EEWORLDEEWORLDEEWORLD

Part Number

Search

CHP2208K3834FNT131

Description
Fixed Resistor, Metal Glaze/thick Film, 0.75W, 3830000ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2208,
CategoryPassive components    The resistor   
File Size152KB,9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

CHP2208K3834FNT131 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 3830000ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 2208,

CHP2208K3834FNT131 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid965090922
Reach Compliance Codecompliant
Country Of OriginFrance
ECCN codeEAR99
YTEOL7.8
structureChip
JESD-609 codee2
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length5.58 mm
Package formSMT
Package width1.91 mm
method of packingTR
Rated power dissipation(P)0.75 W
GuidelineMIL-R-55342D
resistance3830000 Ω
Resistor typeFIXED RESISTOR
seriesCHP HYBRID
size code2208
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Silver (Sn/Ag) - with Nickel (Ni) barrier
Tolerance1%
Operating Voltage200 V
CHP, HCHP
Vishay Sfernice
High Stability Resistor Chips (< 0.25 % at Pn at 70 °C during 1000 h)
Thick Film Technology
FEATURES
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at + 70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform
MIL-R-55342 D.
to
specifications
NFC
83-240
and
Robust terminations
Large ohmic value range 0.1
Ω
to 100 MΩ
Tight tolerance to 0.5 %
CHP: Standard passivated version for
industrial, professional and military applications
HCHP: For high frequency applications
ESCC approved see CHPHR
SMD wraparound chip resistor
Halogen-free according to IEC 61249-2-21 definition
Compliant to RoHS directive 2002/95/0EC
Sputtered Thin Film terminations, with nickel barrier, are very
convenient for high operating conditions. They can withstand
thousands of very severe thermal shocks.
B (W/A), N (W/A) and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
DIMENSIONS
in millimeters (inches)
A
D
D
C
D
A
D
C
E
E
B
A
B
VALUE
TOL.
VALUE
TOL.
1.27
0.152
0.60
0502
0.127 (0.005)
(0.050)
(0.006)
(0.024)
1.27
0.152
1.27
0.127 (0.005)
0505
(0.050)
(0.006)
(0.050)
1.52
0.152
0.85
0603
0.127 (0.005)
(0.060)
(0.006)
(0.033)
0705/
1.91
0.152
1.27
0.127 (0.005)
0805
(0.075)
(0.006)
(0.050)
2.54
0.152
1.27
0.127 (0.005)
1005
(0.100)
(0.006)
(0.050)
3.05
0.152
1.60
1206
0.127 (0.005)
(0.120)
(0.006)
(0.063)
3.81
0.152
1505
1.32 (0.052)
0.127 (0.005)
(0.150)
(0.006)
5.08
0.152
2.54 (0.100)
0.127 (0.005)
2010
(0.200)
(0.006)
2.54
0.152
5.08 (0.200)
0.127 (0.005)
1020
(0.100)
(0.006)
5.58
0.152
2208
1.91 (0.075)
0.127 (0.005)
(0.220)
(0.006)
6.35
0.152
3.06 (0.120)
0.127 (0.005)
2512
(0.250)
(0.006)
2.54
0.152
2.54 (0.100)
0.127 (0.005)
1010
(0.100)
(0.006)
* Pb containing terminations are not RoHS compliant, exemptions may apply
CASE
SIZE
www.vishay.com
54
C
VALUE
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5
(0.020)
0.5 (0.020)
0.5 (0.020)
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
VALUE
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
D/E
TOL.
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
0.127 (0.005)
For technical questions, contact:
sfer@vishay.com
Document Number: 52023
Revision: 25-Aug-09
AMD reveals K8L data to add independent core power management
[Abstract] Source: HKEPC Computer Field Author: Abstract Editor: Tang Tang Date: 2006-05-19 06:06  [HKEPC News] Yesterday at the In-Stat Microprocessor Spring Forum, AMD senior engineer Chuck Moore re...
fighting Power technology
The role of the ARM GPGCON register
What is the function of the GPGCON register on ARM? I often see this register being set when dealing with peripherals. Please give me some advice, thank you!...
bestskw ARM Technology
Which board has SDRAM+VGA function?
I'm working on a 16-bit vga and need to use sdram as a frame buffer. I originally laid out a double-sided board, but due to my lack of consideration, it worked fine during simulation, but when I ran t...
wonderglass FPGA/CPLD
Experts on designing anti-aliasing filters
[p=30, null, left][color=rgb(51, 51, 51)][font=Verdana, Arial, 微软雅黑, 宋体][size=16px] We know that using an anti-aliasing filter is beneficial in high-precision ADC applications, but designing the right...
qwqwqw2088 Analogue and Mixed Signal
In fact, the baby everyone wants to see most is...
It’s Sister Linzi’s baby....
richiefang Talking
Understanding Embedded Linux from a Demand Perspective: Bus, Device, and Driver
[align=left][b][font=微软雅黑]1. Software, object-oriented, software framework[/font][/b][/align][align=left][font=宋体]Software is created to solve real-world problems. Object-oriented software thinking is...
jingcheng ARM Technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 812  2512  1205  2745  1272  17  51  25  56  26 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号