SERIES OVERVIEW
*SOP (SMALL OUTLINE PACKAGES, GULLWING LEADS)
SERIES IC51 (CLAMSHELL - TH) - 0.40 TO 1.27MM PITCH
SOP, TSOP TYPE I & II
SPECIFICATIONS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PSF)
–55°C to +170°C (for type PES & PEI)
10,000 insertions min.
PART NUMBER
IC51 - 028 2 - 334-1 - MF
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
MF = Flanged
Unmarked = Not Flanged
MATERIALS AND FINISH
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
SERIES IC189 (OPEN TOP - TH) - 0.40 TO 1.27MM PITCH
SOP, TSOP TYPE I & II
SPECIFICATIONS
Insulation Resistance:
Dielectric Withstanding Voltage:
1,000MΩ min. at 100V DC, pitch 0.4, 0.5
1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27
100V AC for 1 minute, pitch 0.4, 0.5
500V AC for 1 minute, pitch 0.65
700V AC for 1 minute, pitch 0.8, 1.27
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions
20g to 80g per pin
PART NUMBER
IC189 - 016 2 - 019 - * *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protectin Key
** Protection Key: Prevents IC from releasing during transportation
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
MATERIALS AND FINISH
Housing:
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
Contacts:
Plating:
SERIES IC235 (OPEN TOP - TH) - 1.27MM PITCH
SOP, TSOP TYPE II
SPECIFICATIONS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions min.
20g to 80g per pin
PART NUMBER
IC235 - 020 2 - 201 - *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
MATERIALS AND FINISH
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
22
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CONTACTING - SEMICONDUCTOR
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