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SST25VF080B-50-4C-QAF-T

Description
NOR Flash 2.7V to 3.6V 4Mbit SPI Serial Flash
Categorystorage    storage   
File Size895KB,33 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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SST25VF080B-50-4C-QAF-T Overview

NOR Flash 2.7V to 3.6V 4Mbit SPI Serial Flash

SST25VF080B-50-4C-QAF-T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionHVSON, SOLCC8,.25
Reach Compliance Codecompliant
Maximum clock frequency (fCLK)50 MHz
Data retention time - minimum100
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-N8
JESD-609 codee4
length6 mm
memory density8388608 bit
Memory IC TypeFLASH
memory width1
Number of functions1
Number of terminals8
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX1
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height0.8 mm
Serial bus typeSPI
Maximum standby current0.00002 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width5 mm
write protectHARDWARE/SOFTWARE
Base Number Matches1
SST25VF080B
8 Mbit SPI Serial Flash
Features
• Single Voltage Read and Write Operations
- 2.7-3.6V
• Serial Interface Architecture
- SPI Compatible: Mode 0 and Mode 3
• High Speed Clock Frequency
- 50/66 MHz conditional (see
Table 5-6)
• Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
• Low Power Consumption:
- Active Read Current: 10 mA (typical)
- Standby Current: 5 µA (typical)
• Flexible Erase Capability
- Uniform 4 KByte sectors
- Uniform 32 KByte overlay blocks
- Uniform 64 KByte overlay blocks
• Fast Erase and Byte-Program:
- Chip-Erase Time: 35 ms (typical)
- Sector-/Block-Erase Time: 18 ms (typical)
- Byte-Program Time: 7 µs (typical)
• Auto Address Increment (AAI) Programming
- Decrease total chip programming time over
Byte-Program operations
• End-of-Write Detection
- Software polling the BUSY bit in Status Register
- Busy Status readout on SO pin in AAI Mode
• Hold Pin (HOLD#)
- Suspends a serial sequence to the memory
without deselecting the device
• Write Protection (WP#)
- Enables/Disables the Lock-Down function of the
status register
• Software Write Protection
- Write protection through Block-Protection bits in
status register
• Temperature Range
- Commercial: 0°C to +70°C
- Industrial: -40°C to +85°C
• Packages Available
- 8-lead SOIC (200 mils)
- 8-contact WSON (6mm x 5mm)
- 8-lead PDIP (300 mils)
• All devices are RoHS compliant
Product Description
25 series Serial Flash family features a four-wire, SPI-
compatible interface that allows for a low pin-count
package which occupies less board space and ulti-
mately lowers total system costs. The SST25VF080B
devices are enhanced with improved operating fre-
quency and lower power consumption. SST25VF080B
SPI serial flash memories are manufactured with pro-
prietary, high-performance CMOS SuperFlash technol-
ogy. The split-gate cell design and thick-oxide tunneling
injector attain better reliability and manufacturability
compared with alternate approaches.
The SST25VF080B devices significantly improve per-
formance and reliability, while lowering power con-
sumption. The devices write (Program or Erase) with a
single power supply of 2.7-3.6V for SST25VF080B.
The total energy consumed is a function of the applied
voltage, current, and time of application. Since for any
given voltage range, the SuperFlash technology uses
less current to program and has a shorter erase time,
the total energy consumed during any Erase or Pro-
gram operation is less than alternative flash memory
technologies.
The SST25VF080B device is offered in 8-lead SOIC
(200 mils), 8-contact WSON (6mm x 5mm), and 8-lead
PDIP (300 mils) packages. See
Figure 2-1
for pin
assignments.
2015 Microchip Technology Inc.
DS20005045C-page 1

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Description NOR Flash 2.7V to 3.6V 4Mbit SPI Serial Flash Flash Memory 2.7V to 3.6V 8Mbit SPI Serial Flash NOR Flash 2.7V to 3.6V 8Mbit SPI Serial Flash NOR Flash 2.7V to 3.6V 8Mbit SPI Serial Flash NOR Flash 8M (1Mx8) 50MHz 2.7-3.6V Commercial NOR Flash 2.7V to 3.6V 4Mbit SPI Serial Flash
Is it Rohs certified? conform to conform to conform to conform to conform to -
package instruction HVSON, SOLCC8,.25 SOIC-8 WSON-8 SOIC-8 SOP, SOP8,.3 -
Reach Compliance Code compliant compliant compliant compliant compliant -
Maximum clock frequency (fCLK) 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz -
JESD-30 code R-PDSO-N8 S-PDSO-G8 R-PDSO-N8 S-PDSO-G8 S-PDSO-G8 -
JESD-609 code e4 e3 e3 e3 e4 -
length 6 mm 5.275 mm 6 mm 5.275 mm 5.275 mm -
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit -
Memory IC Type FLASH FLASH FLASH FLASH FLASH -
memory width 1 1 1 1 1 -
Number of functions 1 1 1 1 1 -
Number of terminals 8 8 8 8 8 -
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words -
character code 8000000 8000000 8000000 8000000 8000000 -
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 70 °C -
organize 8MX1 8MX1 8MX1 8MX1 8MX1 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code HVSON SOP HVSON SOP SOP -
Package shape RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE -
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE -
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL -
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 NOT SPECIFIED 260 260 -
Maximum seat height 0.8 mm 2.16 mm 0.8 mm 2.16 mm 2.16 mm -
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V -
surface mount YES YES YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL -
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Nickel/Palladium/Gold (Ni/Pd/Au) -
Terminal form NO LEAD GULL WING NO LEAD GULL WING GULL WING -
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
Terminal location DUAL DUAL DUAL DUAL DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED 40 NOT SPECIFIED 40 40 -
width 5 mm 5.275 mm 5 mm 5.275 mm 5.275 mm -
Factory Lead Time - 9 weeks 7 weeks 9 weeks 24 weeks -

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