MK10FX512VLQ12 datasheet, PDF - EEWORLD Datasheet

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MK10FX512VLQ12: DescriptionFLASH, 120MHz, RISC MICROCONTROLLER, PQFP144; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，80 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MK10FX512VLQ12 Overview

FLASH, 120MHz, RISC MICROCONTROLLER, PQFP144

MK10FX512VLQ12 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	4000167949
package instruction	LQFP-144
Reach Compliance Code	compliant
Country Of Origin	Mainland China, Malaysia
ECCN code	3A991.A.2
Factory Lead Time	52 weeks
Samacsys Manufacturer	NXP
Samacsys Modified On	2022-12-27 12:55:46
YTEOL	5
Has ADC	YES
Other features	ALSO OPERATES AT 1 V MINIMUM SUPPLY
Address bus width
bit size	32
CPU series	CORTEX-M4
maximum clock frequency	32 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G144
JESD-609 code	e3
length	20 mm
Humidity sensitivity level	3
Number of I/O lines	100
Number of terminals	144
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP144,.87SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
RAM (bytes)	131072
rom(word)	524288
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	120 MHz
Maximum slew rate	177 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.71 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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NXP Semiconductors

Data Sheet: Technical Data

Document Number K10P144M120SF3

Rev. 7, 02/2018

Supports the following:

MK10FX512VLQ12,

MK10FN1M0VLQ12,

MK10FX512VMD12,

MK10FN1M0VMD12

Key features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 120 MHz Arm® Cortex®-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 1024 KB program flash memory on non-

FlexMemory devices

– Up to 512 KB program flash memory on

FlexMemory devices

– Up to 512 KB FlexNVM on FlexMemory devices

– 16 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

– NAND flash controller interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 32-channel DMA controller, supporting up to 128

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Four 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Four analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Two 8-channel motor control/general purpose/PWM

timers

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– Two Controller Area Network (CAN) modules

– Three SPI modules

– Two I2C modules

– Six UART modules

– Secure Digital Host Controller (SDHC)

– Two I2S modules

K10 Sub-Family

K10P144M120SF3

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts.......................................................................................3

1.1 Determining valid orderable parts............................................... 3

2 Part identification................................................................................. 3

2.1 Description...................................................................................3

2.2 Format.......................................................................................... 3

2.3 Fields............................................................................................3

2.4 Example....................................................................................... 4

3 Terminology and guidelines.................................................................4

3.1 Definitions................................................................................... 4

3.2 Examples......................................................................................4

3.3 Typical-value conditions..............................................................5

3.4 Relationship between ratings and operating requirements.......... 5

3.5 Guidelines for ratings and operating requirements......................6

4 Ratings..................................................................................................6

4.1 Thermal handling ratings............................................................. 6

4.2 Moisture handling ratings............................................................ 7

4.3 ESD handling ratings................................................................... 7

4.4 Voltage and current operating ratings..........................................7

5 General................................................................................................. 7

5.1 AC electrical characteristics........................................................ 8

5.2 Nonswitching electrical specifications........................................ 8

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements.................. 8

LVD and POR operating requirements.......................... 9

Voltage and current operating behaviors....................... 10

Power mode transition operating behaviors...................12

Power consumption operating behaviors....................... 13

EMC radiated emissions operating behaviors................16

Designing with radiated emissions in mind................... 17

Capacitance attributes.................................................... 17

6.1.1

6.1.2

Debug trace timing specifications..................................21

JTAG electricals.............................................................22

6.2 System modules........................................................................... 25

6.3 Clock modules............................................................................. 25

6.3.1

6.3.2

6.3.3

MCG specifications........................................................25

Oscillator electrical specifications................................. 27

32 kHz oscillator electrical characteristics.....................29

6.4 Memories and memory interfaces................................................30

6.4.1

6.4.2

6.4.3

6.4.4

Flash (FTFE) electrical specifications........................... 30

EzPort switching specifications..................................... 34

NAND flash controller specifications............................35

Flexbus switching specifications....................................38

6.5 Security and integrity modules.................................................... 41

6.6 Analog..........................................................................................41

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications.........................................41

CMP and 6-bit DAC electrical specifications................49

12-bit DAC electrical characteristics............................. 51

Voltage reference electrical specifications.....................54

6.7 Timers.......................................................................................... 55

6.8 Communication interfaces........................................................... 55

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

6.8.7

CAN switching specifications........................................55

DSPI switching specifications (limited voltage range)..56

DSPI switching specifications (full voltage range)........57

Inter-Integrated Circuit Interface (I2C) timing.............. 59

UART switching specifications..................................... 60

SDHC specifications...................................................... 60

I2S/SAI switching specifications................................... 61

6.9 Human-machine interfaces (HMI)...............................................68

6.9.1

TSI electrical specifications........................................... 68

5.3 Switching specifications.............................................................. 17

5.3.1

5.3.2

Device clock specifications............................................17

General switching specifications....................................18

7 Dimensions...........................................................................................69

7.1 Obtaining package dimensions.................................................... 69

8 Pinout................................................................................................... 69

8.1 Pins with active pull control after reset....................................... 69

8.2 K10 Signal Multiplexing and Pin Assignments...........................70

8.3 K10 pinouts..................................................................................76

9 Revision History...................................................................................78

5.4 Thermal specifications................................................................. 19

5.4.1

5.4.2

Thermal operating requirements.................................... 19

Thermal attributes.......................................................... 20

6 Peripheral operating requirements and behaviors................................ 21

6.1 Core modules............................................................................... 21

K10 Sub-Family, Rev. 7, 02/2018

NXP Semiconductors

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