A
B
C
D
E
F
G
REVISIONS
REV
DESCRIPTION, ECN, EAR NO.
H
DATE
APP'D
23.5
L
UPDATE DESCRIPTION
APR06/16
JS
1
1
9.9
15.8
2
2
11.50
1.05
2.6
6.7
3
U10 - A074 - X X X X
0.60 PITCH
0.85
2.15
24.25 MIN
(COMPONENT KEEP OUT)
2.15
3
0.10 A
OPTIONS
0T
= STANDARD CONSTRUCTION WITH TAPE & REEL
PACKAGING
1T =
NO RESONANCE DAMPING FEATURE WITH TAPE & REEL
PACKAGING
LATCH PIN LENGTH OPTIONS
0.66 ±0.05
TYP. (PTH)
1.00
TRACE KEEP OUT AREA
0=
1.50
4=
2.20
4
3.00
0.68 TYP.
10.95
10.95
5.70
9.10
1.78
5=
3.00
6=
4.20
CONTACT PLATING OPTION
2
= 30 MICROINCHES OF GOLD ON MATING END WITH 100
MICROINCHES MINIMUM OF MATTE TIN ON SOLDER
TERMINATION. 50-75 MICROINCHES OF NICKEL
UNDERPLATE ALL OVER
3
= 15 MICROINCHES OF GOLD ON MATING END WITH 100
MICROINCHES MINIMUM OF MATTE TIN ON SOLDER
TERMINATION. 50-75 MICROINCHES OF NICKEL
UNDERPLATE ALL OVER
NOTES:
4
1.20
5.15
1.30±0.05
0.15
B
1.30 ±0.05
(NPTH)
A
#1(A1)
16.20 MIN
(COMPONENT KEEP OUT)
2.70
#37(A37)
2.35
5
5
0.25±0.05 TYP.
0.60 PITCH
21.60
0.60
#38(B37)
#74(B1)
0.35±0.03
1.30±0.03
1) MATERIAL:
A B
HOUSING: SOLDER REFLOW PROCESS COMPATIBLE LCP, UL94V-0
CONTACTS: HIGH PERFORMANCE COPPER ALLOY
LATCH: PHOSPHOR BRONZE
RESONANCE DAMPENING FEATURE: SEMI-CONDUCTIVE POLYMER
2)RoHS COMPLIANT
0.05
L
26.00 MIN
(PLUG)
A B
0.05
L
UNLESS SPECIFIED OTHERWISE
PRIMARY UNITS
SECONDARY
DRAWN
C.MICHLIK
BA.P
NOV27/13
SEP16/14
MILLIMETERS
CHECKED
M.E. APP'D
Q.A. APP'D
DWG APP'D
Amphenol High Speed Interconnects
A Division of Amphenol Corp. www.amphenolcanada.com
6
6
REFERENCE IN PARENTHESES
GENERAL TOLERANCES
1 DECIMAL PLACE
2 DECIMAL PLACES
0.35
0.25
0.150
2
ENG. REL. NO.
REF.
THIRD
ANGLE
PROJECTION
C.MICHLIK NOV27/13
ECN TBD
DWG. NO.
DO NOT
SCALE
DRAWING
ULTRAPORT SLIMSAS™ 8X24 R/A
RECEPTACLE WITH LATCH
REV
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE OR USED FOR MANUFACTURING
PURPOSES WITHOUT WRITTEN PERMISSION FROM AMPHENOL CANADA CORP.
A
B
C
D
3 DECIMAL PLACES
ANGULAR DEGREES
P-U10-A074-XXXX
CODE ID NO.
L
SHEET
03554
DWG SIZE:
G
C
SCALE:
5:1
H
1
OF
1
E
F
Microcontroller MCU
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