BCM43340XKUBGT datasheet, PDF - EEWORLD Datasheet

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BCM43340XKUBGT: DescriptionRF System on a Chip - SoC Dual band + BT FM (iPA); CategoryTopical application Wireless rf/communication; File Size1MB，96 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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BCM43340XKUBGT Overview

RF System on a Chip - SoC Dual band + BT FM (iPA)

BCM43340XKUBGT Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Cypress Semiconductor
Product Category	RF System on a Chip - SoC
RoHS	Details
Packaging	Cut Tape
Packaging	Reel
Factory Pack Quantity	5000

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PRELIMINARY

CYW43340

Single-Chip, Dual-Band (2.4 GHz/5 GHz) IEEE 802.11 a/b/g/n

MAC/Baseband/Radio with Integrated Bluetooth 4.0

General Description

The Cypress CYW43340 single–chip quad–radio device provides the highest level of integration for wearables, Internet of Things and

gateway applications, with integrated dual band (2.4 GHz / 5 GHz) IEEE 802.11 a/b/g and single–stream IEEE 802.11n MAC/

baseband/radio, and Bluetooth 4.0. The CYW43340 includes integrated power amplifiers and LNAs for the 2.4 GHz and 5 GHz WLAN

bands, and an integrated 2.4 GHz T/R switch. This greatly reduces the external part count, PCB footprint, and cost of the solution.

Using advanced design techniques and process technology to reduce active and idle power, the CYW43340 is designed to address

the needs of mobile devices that require minimal power consumption and compact size. It includes a power management unit which

simplifies the system power topology and allows for operation directly from a mobile platform battery while maximizing battery life.

The CYW43340 implements the highly sophisticated Enhanced Collaborative Coexistence algorithms and hardware mechanisms,

allowing for an extremely collaborative Bluetooth coexistence scheme along with coexistence support for external radios (such as

cellular and LTE, GPS, WiMAX, and Ultra–Wideband) and a single shared 2.4 GHz antenna for Bluetooth and WLAN. As a result,

enhanced overall quality for simultaneous voice, video, and data transmission in an IoT or wearable application is achieved.

For the WLAN section, two host interface options are included: an SDIO v2.0 interface and a High-Speed Inter-Chip (HSIC) interface

(a USB 2.0 derivative for short-distance on-board connections). An independent, high-speed UART is provided for the Bluetooth host

interface.

Cypress Part Numbering Scheme

Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,

there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides

Cypress ordering part number that matches an existing IoT part number.

Table 1. Mapping Table for Part Number between Broadcom and Cypress

Broadcom Part Number

BCM43340

BCM43340XKUBG

BCM43340HKUBG

CYW43340

CYW43340XKUBG

CYW43340HKUBG

Cypress Part Number

Acronyms and Abbreviations

In most cases, acronyms and abbreviations are defined on first use.

For a comprehensive list of acronyms and other terms used in Cypress documents, go to

http://www.cypress.com/glossary.

Feautures

IEEE 802.11x Key Features

■

Dual–band 2.4 GHz and 5 GHz IEEE 802.11

a/b/g/n

Single–stream IEEE 802.11n support for 20 MHz and 40 MHz

channels provides PHY layer rates up to 150 Mbps for typical

upper–layer throughput in excess of 90 Mbps.

Supports the IEEE 802.11n STBC (space–time block coding)

RX and LDPC (low–density parity check) TX options for

improved range and power efficiency.

Supports a single 2.4 GHz antenna shared between WLAN and

Bluetooth.

Shared Bluetooth and 2.4 GHz WLAN receive signal path elimi-

nates the need for an external power splitter while maintaining

excellent sensitivity for both Bluetooth and WLAN.

Internal fractional nPLL allows support for a wide range of

reference clock frequencies

■

Supports IEEE 802.15.2 external coexistence interface to

optimize bandwidth utilization with other co–located wireless

technologies such as GPS, WiMAX, or UWB

Supports standard SDIO v2.0 host interfaces.

Alternative host interface supports HSIC v1.0 (short–distance

USB device)

Integrated ARM® Cortex–M3™ processor and on–chip

memory for complete WLAN subsystem functionality,

minimizing the need to wake up the applications processor for

standard WLAN functions. This allows for further minimization

of power consumption, while maintaining the ability to field

upgrade with future features. On–chip memory includes 512

KB SRAM and 640 KB ROM.

OneDriver™ software architecture for easy migration from

existing embedded WLAN and Bluetooth devices as well as

future devices.

■

Cypress Semiconductor Corporation

Document Number: 002-14943 Rev. *L

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised Tuesday, March 28, 2017

BCM43340XKUBGT Related Products

	BCM43340XKUBGT	BCM43340HKUBGT
Description	RF System on a Chip - SoC Dual band + BT FM (iPA)	RF System on a Chip - SoC Dual band + BT FM (iPA)
Product Attribute	Attribute Value	Attribute Value
Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Product Category	RF System on a Chip - SoC	RF System on a Chip - SoC
RoHS	Details	Details
Factory Pack Quantity	5000	5000
Packaging	Reel	Reel

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