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BGA 734L16 E6327

Description
RF Amplifier RF SILICON MMIC
CategoryTopical application    Wireless rf/communication   
File Size95KB,2 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Environmental Compliance
Download Datasheet Parametric View All

BGA 734L16 E6327 Overview

RF Amplifier RF SILICON MMIC

BGA 734L16 E6327 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerInfineon
Product CategoryRF Amplifier
RoHSDetails
Mounting StyleSMD/SMT
TypeGeneral Purpose Amplifier
Operating Frequency800 MHz to 2.1 GHz
Gain14.5 dB
NF - Noise Figure1.3 dB
Test Frequency800 MHz
Operating Supply Current3.5 mA
Minimum Operating Temperature- 30 C
Maximum Operating Temperature+ 85 C
PackagingCut Tape
PackagingMouseReel
PackagingReel
Number of Channels3 Channel
Input Return Loss27 dB
Isolation dB36 dB
Factory Pack Quantity7500
Supply Voltage - Max3 V
Supply Voltage - Min2.7 V
Product Brief
BGA734L16
Highly Integrated Tri-Band Low Noise Amplifier
for UMTS and HSxPA Systems
T h e B G A 7 3 4 L 1 6 is a highly integrated Low Noise Amplifier for 3G low,
mid, and high bands. Designed using a proprietary Silicon Germanium Carbon
process, the BGA734L16 delivers outstanding RF performance while optimizing cost,
battery life, and size.
High Level of Integration
In order to reduce front-end design complexity and minimize cost, the BGA734L16
monolithically integrates three amplifiers for cellular bands 800 Mhz, 1900 Mhz,
and 2100 Mhz on one die. Additional functions, including temperature stabilizing
block, 1kV hBM eSD protection, and output matching network are also integrated on
chip.
Battery Life Optimized
The BGA734L16 offers gain control capability for improving the dynamic range and
system performance in presence of high levels of interferers. Controlling the gain of
the LNA has also the advantage of extending battery life.
Small Form Factor
The BGA734L16 comes in a low profile, Tiny and Small Leadless Package code-
named TSLP-16. The package measures 2.3 x 2.3 x 0.39 mm
3
making this device
ideal for low profile multi-media phones and highly integrated front end modules.
Applications
handset
Data-Card
Module
Features
Internally matched output to 50
W
SiGe:C process
Shut down mode
Temperature stabilization
Two gain modes
Low external part count
Benefits
high level of integration
high linearity
Ultra-low noise figure
Small form factor
Low cost
TSLP-16 Package
2.3 x 2.3 x 0.39 mm
3
www.infineon.com/smallsignaldiscretes
Small Signal Discretes

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