DATA SHEET
Silicon Beamless Schottky Diodes: Pairs and Quads
Applications
Microwave MIC assembly and automated high volume
manufacturing lines
Mixers
Die Attach Methods
Features
Mechanically rugged design
Three barrier heights for optimized mixer performance
Wide product range: series pair, ring, bridge, and eight-diode
rings
Use in ring or crossover designs in double balanced mixers
Virtually any LO requirement can be met with choice of barrier
height
100% DC tested on water
Available on film frame or waffle pack
All leadless chips are compatible with both eutectic and
conductive epoxy die attach methods. Eutectic processes use
Sn/Au or Sn/Pb solder. Nonconductive die attach is
recommended.
Packing Methods
1.
Gel
pak
2. Wafer on film frame (rejects are marked with ink):
– Diced, ready for pick and place
– Unsawn, whole wafer, 7-mil thick, maximum
Wire Bonding
Skyworks
Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to
Skyworks
Definition of Green™,
document number
SQ04-0074.
Two methods can be used to connect wire, ribbon, or wire mesh
to the chips:
Thermocompression
Ballbonding
Skyworks recommends use of pure gold wire.
Description
Skyworks beamless diode family is designed for a high degree of
device reliability in both commercial and industrial uses. The
diodes are designed to offer the utmost in performance as well as
achieving price sensitive cost targets for commercial systems.
Electrical and Physical Specifications
Absolute maximum ratings for the beamless Schottky diodes are
provided in Table 1. Electrical specifications are noted in Table 2.
SPICE model parameters are defined in Table 3.
A typical bonding configuration is illustrated in Figure 1.
Assembly and Handling Procedure
The process flow for assembly is:
Die attach using nonconductive epoxy
Wire bond
Encapsulation (nonconductive epoxy)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 15, 2014
1
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Table 1. Absolute Maximum Ratings (Note 1)
Parameter
Peak inverse voltage
Supply current
Power dissipation (CW)
Storage temperature
Operating temperature
Electrostatic discharge:
Human Body Model (HBM), Class 0
PIV
I
MAX
P
DISS
T
STG
T
OP
ESD
< 250
V
–65
–65
Symbol
Minimum
Maximum
V
B
50
75
+175
+150
Units
–
mA/V
mW/junction
C
C
Note 1:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION:
Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. Electrical Specifications (Per Junction) (1 of 2) (Note 1)
V
F
I
F
= 1.0 mA
(mV)
Min
Ring Quad (Note 3)
DMF3926-000
DME3927-000
DMJ3928-000
DMF3942-000
DME3943-000
DMJ3944-000
Bridge Quad (Note 3)
DMF3929-000
DME3930-000
DMJ3931-000
DMF4102-000
DME4101-000
DMJ4103-000
Series Pair (Note 3)
DMF3932-000
DME3933-000
DMJ3934-000
S
S
S
Low
Medium
High
200
300
500
260
400
600
10
10
10
0.30
0.30
0.30
0.50
0.50
0.50
5
5
5
2
3
4
551-012
551-012
551-012
S
S
S
X
X
X
Low
Medium
High
Low
Medium
High
200
300
500
250
325
550
260
400
600
310
425
650
10
10
10
10
10
10
0.30
0.30
0.30
0.15
0.15
0.15
0.50
0.50
0.50
0.3
0.3
0.3
5
5
5
14
14
14
2
3
4
2
3
4
551-004
551-004
551-004
551-004
551-004
551-004
S
S
S
X
X
X
Low
Medium
High
Low
Medium
High
200
300
500
250
325
550
260
400
600
310
425
650
10
10
10
10
10
10
0.30
0.30
0.30
0.15
0.15
0.15
0.50
0.50
0.50
0.30
0.30
0.30
5
5
5
8
8
8
–
–
–
–
–
–
551-002
551-002
551-002
551-002
551-002
551-002
Max
ΔV
F
I
F
= 1.0 mA
(mV)
Max
C
J
(Note 2)
V
R
= 0 V,
f = 1 MHz
(pF)
Min
Max
R
S
I
F
= 5 mA
(Ω)
Max
V
B
@ 10
μA
(V)
Min
Outline
Drawing
Number
Part Number
Band
Barrier
Back-to-Back Ring Series Pair (Note 3)
DMF3935-000
DME3936-000
DMJ3937-000
S
S
S
Low
Medium
High
200
300
500
260
400
600
10
10
10
0.30
0.30
0.30
0.50
0.50
0.50
5
5
5
–
–
–
551-056
551-056
551-056
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Table 2. Electrical Specifications (Per Junction) (2 of 2) (Note 1)
V
F
I
F
= 1.0 mA
(mV)
Min
Octoquad Ring (Note 4)
DMF3938-000
DME3939-000
DMJ3940-000
S-X
S-X
S-X
Low
Medium
High
400
600
1000
520
800
1200
15
15
15
0.15
0.15
0.15
0.30
0.30
0.30
16
16
16
–
–
–
556-020
556-020
556-020
Max
ΔV
F
I
F
= 1.0 mA
(mV)
Max
C
J
(Note 2)
V
R
= 0 V,
f = 1 MHz
(pF)
Min
Max
R
S
I
F
= 5 mA
(Ω)
Max
V
S
@ 10
μA
(V)
Min
Outline
Drawing
Number
Part Number
Band
Barrier
Back-to-Back Crossover Quad, to 6 GHz
DMF3945-000
DME3946-000
DMJ3947-000
S
S
S
Low
Medium
High
200
300
525
260
400
625
15
15
15
0.30
0.30
0.30
0.50
0.50
0.50
5
5
5
–
–
–
588-065
588-065
588-065
Note 1.
Performance is guaranteed only under the conditions listed in this table.
Note 2:
Cj represents total capacitance. Maximum Cj unbalance @ 0 V, 1 MHz = 0.25 pF.
Note 3:
Matching criteria Vf @ 1 mA ≤ 15 mV available for matched sets.
Note 4:
Matching criteria Vf @ 1 mA ≤ 20 mV available for matched sets.
Table 3. SPICE Model Parameters (Per Junction)
Part
Number
Prefix
DMF3926
DME3927
DMJ3926
DMF4102
DME4101
DMJ4103
I
S
(A)
2.5 x 10
–7
1.3 x 10
–9
9.0 x 10
–13
1.1 x 10
–7
2.4 x 10
–9
8.5 x 10
–13
R
S
(Ω)
4
4
4
6
6
6
N
1.04
1.04
1.04
1.04
1.04
1.04
T
T
(s)
1 x 10
–11
1 x 10
–11
1 x 10
–11
1 x 10
–11
1 x 10
–11
1 x 10
–11
C
JO
(pF)
0.42
0.39
0.39
0.22
0.20
0.20
M
0.32
0.34
0.42
0.32
0.37
0.42
E
G
(eV)
0.69
0.69
0.69
0.69
0.69
0.69
V
J
(V)
0.51
0.65
0.84
0.495
0.595
0.800
XTI
2
2
2
2
2
2
F
C
0.5
0.5
0.5
0.5
0.5
0.5
B
V
(V)
2
3
3
2
3
4
I
BV
(A)
1 x 10
–5
1 x 10
–5
1 x 10
–5
1 x 10
–5
1 x 10
–5
1 x 10
–5
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014
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DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
1
3
Ring Quad
2
4
Bond Pad
1
3
Crossover
Quad
Bond Pad
2
4
S3542
Figure 1. Typical Bonding Configuration
Package Information
Skyworks silicon beamless Schottky diodes are provided in
Gel
paks and on film frame. Package dimensions are provided in
Figures 2 through 7.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Schematic
2
1
3
Schematic
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
2
4
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
1
2
2
1
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
3 Plcs.
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
4
1
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3543
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3544
Figure 2. 551-002 Package Dimensions
Figure 3. 551-012 Package Dimensions
Schematic
2
1
Schematic
1
2 4
3
3
0.020 in (0.500 mm)
± 0.001 in (0.025 mm)
2
4
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
1
4
017-1
0.020 in (0.500 mm)
± 0.001 in (0.025 mm)
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
1
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
3
0.004 x 0.004 in
(0.10 x 0.10 mm)
4 Plcs.
4
0.020 in (0.500 mm)
2
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3546
0.006 in (0.180 mm)
± 0.001 in (0.025 mm)
S3545
Figure 4. 551-056 Package Dimensions
Figure 5. 556-020 Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014
5
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