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89HPES6T6G2ZCALGI

Description
PCI Interface IC PCI EXPRESS SWITCH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size291KB,30 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES6T6G2ZCALGI Overview

PCI Interface IC PCI EXPRESS SWITCH

89HPES6T6G2ZCALGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionFCBGA-324
Contacts324
Manufacturer packaging codeALG324
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionFLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM
Address bus width
Bus compatibilityPCI
maximum clock frequency100 MHz
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
6-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES6T6G2
Data Sheet
Device Overview
The 89HPES6T6G2, a 6-lane 6-port Gen2 PCI Express® switch, is a
member of IDT’s PRECISE™ family of PCI Express switching solutions.
The PES6T6G2 is a peripheral chip that performs PCI Express Base
switching with a feature set optimized for servers, storage, communica-
tions, and consumer applications. It provides connectivity and switching
functions between a PCI Express upstream port and five downstream
ports or peer-to-peer switching between downstream ports.
Features
High Performance PCI Express Switch
– Six Gen2 PCI Express lanes supporting 5 Gbps and
2.5 Gbps operation
• One x1 upstream port
• Five x1 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2Kbytes
– Supports one virtual channel and eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates six 5 Gbps / 2.5 Gbps embedded SerDes, 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
– Hot-swap capable I/O
– External Serial EEPROM contents are checksum protected
Block Diagram
6-Port Switch Core / 6 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
©
2011 Integrated Device Technology, Inc.
March 30, 2011
DSC 6930

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Description PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA
package instruction FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-324
Contacts 324 324 324 324 324
Manufacturer packaging code ALG324 ALG324 ALG324 AL324 AL324
Reach Compliance Code compliant compliant compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI PCI PCI; SMBUS PCI PCI; SMBUS
maximum clock frequency 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e1 e1 e1 e0 e0
length 19 mm 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 4 4 4 4 4
Number of terminals 324 324 324 324 324
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 225 225
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 NOT SPECIFIED 30 NOT SPECIFIED
width 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1
Samacsys Description FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM - -
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