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DL4743A-TP

Description
Zener Diodes 1W 19V
CategoryDiscrete semiconductor    diode   
File Size245KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
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DL4743A-TP Overview

Zener Diodes 1W 19V

DL4743A-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance10 Ω
JESD-30 codeO-LELF-R2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation1 W
Certification statusNot Qualified
Nominal reference voltage13 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current19 mA
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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DL4728
THRU
DL4761
Features
High Reliability
Very Sharp Reverse Characteristic
Low Reverse Current Level
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
Moisture Sensitivity Level 1
1 Watt
Zener Diode
3.3
to
75
Volts
GLASS MELF
Cathode Mark
Maximum Ratings
Operating Temperature: -65 to +175
Storage Temperature: -65 to +175
1 Watt DC Power Dissipation
Maximum Thermal Resistance: 100K/W Junction To Ambient
Test Conditions: I = 9.5mm(3/8”),T
L
= constant
Maximum Forward Voltage @ 200mA: 1.2 Volts
Figure 1 - Typical Temperature Coefficient
C
B
40
A
mV/
20
INCHES
MIN
.190
---
.095
MM
MIN
4.80
---
2.40
0
0
20
V
Z
40
) –
versus
– Zener Voltage (V
Z
)
DIM
A
B
C
MAX
.205
.022
.105
MAX
5.20
.55
2.67
NOTE
Nominal
Typical Temperature Coefficient (mV/
Figure 2 - Derating Curve
SUGGESTED SOLDER
PAD LAYOUT
.210”
1.0
W
0.5
.115”
.035”
200
100
150
Temperature
Power Dissipation (W) -
Versus
- Temperature
25
Notes: 1.
Lead in Glass Exemption Applied, see EU Directive Annex Notes 5.
Revision:
B
www.mccsemi.com
1 of 3
2011/09/06

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