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DSPB56725AF

Description
Audio DSPs Multi-Core Audio Processor 80-Pin
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size923KB,48 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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DSPB56725AF Overview

Audio DSPs Multi-Core Audio Processor 80-Pin

DSPB56725AF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFP
package instruction14 X 14 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, LQFP-80
Contacts80
Reach Compliance Codeunknown
ECCN code3A991.A.2
Samacsys DescriptionMulti-Core Audio Processors
Other featuresALSO REQUIRES 3.3V I/O SUPPLY
Address bus width
barrel shifterNO
boundary scanYES
maximum clock frequency200 MHz
External data bus width
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PQFP-G80
JESD-609 codee3
length14 mm
low power modeNO
Humidity sensitivity level3
Number of terminals80
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width14 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches1
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: DSP56724EC
Rev. 2, 3/2009
DSP56724/DSP56725
Symphony
DSP56724/
DSP56725 Multi-Core Audio
Processors
The Symphony DSP56724/DSP56725 Multi-Core Audio
Processors are part of the DSP5672x family of programmable
CMOS DSPs, designed using dual DSP56300 24-bit cores.
The DSP56724 is intended for consumer and professional
audio applications that require high performance for audio
processing. In addition, the DSP56724 is ideally suited for
applications that need the capability to expand memory
off-chip or to interface to external parallel peripherals.
Potential applications include A/V receivers, DVD Receivers,
Home Theater in a Box (HTIB), and professional audio
equipment including portable recording equipment, musical
instruments, guitar amplifiers and pedals. The DSP56724
offers customers flexibility in their designs by providing a
more cost-effective alternative to the DSP56720 while
maintaining pin compatibility.
The DSP56725 is intended for automotive and audio
applications that require high performance for audio
processing. Potential applications include A/V receivers,
DVD Receivers, Home Theater in a Box (HTIB), and
automotive amplifiers and entertainment systems. The
DSP56725 offers customers flexibility in their designs by
providing a more cost-effective alternative to the DSP56721
while maintaining pin compatibility.
The DSP56724/DSP56725 devices provide a wealth of
on-chip audio processing functions, via a plug and play
software architecture system that supports audio decoding
algorithms, various equalization algorithms, compression,
signal generator, tone control, fade/balance, level
meter/spectrum analyzer, among others. The
DSP56724/DSP56725 devices also support various matrix
decoders and sound field processing algorithms.
With two DSP56300 cores, a single DSP56724/ DSP56725
device can replace dual-DSP designs, saving costs while
DSP56724
144-Pin LQFP
20 mm
×
20 mm
0.5 mm pitch
DSP56725
80-Pin LQFP
14 mm
×
14 mm
0.65 mm pitch
See
Table 19.
meeting high MIPs requirements. Legacy peripherals from
the previous DSP5636x/37x families are included, as are a
variety of new modules available in the DSP5672x family.
Modules from the DSP56720 are included, such as an
Asynchronous Sample Rate Converter (ASRC), an Inter-Core
Communication (ICC) module, an External Memory
Controller (EMC) to support SDRAM (DSP56724 only), and
a Sony/Philips Digital Interface (S/PDIF) transceiver.
The DSP56724/DSP56725 devices offer up to 250 million
instructions per second (MIPs) per core using an internal
250 MHz clock. The DSP56724/ DSP56725 products are high
density CMOS devices with 3.3 V inputs and outputs.
The DSP56724 block diagram is shown in
Figure 1;
the
DSP56725 block diagram is shown in
Figure 2.
NOTE
This document contains information on a new product.
Specifications and information herein are subject to change
without notice. Finalized specifications may be published
after further characterization and device qualifications are
completed.
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2009. All rights reserved.

DSPB56725AF Related Products

DSPB56725AF DSPB56725CAF
Description Audio DSPs Multi-Core Audio Processor 80-Pin Audio DSPs PB FREE DSPB56724 AP
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker NXP NXP
Parts packaging code QFP QFP
package instruction 14 X 14 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, LQFP-80 14 X 14 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, LQFP-80
Contacts 80 80
Reach Compliance Code unknown unknown
ECCN code 3A991.A.2 3A991.A.2
Other features ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
barrel shifter NO NO
boundary scan YES YES
maximum clock frequency 200 MHz 200 MHz
Format FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE
JESD-30 code S-PQFP-G80 S-PQFP-G80
JESD-609 code e3 e3
length 14 mm 14 mm
low power mode NO NO
Humidity sensitivity level 3 3
Number of terminals 80 80
Maximum operating temperature 70 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP
Package shape SQUARE SQUARE
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm
Maximum supply voltage 1.26 V 1.05 V
Minimum supply voltage 1.14 V 0.95 V
Nominal supply voltage 1.2 V 1 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature 40 40
width 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
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