MC50XS4200BEKR2 datasheet, PDF

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MC50XS4200BEKR2: DescriptionBUF OR INV BASED PRPHL DRVR; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size927KB，63 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC50XS4200BEKR2 Overview

BUF OR INV BASED PRPHL DRVR

MC50XS4200BEKR2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	4000155138
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Manufacturer	NXP
Samacsys Modified On	2022-12-27 12:55:46
Number of drives	2
Interface integrated circuit type	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code	R-PDSO-G32
JESD-609 code	e3
Humidity sensitivity level	3
Number of terminals	32
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Maximum output current	1.2 A
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP32,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3/5,8/36 V
Certification status	Not Qualified
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40

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NXP Semiconductors

Data Sheet: Advance Information

Document Number: MC50XS4200

Rev. 4.0, 5/2018

Dual

24 V,

50 mOhm high-side switch

The 50XS4200 device is part of a 24 V dual high-side switch product family with

integrated control, and a high number of protective and diagnostic functions. It

is designed for truck and bus applications. The low R

DS(on)

channels (<50 mΩ)

can control different load types; bulbs, solenoids, or DC motors. Control, device

configuration, and diagnostics are performed through a 16-bit serial peripheral

interface (SPI), allowing easy integration into existing applications. This device

is powered by SMARTMOS technology.

Both channels can be controlled individually by external/internal clock signals,

or by direct inputs. Using the internal clock allows fully autonomous device

operation. Programmable output voltage slew rates (individually programmable)

helps improve electromagnetic compatibility (EMC) performance. To avoid

shutting off the device upon inrush current, while still being able to closely track

the load current, a dynamic overcurrent threshold profile is featured. Switching

current of each channel can be sensed with a programmable sensing ratio.

Whenever communication with the external microcontroller is lost, the device

enters a Fail-safe operation mode, but remains operational, controllable, and

protected.

Features

•

Two fully-protected 50 mΩ (at 25 °C) high-side switches

Up to 1.65 A steady state current per channel

Separate bulb and DC motor latched overcurrent handling

Individually programmable internal/external PWM clock signals

Overcurrent, short-circuit, and overtemperature protection with

programmable autoretry functions

Accurate temperature and current sensing

Open load detection (channel in OFF and ON state), also for LED

applications (7.0 mA typ.)

Normal operating range: 8.0 to 36 V, extended range: 6.0 to 58 V

3.3 V and 5.0 V compatible 16-bit SPI port for device control, configuration

and diagnostics at rates up to 8.0 MHz

50XS4200

HIGH-SIDE SWITCH

EK SUFFIX (PB-FREE)

98ASA00368D

32 PIN SOIC (10 mm X 11 mm)

Applications

• Truck, bus and 24 V transportation systems

• Resistive, capacitive, and inductive loads

PWR

50XS4200

I/O

SCLK

CSB

MCU

I/O

VDD

VPWR

CLOCK

FSB

SCLK

HS0

CSB

RSTB

HS1

IN0

IN1

CONF0

CONF1

FSOB

SYNC

CSNS GND

LOAD

GND

I/O

A/D

Figure 1. Simplified application diagram

* This document contains certain information on a new product.

Specifications and information herein are subject to change without notice.

Table of Contents

Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.2 Static electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4.3 Dynamic electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.4 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.2 Pin assignment and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.3 Functional internal block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Functional device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6.1 Operation and operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6.3 Logic commands and SPI registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

8.1 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

50XS4200

NXP Semiconductors

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