Silicon Press-Fit-Diodes
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SEMIKRON |
| package instruction | O-MUPF-D1 |
| Contacts | 1 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| application | GENERAL PURPOSE |
| Shell connection | CATHODE |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| JESD-30 code | O-MUPF-D1 |
| JESD-609 code | e2 |
| Maximum non-repetitive peak forward current | 360 A |
| Number of components | 1 |
| Phase | 1 |
| Number of terminals | 1 |
| Maximum output current | 35 A |
| Package body material | METAL |
| Package shape | ROUND |
| Package form | PRESS FIT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum repetitive peak reverse voltage | 50 V |
| surface mount | NO |
| Terminal surface | Tin/Silver (Sn/Ag) |
| Terminal form | SOLDER LUG |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| KYZ35A05 | KYZ35A2 | KYZ35A1 | KYZ35A3 | KYZ35A6 | KYZ35A4 | |
|---|---|---|---|---|---|---|
| Description | Silicon Press-Fit-Diodes | Silicon Press-Fit-Diodes | Silicon Press-Fit-Diodes | Silicon Press-Fit-Diodes | Silicon Press-Fit-Diodes | Silicon Press-Fit-Diodes |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON | SEMIKRON |
| package instruction | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 |
| Contacts | 1 | 1 | 1 | 1 | 1 | 1 |
| Reach Compliance Code | unknow | unknown | unknow | unknown | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| application | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
| Shell connection | CATHODE | CATHODE | CATHODE | CATHODE | CATHODE | CATHODE |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| JESD-30 code | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 | O-MUPF-D1 |
| JESD-609 code | e2 | e2 | e2 | e2 | e2 | e2 |
| Maximum non-repetitive peak forward current | 360 A | 360 A | 360 A | 360 A | 360 A | 360 A |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 |
| Phase | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum output current | 35 A | 35 A | 35 A | 35 A | 35 A | 35 A |
| Package body material | METAL | METAL | METAL | METAL | METAL | METAL |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | PRESS FIT | PRESS FIT | PRESS FIT | PRESS FIT | PRESS FIT | PRESS FIT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum repetitive peak reverse voltage | 50 V | 200 V | 100 V | 300 V | 600 V | 400 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| Terminal surface | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) |
| Terminal form | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG |
| Terminal location | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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