.amphenol-highspeed.com
9
Email: cages@amphenol-highspeed.com
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