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DSPIC30F2023-30I/ML

Description
Digital Signal Processors & Controllers - DSP, DSC 12KB 512bytes-RAM 30MIPS 35I/O
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,287 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Download user manual Parametric Compare View All

DSPIC30F2023-30I/ML Overview

Digital Signal Processors & Controllers - DSP, DSC 12KB 512bytes-RAM 30MIPS 35I/O

DSPIC30F2023-30I/ML Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerMicrochip
Parts packaging codeQFN
package instructionQFN-44
Contacts44
Reach Compliance Codecompliant
Factory Lead Time30 weeks
Samacsys DescriptionMicrochip DSPIC30F2023-30I/ML, 16bit dsPIC Microcontroller, 14.55MHz, 12 kB Flash, 44-Pin QFN
Address bus width
barrel shifterYES
boundary scanNO
maximum clock frequency15 MHz
External data bus width
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PQCC-N44
length8 mm
low power modeYES
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Filter levelTS 16949
Maximum seat height1 mm
Maximum supply voltage5.5 V
Minimum supply voltage3 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationQUAD
width8 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
dsPIC30F1010/202X
28/44-Pin dsPIC30F1010/202X Enhanced Flash
SMPS 16-Bit Digital Signal Controller
Note:
This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F
Family Reference
Manual”
(DS70046). For more information on the device
instruction set and programming, refer to the
“dsPIC30F/
33F Programmer’s Reference Manual”
(DS70157).
Peripheral Features:
• High-current sink/source I/O pins: 25 mA/25 mA
• Three 16-bit timers/counters; optionally pair up
16-bit timers into 32-bit timer modules
• One 16-bit Capture input functions
• Two 16-bit Compare/PWM output functions
- Dual Compare mode available
• 3-wire SPI modules (supports 4 Frame modes)
• I
2
C
TM
module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
• UART Module:
- Supports RS-232, RS-485 and LIN 1.2
- Supports IrDA
®
with on-chip hardware endec
- Auto wake-up on Start bit
- Auto-Baud Detect
- 4-level FIFO buffer
High-Performance Modified RISC CPU:
• Modified Harvard architecture
• C compiler optimized instruction set architecture
• 83 base instructions with flexible addressing
modes
• 24-bit wide instructions, 16-bit wide data path
• 12 Kbytes on-chip Flash program space
• 512 bytes on-chip data RAM
• 16 x 16-bit working register array
• Up to 30 MIPS operation:
- Dual Internal RC
- 9.7 and 14.55 MHz (±1%) Industrial Temp
- 6.4 and 9.7 MHz (±1%) Extended Temp
- 32X PLL with 480 MHz VCO
- PLL inputs ±3%
- External EC clock 6.0 to 14.55 MHz
- HS Crystal mode 6.0 to 14.55 MHz
• 32 interrupt sources
• Three external interrupt sources
• 8 user-selectable priority levels for each interrupt
• 4 processor exceptions and software traps
Power Supply PWM Module Features:
• Four PWM generators with 8 outputs
• Each PWM generator has independent time base
and duty cycle
• Duty cycle resolution of 1.1 ns at 30 MIPS
• Individual dead time for each PWM generator:
- Dead-time resolution 4.2 ns at 30 MIPS
- Dead time for rising and falling edges
• Phase-shift resolution of 4.2 ns @ 30 MIPS
• Frequency resolution of 8.4 ns @ 30 MIPS
• PWM modes supported:
- Complementary
- Push-Pull
- Multi-Phase
- Variable Phase
- Current Reset
- Current-Limit
• Independent Current-Limit and Fault Inputs
• Output Override Control
• Special Event Trigger
• PWM generated ADC Trigger
DSP Engine Features:
• Modulo and Bit-Reversed modes
• Two 40-bit wide accumulators with optional
saturation logic
• 17-bit x 17-bit single-cycle hardware fractional/
integer multiplier
• Single-cycle Multiply-Accumulate (MAC)
operation
• 40-stage Barrel Shifter
• Dual data fetch
2006-2014 Microchip Technology Inc.
DS70000178D-page 1

DSPIC30F2023-30I/ML Related Products

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Description Digital Signal Processors & Controllers - DSP, DSC 12KB 512bytes-RAM 30MIPS 35I/O Digital Signal Processors & Controllers - DSP, DSC 6KB 256bytes-RAM 30MIPS 21I/O Digital Signal Processor and Controller-DSP, DSC 12KB 512bytes-RAM 30MIPS 35I/O Digital Signal Processor and Controller - DSP, DSC 12KB 512bytes-RAM 30MIPS 21I/O Digital Signal Processor and Controller-DSP, DSC 28-pin 6KB 256bytes- RAM 30MIPS 21I/O Digital Signal Processor and Controller - DSP, DSC 12KB 512bytes-RAM 30MIPS 21I/O Digital Signal Processor and Controller - DSP, DSC 12KB 512bytes-RAM 30MIPS 21I/O
Is it lead-free? Lead free - Lead free Lead free Lead free Lead free Lead free
Maker Microchip - Microchip Microchip Microchip Microchip Microchip
Parts packaging code QFN - QFN SOIC DIP QFN QFN
package instruction QFN-44 - HVQCCN, SOP, SOP28,.4 SDIP-28 - -
Contacts 44 - 44 28 28 28 28
Reach Compliance Code compliant - compliant compliant compliant compliant compliant
Factory Lead Time 30 weeks - 13 weeks 8 weeks 29 weeks 30 weeks 30 weeks
maximum clock frequency 15 MHz - 15 MHz 15 MHz 15 MHz - -
Format FIXED POINT - FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
JESD-30 code S-PQCC-N44 - S-PQCC-N44 R-PDSO-G28 R-PDIP-T28 S-PQCC-N28 S-PQCC-N28
length 8 mm - 8 mm 17.87 mm 34.67 mm - -
Number of terminals 44 - 44 28 28 28 28
Maximum operating temperature 85 °C - 125 °C 85 °C 85 °C 125 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN - HVQCCN SOP DIP QCCN QCCN
Package shape SQUARE - SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE IN-LINE CHIP CARRIER CHIP CARRIER
Maximum seat height 1 mm - 1 mm 2.64 mm 4.06 mm - -
Maximum supply voltage 5.5 V - 5.5 V 5.5 V 5.5 V - -
Minimum supply voltage 3 V - 3 V 3 V 4.5 V - -
Nominal supply voltage 5 V - 5 V 5 V 5 V - -
surface mount YES - YES YES NO YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL
Terminal form NO LEAD - NO LEAD GULL WING THROUGH-HOLE NO LEAD NO LEAD
Terminal pitch 0.65 mm - 0.65 mm 1.27 mm 2.54 mm 0.635 mm 0.635 mm
Terminal location QUAD - QUAD DUAL DUAL QUAD QUAD
width 8 mm - 8 mm 7.49 mm 7.62 mm - -
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER - DIGITAL SIGNAL PROCESSOR, OTHER MICROCONTROLLER, RISC MICROCONTROLLER, RISC - -
Is it Rohs certified? - - - conform to conform to conform to conform to
bit size - - - 16 16 16 16
JESD-609 code - - - e3 e3 e3 e3
Encapsulate equivalent code - - - SOP28,.4 DIP28,.3 LCC28,.24SQ,25 LCC28,.24SQ,25
power supply - - - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Certification status - - - Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) - - - 256 128 256 256
Maximum slew rate - - - 273 mA 273 mA 193 mA 273 mA
Terminal surface - - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
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