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SMAJ5937B-TP

Description
Zener Diodes 1.5W 33V
CategoryDiscrete semiconductor    diode   
File Size445KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

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SMAJ5937B-TP Overview

Zener Diodes 1.5W 33V

SMAJ5937B-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AC
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance33 Ω
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation1.5 W
Certification statusNot Qualified
Nominal reference voltage33 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current11.4 mA
Micro Commercial Components
MCC
TM
Features
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
SMAJ5913B
THRU
SMAJ5956B
1.5 Watt
Zener Diode
3.3 to
200
Volts

Maximum Ratings
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Low Zener Impedance
Low Regulation Factor
V
Z
– tolerance:
f5%
For Surface Mount Applications
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Halogen
free available upon request by adding suffix "-HF"
Junction Temperature: 150
Storage Temperature: -65 to +175
1.5 Watt DC Power Dissipation
(T
L
75
)
Thermal Resistance Junction to
Lead: 50
/W
Thermal Resistance Junction to Ambient: 83 /W
Forward Voltage @ 200mA: 1.5 Volts

DO-214AC
(SMA)( LEAD

FRAME)
H


J
A
C
E
F
G
DIMENSIONS
D
B
DIM
A
B
C
D
E
F
G
H
J
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090 ”
0.085 ”
Note:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
0.070"
Revision:
F
www.mccsemi.com
1 of 5
2014/01/24

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