19-4659; Rev 4; 6/09
EVALUATION KIT AVAILABLE
www.maxim-ic.com
Network Microcontrollers with
Ethernet and CAN
FEATURES
High-Performance Architecture
Single 8051 Instruction Cycle in 54ns
DC to 75MHz Clock Rate
Flat 16MB Address Space
Four Data Pointers with Auto-Increment/
Decrement and Select-Accelerate Data Movement
16/32-Bit Math Accelerator
DS80C410/DS80C411
GENERAL DESCRIPTION
The DS80C410/DS80C411 network microcontrollers offer
the highest integration available in an 8051 device.
Peripherals include a 10/100 Ethernet MAC, three serial
ports, an optional CAN 2.0B controller, 1-Wire® Master,
and 64 I/O pins. The DS80C410 and DS80C411 also
include 64kBytes internal SRAM for user application
storage and network stack.
To enable access to the network, a full application-
accessible TCP IPv4/6 network stack and OS are provided
in the ROM. The network stack supports up to 32
simultaneous TCP connections and can transfer up to
5Mbps through the Ethernet MAC. Its maximum system-
clock frequency of 75MHz results in a minimum instruction
cycle time of 54ns. Access to large program or data
memory areas is simplified with a 24-bit addressing
scheme that supports up to 16MB of contiguous memory.
To accelerate data transfers between the microcontroller
and memory, the DS80C410 and DS80C411 provide four
data pointers, each of which can be configured to
automatically increment or decrement upon execution of
certain data pointer-related instructions. High-speed shift,
normalization, accumulate functions and 32-bit/16-bit
multiply and divide operations are optimized by the
DS80C410/DS80C411 hardware math accelerator.
The High-Speed Microcontroller User’s Guide and the High-Speed
Microcontroller User’s Guide: Network Microcontroller Supplement
should be used in conjunction with this data sheet.
Download
both at:
www.maxim-ic.com/user_guides.
Multitiered Networking and I/O
10/100 Ethernet Media Access Controller (MAC)
Optional CAN 2.0B Controller
1-Wire Net Controller
Three Full-Duplex Hardware Serial Ports
Up to Eight Bidirectional 8-Bit Ports (64 Digital I/O Pins)
Robust ROM Firmware
Supports Network Boot Over Ethernet Using DHCP and
TFTP
Full, Application-Accessible TCP/IP Network Stack
Supports IPv4 and IPv6
Implements UDP, TCP, DHCP, ICMP, and IGMP
Preemptive, Priority-Based Task Scheduler
MAC Address can Optionally be Acquired from IEEE-
Registered DS2502-E48
Flexible IEEE 802.3 MII (10/100Mbps) and ENDEC
(10Mbps) Interfaces Allow Selection of PHY
Low-Power Operation
Ultra-Low-Power Sleep Mode with Magic Packet®
and Wake-Up Frame Detection
8kB On-Chip Tx/Rx Packet Data Memory with Buffer
Control Unit Reduces Load on CPU
Half- or Full-Duplex Operation with Flow Control
Multicast/Broadcast Address Filtering with VLAN
Support
10/100 Ethernet Mac
APPLICATIONS
Industrial Control/Automation
Environmental Monitoring
Network Sensors
Vending
Home/Office Automation
Transaction/Payment
Terminals
Data Converters (Serial-to-
Ethernet, CAN-to-
Ethernet)
Remote Data-Collection
Equipment
Features continued on page 34.
Pin Configuration appears at end of data sheet.
Selector Guide appears at end of data sheet
.
ORDERING INFORMATION
PART
DS80C410-FNY
DS80C410-FNY+
DS80C411-FNY
DS80C411-FNY+
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
100 LQFP
100 LQFP
100 LQFP
100 LQFP
1-Wire is a registered trademark of Maxim Integrated Products, Inc.
Magic Packet is a registered trademark of Advanced Micro
Devices, Inc.
+Denotes a lead(Pb)-free/RoHS-compliant device.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here:
www.maxim-ic.com/errata.
1 of 102
DS80C410/DS80C411 Network Microcontrollers with Ethernet and CAN
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Input Pin Relative to Ground………………………………………………………..-0.5V to +5.5V
Voltage Range on Any Output Pin Relative to Ground……………………………………………..-0.5V to (V
CC3
+ 0.5V)
Voltage Range on V
CC3
Relative to Ground…………………………………………………………………..-0.5V to +3.6V
Voltage Range on V
CC1
Relative to Ground…………………………………………………………………..-0.3V to +2.0V
Operating Temperature Range………………………………………………………………………………..-40°C to +85°C
Junction Temperature……………………………………………………………………………………………..+150°C max
Storage Temperature Range………………………………………………………………………………...-55°C to +160°C
Soldering Temperature………………………………………………………………See IPC/JEDEC J-STD-020 Standard
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating conditions for extended periods can affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC3
= 3.0V to 3.6V, V
CC1
= 1.8V ±10%, T
A
= -40°C to +85°C.) (Note 1)
PARAMETER
Supply Voltage (V
CC3
) (Note 2)
Power-Fail Warning (V
CC3
) (Note 3)
Power-Fail Reset Voltage (V
CC3
) (Note 3)
Active Mode Current (V
CC3
) (Note 4)
Idle Mode Current (V
CC3
) (Note 4)
Stop Mode Current (V
CC3
) (Not 4)
SYMBOL
V
CC3
V
PFW3
V
RST3
I
CC3
I
IDLE3
I
STOP3
I
SPBG3
V
CC1
V
PFW1
V
RST1
I
CC1
I
IDLE1
I
STOP1
I
SPBG1
V
IL1
V
IL2
V
IH1
V
IH2
I
OL1
I
OL2
I
OL3
I
OH1
I
OH2
I
OH3
I
IL
I
TL
I
TH0
I
TL0
I
L
R
RST
-50
-650
20
-200
-10
50
MIN
3.0
2.85
2.76
TYP
3.3
3.00
2.90
16
7
1
100
1.8
1.60
1.55
30
20
3
3
MAX
3.6
3.15
3.05
35
15
10
150
1.98
1.68
1.63
60
50
20
20
0.8
1.0
UNITS
V
V
V
mA
mA
µA
µA
V
V
V
mA
mA
mA
mA
V
V
V
V
mA
mA
mA
-50
-4
-8
-10
200
-20
10
200
µA
mA
mA
µA
µA
µA
µA
µA
kΩ
VCC3
Stop Mode Current, Bandgap Enabled (V
CC3
) (Note 4)
Supply Voltage (V
CC1
) (Note 2)
Power-Fail Warning (V
CC1
) (Note 5)
Power-Fail Reset Voltage (V
CC1
) (Note 5)
Active Mode Current (V
CC1
) (Note 4)
Idle Mode Current (V
CC1
) (Note 4)
Stop Mode Current (V
CC1
) (Note 4)
Stop Mode Current, Bandgap Enabled (V
CC1
) (Note 4)
Input Low Level
Input Low Level for XTAL1, RST, OW
Input High Level
Input High Level for XTAL1, RST, OW
Output Low Current for Port 1, 3–7 at V
OL
= 0.4V
Output Low Current for Port 0, 2, TX_EN, TXD[3:0], MDC, MDIO,
RSTOL,
ALE,
PSEN,
and Ports 3–7 (when used as any of the following:
A21–A0,
WR, RD, CE0-7, PCE0-3)
at V
OL
= 0.4V (Note 6)
Output Low Current for OW,
OWSTP
at V
OL
= 0.4V
Output High Current for Port 1, 3–7 at V
OH
= V
CC3
- 0.4V (Note 7)
Output High Current for Port 1, 3–7 at V
OH
= V
CC3
- 0.4V (Note 8)
Output High Current for Port 0, 2, TX_EN, TXD[3:0], MDC, MDIO,
RSTOL,
ALE,
PSEN,
and Ports 3–7 (when used as any of the following:
A21–A0,
WR, RD, CE0-7, PCE0-3)
at V
OH
= V
CC3
- 0.4V (Notes 6, 9)
Input Low Current for Port 1–7 at 0.4V (Note 10)
Logic 1-to-0 Transition Current for Port 1, 3–7 (Note 11)
Input Leakage Current, Port 0 Bus Mode, V
IL
= 0.8V (Note 12)
Input Leakage Current, Port 0 Bus Mode, V
IH
= 2.0V (Note 12)
Input Leakage Current, Input Mode (Note 13)
RST Pulldown Resistance
VCC1
1.62
1.52
1.47
2.0
2.4
6
12
10
10
20
16
-75
-8
-16
-20
-400
50
-50
0
100
2 of 102
DS80C410/DS80C411 Network Microcontrollers with Ethernet and CAN
Note 1:
Note 2:
Specifications to -40°C are guaranteed by design and not production tested.
The user should note that this part is tested and guaranteed to operate down to V
CC3
= 3.0V and V
CC1
= 1.62V, while the reset
thresholds for those supplies, V
RST3
and V
RST1
respectively, may be above or below those points. When the reset threshold for a
given supply is greater than the guaranteed minimum operating voltage, that reset threshold should be considered the minimum
operating point since execution ceases once the part enters the reset state. When the reset threshold for a given supply is lower
than the guaranteed minimum operating voltage, there exists a range of voltages for either supply, (V
RST3
< V
CC3
< 1.62V) or (V
RST1
< V
CC1
< 3.0V), where the processor’s operation is not guaranteed, and the reset trip point has not been reached. This should not
be an issue in most applications, but should be considered when proper operation must be maintained at all times. For these
applications, it may be desirable to use a more accurate external reset.
While the specifications for V
PFW3
and V
RST3
overlap, the design of the hardware makes it such that this is not possible. Within the
ranges given, there is a guaranteed separation between these two voltages.
Current measured with 75MHz clock source on XTAL1, V
CC3
= 3.6V, V
CC1
= 2.0V,
EA
and RST = 0V, Port0 = V
CC3
, all other pins
disconnected.
While the specifications for V
PFW1
and V
RST1
overlap, the design of the hardware makes it such that this is not possible. Within the
ranges given, there will be a guaranteed separation between these two voltages.
Certain pins exhibit stronger drive capability when being used to address external memory. These pins and associated memory
interface function (in parentheses) are as follows: Port 3.6-3.7 (WR,
RD),
Port 4 (CE0-3, A16-A19), Port 5.4-5.7 (PCE0-3), Port 6.0-
6.5 (CE4-7, A20, A21), Port 7 (demultiplexed mode A0-A7).
This measurement reflects the weak I/O pullup state that persists following the momentary strong 0 to 1 port pin drive (V
OH2
). This
I/O pin state can be achieved by applying RST = V
CC3.
The measurement reflects the momentary strong port pin drive during a 0-to-1 transition in I/O mode. During this period, a one shot
circuit drives the ports hard for two clock cycles. A weak pullup device (V
OH1
) remains in effect following the strong two-clock cycle
drive. If a port 4 or 6 pin is functioning in memory mode with pin state of 0 and the SFR bit contains a 1, changing the pin to an I/O
mode (by writing to P4CNT, for example) does not enable the two-cycle strong pullup.
Port 3 pins 3.6 (WR) and 3.7(RD) have a stronger than normal pullup drive for only one system clock period following the transition
of either
WR
or
RD
from a 0 to a 1.
This is the current required from an external circuit to hold a logic low level on an I/O pin while the corresponding port latch bit is set
to 1. This is only the current required to
hold
the low level; transitions from 1 to 0 on an I/O pin also have to overcome the transition
current.
Following the 0 to 1 one-shot timeout, ports in I/O mode source transition current when being pulled down externally. It reaches a
maximum at approximately 2V.
During external addressing mode, weak latches are used to maintain the previously driven state on the pin until such time that the
Port 0 pin is driven by an external memory source.
The OW pin (when configured to output a 1) at V
IN
= 5.5V,
EA, MUX,
and all MII inputs (TXCLk, RXCLk, RX_DV, RX_ER, RXD[3:0],
CRS, COL, MDIO) at V
IN
= 3.6V.
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Note 10:
Note 11:
Note 12:
Note 13:
3 of 102
DS80C410/DS80C411 Network Microcontrollers with Ethernet and CAN
AC ELECTRICAL CHARACTERISTICS (MULTIPLEXED ADDRESS/DATA BUS)
(V
CC3
= 3.0V to 3.6V, V
CC1
= 1.8V ±10%, T
A
= -40°C to +85°C.)
(Note
1)
PARAMETER
External Crystal Frequency
Clock Mutliplier 2X Mode
Clock Multiplier 4X Mode
External Clock Oscillator Frequency
Clock Mutliplier 2X Mode
Clock Multiplier 4X Mode
ALE Pulse Width
Port 0 Instruction Address Valid to ALE Low
Address Hold After ALE Low
ALE Low to Valid Instruction In
ALE Low to
PSEN
Low
PSEN
Pulse Width
PSEN
Low to Valid Instruction In
Input Instruction Hold After
PSEN
Input Instruction Float After
PSEN
Port 0 Address to Valid Instruction In
Port 2, 4, 6 Address or Port 4 CE to Valid
Instruction In
PSEN
Low to Address Float
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
SYMBOL
1 / t
CLK
75MHz
MIN
MAX
VARIABLE CLOCK
MIN
MAX
4
40
16
11
DC
37.5
18.75
75
37.5
18.75
UNITS
MHz
1 / t
CLK
t
LHLL
t
AVLL
t
LLAX
t
LLIV
t
LLPL
t
PLPH
t
PLIV
t
PXIX
t
PXIZ
t
AVIV0
t
AVIV2
t
PLAZ
0
8.3
21.0
24.7
0
3.7
21.7
8.7
15.0
1.7
4.7
14.3
16
11
t
CLCL
+ t
CHCL
- 5
t
CHCL
- 5
t
CLCH
- 2
MHz
ns
ns
ns
2t
CLCL
+ t
CLCH
- 19
t
CLCH
- 3
2t
CLCL
- 5
2t
CLCL
-18
0
t
CLCL
- 5
3t
CLCL
- 19
3t
CLCL
+ t
CLCH
- 22
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
AC electrical characteristics assume 50% duty cycle for the oscillator, oscillator frequency
≤ 75MHz, and are not 100% production
tested, but are guaranteed by design.
All parameters apply to both commercial and industrial temperature operation, unless otherwise noted.
t
CLCL
, t
CLCH
, t
CHCL
are time periods associated with the internal system clock and are related to the external clock (t
CLK
) as defined in
the
External Clock Oscillator (XTAL1) Characteristics
table.
The precalculated 75MHz MIN/MAX timing specifications assume an exact 50% duty cycle.
All signals guaranteed with load capacitance of 80pF except Port 0, Port 2,
ALE, PSEN, RD,
and
WR
with 100pF. The following
signals, when configured for memory interface, are also characterized with 100pF loading: Port 4 (CE0-3, A16–A19), Port 5.4–5.7 (
PCE0-3),
Port 6.0–6.5 (CE4-7, A20, A21), Port 7 (demultiplexed mode A0–A7).
For high-frequency operation, special attention should be paid to the float times of the interfaced memory devices so as to avoid
bus contention.
References to the XTAL, XTAL1 or CLK signal in timing diagrams is to assist in determining the relative occurrence of events, not
for determing absolute signal timing with respect to the external clock.
Note 6:
Note 7:
4 of 102
DS80C410/DS80C411 Network Microcontrollers with Ethernet and CAN
EXTERNAL CLOCK OSCILLATOR (XTAL1) CHARACTERISTICS
PARAMETER
Clock Oscillator Period
Clock Symmetry at 0.5 x V
CC3
Clock Rise Time
Clock Fall Time
SYMBOL
t
CLK
t
CH
t
CR
t
CF
MIN
MAX
See
External Clock
Oscillator Frequency
0.45 t
CLK
0.55 t
CLK
3
3
UNITS
ns
ns
ns
EXTERNAL CLOCK DRIVE
t
CF
t
CR
XTAL1
t
CH
t
CLK
t
CL
SYSTEM CLOCK TIME PERIODS (t
CLCL
, t
CHCL
, t
CLCH
)
SYSTEM CLOCK SELECTION
4X/2X
1
0
X
X
CD1
0
0
1
1
CD0
0
0
0
1
SYSTEM CLOCK
PERIOD t
CLCL
t
CLK
/ 4
t
CLK
/ 2
t
CLK
256 t
CLK
SYSTEM CLOCK HIGH (t
CHCL
) AND
SYSTEM CLOCK LOW (t
CLCH
)
MIN
MAX
0.45 (t
CLK
/ 4)
0.55 (t
CLK
/ 4)
0.45 (t
CLK
/ 2)
0.55 (t
CLK
/ 2)
0.45 t
CLK
0.55 t
CLK
0.45 (256 t
CLK)
0.55 (256 t
CLK)
Note 1:
Figure 21
shows a detailed description and illustration of the system clock selection.
Note 2:
When an external clock oscillator is used in conjunction with the default system clock selection (CD1:CD0 = 10b), the
minimum/maximum system clock high (t
CHCL
) and system clock low (t
CLCH
) periods are directly related to clock oscillator duty cycle.
MOVX CHARACTERISTICS (MULTIPLEXED ADDRESS/DATA BUS) (Note 1)
(V
CC3
= 3.0V to 3.6V, V
CC1
= 1.8V ±10%, T
A
= -40
°C
to +85°C.)
PARAMETER
MOVX ALE Pulse Width
Port 0 MOVX Address Valid
to ALE Low
Port 0 MOVX Address Hold
after ALE Low
RD
Pulse Width (P3.7 or
PSEN)
WR
Pulse Width (P3.6)
RD
(P3.7 or
PSEN)
Low to
Valid Data In
Data Hold After
RD
(P3.7 or
PSEN)
High
SYMBOL
t
LHLL2
MIN
t
CLCL
+ t
CHCL
- 5
2t
CLCL
- 5
6t
CLCL
- 5
t
CHCL
- 5
t
CLCL
- 6
5t
CLCL
- 6
t
CLCH
- 2
t
CLCL
- 2
5t
CLCL
- 2
2t
CLCL
- 5
(4 x C
ST
) t
CLCL
- 3
2t
CLCL
- 5
(4 x C
ST
) t
CLCL
- 3
MAX
UNITS
ns
STRETCH VALUES
C
ST
(MD2:0)
C
ST
= 0
1≤ C
ST
≤
3
4
≤
C
ST
≤
7
C
ST
= 0
1≤ C
ST
≤
3
4
≤
C
ST
≤
7
C
ST
= 0
1≤ C
ST
≤3
4
≤
C
ST
≤
7
C
ST
= 0
1
≤
C
ST
≤
7
C
ST
= 0
1
≤
C
ST
≤
7
C
ST
= 0
1
≤
C
ST
≤
7
t
AVLL2
t
LLAX2
and t
LLAX3
t
RLRH
t
WLWH
t
RLDV
t
RHDX
ns
ns
ns
ns
2t
CLCL
- 18
(4 x C
ST
) t
CLCL
- 18
ns
ns
-2
5 of 102
京公网安备 11010802033920号
EEWORLD
