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IS61NVP51236B-200B3I

Description
SRAM 18Mb No-Wait/ Pipeline Sync
Categorystorage   
File Size2MB,39 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
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IS61NVP51236B-200B3I Overview

SRAM 18Mb No-Wait/ Pipeline Sync

IS61NVP51236B-200B3I Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerISSI(Integrated Silicon Solution Inc.)
Product CategorySRAM
RoHSN
Memory Size18 Mbit
Organization512 k x 36
Access Time3 ns
Maximum Clock Frequency200 MHz
Interface TypeParallel
Supply Voltage - Max2.625 V
Supply Voltage - Min2.375 V
Supply Current - Max240 mA
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Package / CaseFBGA-165
Memory TypeSDR
TypeSynchronous
Moisture SensitiveYes
Factory Pack Quantity144
IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B
IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B
512K x36 and 1024K x18 18Mb, PIPELINE 'NO WAIT' STATE BUS
SYNCHRONOUS SRAM
JUNE 2016
FEATURES
100 percent bus utilization
No wait cycles between Read and Write
Internal self-timed write cycle
Individual Byte Write Control
Single R/W (Read/Write) control pin
Clock controlled, registered address, data and
control
Interleaved or linear burst sequence control
using MODE input
Three chip enables for simple depth
expansion and address pipelining
Power Down mode
Common data inputs and data outputs
/CKE pin to enable clock and suspend
operation
JEDEC 100-pin QFP, 165-ball BGA and 119-
ball BGA packages
Power supply:
NLP: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
NVP: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
NVVP: V
DD
1.8V (± 5%), V
DDQ
1.8V (± 5%)
JTAG Boundary Scan for BGA packages
Commercial, Industrial and Automotive (x36)
temperature support
Lead-free available
For leaded option, please contact ISSI.
DESCRIPTION
The 18Meg product family features high-speed, low-
power synchronous static RAMs designed to provide
a burstable, high-performance, 'no wait' state,
device for networking and communications
applications. They are organized as 512K words by
36 bits and 1024K words by 18 bits, fabricated with
ISSI's
advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles
are eliminated when the bus switches from read to
write, or write to read. This device integrates a 2-bit
burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic
circuit.
All synchronous inputs pass through registers are
controlled by a positive-edge-triggered single clock
input. Operations may be suspended and all
synchronous inputs ignored when Clock Enable,
/CKE is HIGH. In this state the internal device will
hold their previous values.
All Read, Write and Deselect cycles are initiated by
the ADV input. When the ADV is HIGH the internal
burst counter is incremented. New external
addresses can be loaded when ADV is LOW.
Write cycles are internally self-timed and are
initiated by the rising edge of the clock inputs and
when /WE is LOW. Separate byte enables allow
individual bytes to be written.
A burst mode pin (MODE) defines the order of the
burst sequence. When tied HIGH, the interleaved
burst sequence is selected. When tied LOW, the
linear burst sequence is selected
.
FAST ACCESS TIME
Symbol
tKQ
tKC
Parameter
Clock Access Time
Cycle time
Frequency
-250
2.6
4
250
-200
3.0
5
200
Units
ns
ns
MHz
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version
of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of
the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products
are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. D1
06/3/2016
1

IS61NVP51236B-200B3I Related Products

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Description SRAM 18Mb No-Wait/ Pipeline Sync SRAM 18Mb No-Wait/ Pipeline Sync SRAM 18Mb 250Mhz 3.3v/ 2.5V 512Kx36SyncSRAM SRAM 18Mb250Mhz 3.3V/2.5V 512K x 36 Sync SRAM SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,3.3v/2.5v - I/O,100 Pin TQFP, RoHS SRAM 18Mb No-Wait/ Pipeline Sync SRAM 18Mb No-Wait/ Pipeline Sync SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,250Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,250Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS Fixed Resistor, Metal Glaze/thick Film, 0.3W, 124000ohm, 1000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value -
Manufacturer ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) ISSI(Integrated Silicon Solution Inc.) -
Product Category SRAM SRAM SRAM SRAM SRAM SRAM SRAM SRAM SRAM -
RoHS N Details Details Details - Details Details - - -
Memory Size 18 Mbit 18 Mbit 18 Mbit 18 Mbit - 18 Mbit 18 Mbit - - -
Organization 512 k x 36 512 k x 36 1 M x 18 1 M x 18 - 512 k x 36 512 k x 36 - - -
Access Time 3 ns 3 ns 2.6 ns 2.6 ns - 3 ns 3 ns - - -
Maximum Clock Frequency 200 MHz 200 MHz 250 MHz 250 MHz - 200 MHz 200 MHz - - -
Supply Voltage - Max 2.625 V 2.625 V 3.3 V 3.3 V - 2.625 V 2.625 V - - -
Supply Voltage - Min 2.375 V 2.375 V 2.5 V 2.5 V - 2.375 V 2.375 V - - -
Minimum Operating Temperature - 40 C - 40 C 0 C 0 C - - 40 C - 40 C - - -
Maximum Operating Temperature + 85 C + 85 C + 70 C + 70 C - + 85 C + 85 C - - -
Mounting Style SMD/SMT SMD/SMT SMD/SMT SMD/SMT - SMD/SMT SMD/SMT - - -
Package / Case FBGA-165 TQFP-100 FBGA-165 FBGA-165 TQFP-100 TQFP-100 FBGA-165 FBGA-165 FBGA-165 -
Memory Type SDR SDR Synchronous Synchronous - SDR SDR - - -
Type Synchronous Synchronous Pipelined SRAM Pipelined SRAM - Synchronous Synchronous - - -
Moisture Sensitive Yes Yes Yes Yes Yes Yes Yes Yes Yes -
Factory Pack Quantity 144 800 144 2000 72 72 144 144 2000 -

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