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74AUP1G34GX,125

Description
Buffers & Line Drivers 74AUP1G34GX/X2SON5/REEL 7" Q3/
Categorylogic    logic   
File Size243KB,21 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AUP1G34GX,125 Overview

Buffers & Line Drivers 74AUP1G34GX/X2SON5/REEL 7" Q3/

74AUP1G34GX,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSON
package instructionSON, LCC5(UNSPEC)
Contacts5
Manufacturer packaging codeSOT1226
Reach Compliance Codecompliant
seriesAUP/ULP/V
JESD-30 codeS-PDSO-N5
JESD-609 codee3
length0.8 mm
Load capacitance (CL)30 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.0017 A
Humidity sensitivity level1
Number of functions1
Number of entries1
Number of terminals5
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSON
Encapsulate equivalent codeLCC5(UNSPEC)
Package shapeSQUARE
Package formSMALL OUTLINE
method of packingTAPE AND REEL
power supply1.2/3.3 V
Prop。Delay @ Nom-Sup20.8 ns
propagation delay (tpd)20.8 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.35 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.1 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formNO LEAD
Terminal pitch0.48 mm
Terminal locationDUAL
width0.8 mm
74AUP1G34
Low-power buffer
Rev. 7 — 28 March 2017
Product data sheet
1
General description
The 74AUP1G34 provides a low-power, low-voltage single buffer.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing the damaging backflow current through the
device when it is powered down.
2
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial power-down mode operation
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

74AUP1G34GX,125 Related Products

74AUP1G34GX,125 74AUP1G34GM,132 74AUP1G34GW,125 74AUP1G34GN,132
Description Buffers & Line Drivers 74AUP1G34GX/X2SON5/REEL 7" Q3/ Buffers & Line Drivers 1.8V SNGL LO-PWR BUF Buffers & Line Drivers 1.8V SINGLE BUFFER Buffers & Line Drivers 4.6 V XSON6
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to
Maker NXP NXP NXP NXP
Parts packaging code SON SON TSSOP SON
package instruction SON, LCC5(UNSPEC) 1 MM X 1.45 MM, 0.5 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 TSSOP, TSSOP5/6,.08 SON, SOLCC6,.04,12
Contacts 5 6 5 6
Manufacturer packaging code SOT1226 SOT886 SOT353-1 SOT1115
Reach Compliance Code compliant compliant compliant compliant
series AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code S-PDSO-N5 R-PDSO-N6 R-PDSO-G5 R-PDSO-N6
JESD-609 code e3 e3 e3 e3
length 0.8 mm 1.45 mm 2.05 mm 1 mm
Load capacitance (CL) 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) 0.0017 A 0.0017 A 0.0017 A 0.0017 A
Humidity sensitivity level 1 1 1 1
Number of functions 1 1 1 1
Number of entries 1 1 1 1
Number of terminals 5 6 5 6
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SON VSON TSSOP SON
Encapsulate equivalent code LCC5(UNSPEC) SOLCC6,.04,20 TSSOP5/6,.08 SOLCC6,.04,12
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
power supply 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Sup 20.8 ns 20.8 ns 20.8 ns 20.8 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
Maximum seat height 0.35 mm 0.5 mm 1.1 mm 0.35 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.1 V 1.1 V 1.1 V 1.1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form NO LEAD NO LEAD GULL WING NO LEAD
Terminal pitch 0.48 mm 0.5 mm 0.65 mm 0.3 mm
Terminal location DUAL DUAL DUAL DUAL
width 0.8 mm 1 mm 1.25 mm 0.9 mm
propagation delay (tpd) 20.8 ns - 20.8 ns 20.8 ns

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