|
DG384ABK |
DG387AAA |
DG387ABA |
DG381ACK |
CPF-26342FT-1E36 |
DG384ACWE |
DG384ACJ |
| Description |
Analog Switch ICs General Purpose CMOS Analog Switch |
Analog Switch ICs General Purpose CMOS Analog Switch |
Analog Switch ICs General Purpose CMOS Analog Switch |
Analog Switch ICs |
Fixed Resistor, Metal Film, 2W, 63400ohm, 350V, 1% +/-Tol, -100,100ppm/Cel, |
Analog Switch ICs |
Analog Switch ICs Dual SPST General Purpose CMOS Analog Switch |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
conform to |
incompatible |
incompatible |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
compliant |
not_compliant |
not_compliant |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
- |
Contains lead |
Contains lead |
| Maker |
Maxim |
Maxim |
- |
Maxim |
- |
Maxim |
Maxim |
| Parts packaging code |
DIP |
- |
BCY |
DIP |
- |
SOIC |
DIP |
| package instruction |
DIP, DIP16,.3 |
- |
METAL CAN-10 |
0.300 INCH, CERDIP-14 |
- |
SO-16 |
DIP, DIP16,.3 |
| Contacts |
16 |
- |
10 |
14 |
- |
16 |
16 |
| Analog Integrated Circuits - Other Types |
DPST |
SPDT |
SPDT |
- |
- |
DPST |
DPST |
| JESD-30 code |
R-GDIP-T16 |
- |
O-MBCY-W10 |
- |
- |
R-PDSO-G16 |
R-PDIP-T16 |
| JESD-609 code |
e0 |
e0 |
- |
- |
e3 |
e0 |
e0 |
| Humidity sensitivity level |
1 |
- |
1 |
- |
- |
1 |
1 |
| Maximum negative supply voltage (Vsup) |
-18 V |
- |
-18 V |
- |
- |
-18 V |
-18 V |
| Negative supply voltage minimum (Vsup) |
-5 V |
- |
-5 V |
- |
- |
-5 V |
-5 V |
| Nominal Negative Supply Voltage (Vsup) |
-15 V |
- |
-15 V |
- |
- |
-15 V |
-15 V |
| Number of channels |
2 |
- |
1 |
- |
- |
2 |
2 |
| Number of functions |
2 |
- |
1 |
- |
- |
2 |
2 |
| Number of terminals |
16 |
- |
10 |
- |
2 |
16 |
16 |
| Nominal off-state isolation |
62 dB |
- |
62 dB |
- |
- |
62 dB |
62 dB |
| Maximum on-state resistance (Ron) |
50 Ω |
- |
50 Ω |
- |
- |
50 Ω |
50 Ω |
| Maximum operating temperature |
85 °C |
- |
85 °C |
- |
230 °C |
70 °C |
70 °C |
| Package body material |
CERAMIC, GLASS-SEALED |
- |
METAL |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Encapsulate equivalent code |
DIP16,.3 |
- |
CAN10,.23 |
- |
- |
SOP16,.4 |
DIP16,.3 |
| Package shape |
RECTANGULAR |
- |
ROUND |
- |
- |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
- |
CYLINDRICAL |
- |
Axial |
SMALL OUTLINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
240 |
NOT SPECIFIED |
240 |
- |
- |
240 |
240 |
| power supply |
+-15 V |
- |
+-15 V |
- |
- |
+-15 V |
+-15 V |
| Certification status |
Not Qualified |
- |
Not Qualified |
- |
- |
Not Qualified |
Not Qualified |
| Maximum supply voltage (Vsup) |
18 V |
- |
18 V |
- |
- |
18 V |
18 V |
| Minimum supply voltage (Vsup) |
5 V |
- |
5 V |
- |
- |
5 V |
5 V |
| Nominal supply voltage (Vsup) |
15 V |
- |
15 V |
- |
- |
15 V |
15 V |
| surface mount |
NO |
- |
NO |
- |
- |
YES |
NO |
| Maximum disconnect time |
250 ns |
- |
250 ns |
- |
- |
250 ns |
250 ns |
| Maximum connection time |
300 ns |
- |
300 ns |
- |
- |
300 ns |
300 ns |
| switch |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
- |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
| technology |
CMOS |
- |
CMOS |
- |
METAL FILM |
CMOS |
CMOS |
| Temperature level |
OTHER |
- |
OTHER |
- |
- |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
- |
Matte Tin (Sn) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
| Terminal form |
THROUGH-HOLE |
- |
WIRE |
- |
- |
GULL WING |
THROUGH-HOLE |
| Terminal location |
DUAL |
- |
BOTTOM |
- |
- |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
20 |
NOT SPECIFIED |
20 |
- |
- |
20 |
20 |