Trench IGBT Modules
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | SEMIKRON |
| package instruction | FLANGE MOUNT, R-XUFM-X9 |
| Contacts | 11 |
| Manufacturer packaging code | CASE SEMIX 2 |
| Reach Compliance Code | compli |
| Shell connection | ISOLATED |
| Maximum collector current (IC) | 490 A |
| Collector-emitter maximum voltage | 600 V |
| Configuration | SINGLE WITH BUILT-IN DIODE AND THERMISTOR |
| JESD-30 code | R-XUFM-X9 |
| JESD-609 code | e3/e4 |
| Number of components | 1 |
| Number of terminals | 9 |
| Maximum operating temperature | 175 °C |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal surface | TIN/SILVER |
| Terminal form | UNSPECIFIED |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | POWER CONTROL |
| Transistor component materials | SILICON |
| SEMIX402GAL066HD | SEMIX402GAR066HD | |
|---|---|---|
| Description | Trench IGBT Modules | Trench IGBT Modules |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | SEMIKRON | SEMIKRON |
| package instruction | FLANGE MOUNT, R-XUFM-X9 | FLANGE MOUNT, R-XUFM-X9 |
| Contacts | 11 | 11 |
| Manufacturer packaging code | CASE SEMIX 2 | CASE SEMIX 2 |
| Reach Compliance Code | compli | compli |
| Shell connection | ISOLATED | ISOLATED |
| Maximum collector current (IC) | 490 A | 490 A |
| Collector-emitter maximum voltage | 600 V | 600 V |
| Configuration | SINGLE WITH BUILT-IN DIODE AND THERMISTOR | SINGLE WITH BUILT-IN DIODE AND THERMISTOR |
| JESD-30 code | R-XUFM-X9 | R-XUFM-X9 |
| JESD-609 code | e3/e4 | e3/e4 |
| Number of components | 1 | 1 |
| Number of terminals | 9 | 9 |
| Maximum operating temperature | 175 °C | 175 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLANGE MOUNT | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL | N-CHANNEL |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | NO |
| Terminal surface | TIN/SILVER | TIN/SILVER |
| Terminal form | UNSPECIFIED | UNSPECIFIED |
| Terminal location | UPPER | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | POWER CONTROL | POWER CONTROL |
| Transistor component materials | SILICON | SILICON |
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