1N5769 datasheet, PDF - EEWORLD Datasheet

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1N5769: Description8 ELEMENT, SILICON, SIGNAL DIODE; CategoryDiscrete semiconductor diode; File Size146KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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1N5769 Overview

8 ELEMENT, SILICON, SIGNAL DIODE

1N5769 Parametric

Parameter Name	Attribute value
package instruction	R-CDFP-F10
Reach Compliance Code	unknow
ECCN code	EAR99
Configuration	COMMON CATHODE, 8 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
JESD-30 code	R-CDFP-F10
Number of components	8
Number of terminals	10
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR
Package form	FLATPACK
Maximum power dissipation	0.5 W
Certification status	Not Qualified
Maximum reverse recovery time	0.02 µs
surface mount	YES
Terminal form	FLAT
Terminal location	DUAL
Base Number Matches	1

1N5769 Related Products

	1N5769	1N5773	1N5771	1N5775	1808J2000101KRR	1808N101J201NX080H	1N5774	CRC11A2E272JH
Description	8 ELEMENT, SILICON, SIGNAL DIODE	16 ELEMENT, SILICON, SIGNAL DIODE	8 ELEMENT, SILICON, SIGNAL DIODE	16 ELEMENT, SILICON, SIGNAL DIODE	Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, BZ, 15% TC, 0.0001uF, Surface Mount, 1808, CHIP, ROHS COMPLIANT	Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, -/+30ppm/Cel TC, 0.0001uF, 1808,	16 ELEMENT, SILICON, SIGNAL DIODE	RESISTOR, NETWORK, FILM, ISOLATED, SURFACE MOUNT, 0404, CHIP, ROHS COMPLIANT
Reach Compliance Code	unknow	unknow	unknow	unknow	compliant	compliant	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Number of terminals	10	10	10	14	2	2	14	2
package instruction	R-CDFP-F10	R-CDFP-F10	R-CDFP-F10	R-CDFP-F14	, 1808	, 1808	-	, 0404
Configuration	COMMON CATHODE, 8 ELEMENTS	COMPLEX	COMMON ANODE, 8 ELEMENTS	COMPLEX	-	-	COMPLEX	-
Diode component materials	SILICON	SILICON	SILICON	SILICON	-	-	SILICON	-
Diode type	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	-	-	RECTIFIER DIODE	-
JESD-30 code	R-CDFP-F10	R-CDFP-F10	R-CDFP-F10	R-CDFP-F14	-	-	R-CDFP-F14	-
Number of components	8	16	8	16	-	-	16	1
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	-	-	CERAMIC, METAL-SEALED COFIRED	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR PACKAGE	-	RECTANGULAR	RECTANGULAR PACKAGE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	SMT	SMT	FLATPACK	-
Maximum power dissipation	0.5 W	0.5 W	0.5 W	0.5 W	-	-	0.5 W	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	-
Maximum reverse recovery time	0.02 µs	0.02 µs	0.02 µs	0.02 µs	-	-	0.02 µs	-
surface mount	YES	YES	YES	YES	YES	-	YES	YES
Terminal form	FLAT	FLAT	FLAT	FLAT	-	-	FLAT	-
Terminal location	DUAL	DUAL	DUAL	DUAL	-	-	DUAL	-
Base Number Matches	1	1	1	1	-	-	1	-

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