BZX84C2V4 - BZX84C51
350mW SURFACE MOUNT ZENER DIODE
Features
•
•
•
•
•
•
•
Planar Die Construction
350mW Power Dissipation
Zener Voltages from 2.4V - 51V
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
e3
Polarity: See Diagram
Weight: 0.008 grams (approximate)
SOT23
Top View
Device Schematic
Ordering Information
(Note 5)
Part Number
(Type Number)-7-F
(Type Number)Q-7-F
(Type Number)-13-F
(Type Number)Q-13-F
Notes:
Compliance
Standard
Automotive
Standard
Automotive
Case
SOT23
SOT23
SOT23
SOT23
Packaging
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
*For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F.
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4-
BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire
Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound.
BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Kxx
Date Code Key
Year
1998
Code
J
Month
Code
Jan
1
…
…
2002
N
Feb
2
2003
P
Mar
3
2004
R
2005
S
Apr
4
2006 2007
T
U
May
5
2008
V
Jun
6
2009
W
Jul
7
2010
X
YM
2011
Y
Aug
8
Kxx
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking for Shanghai
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM
= Date Code Marking for Chengdu
Assembly / Test site
Y
= Year (ex: Z = 2012)
M = Month (ex: 9 = September)
YM
2012
Z
Sep
9
2013
A
2014
B
Oct
O
2015
C
Nov
N
2016
D
2017
E
Dec
D
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
1 of 5
www.diodes.com
February 2014
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Forward Voltage
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient Air (Note 6)
Thermal Resistance, Junction to Ambient Air (Note 7)
Operating and Storage Temperature Range
Symbol
P
D
P
D
R
θJA
R
θJA
T
J,
T
STG
Value
300
350
417
357
-65 to +150
Unit
mW
mW
°C/W
°C/W
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Type
Number
Marking
Code
Nom (V)
BZX84C2V4
BZX84C2V7
BZX84C3V0
BZX84C3V3
BZX84C3V6
BZX84C3V9
BZX84C4V3
BZX84C4V7
BZX84C5V1
BZX84C5V6
BZX84C6V2
BZX84C6V8
BZX84C7V5
BZX84C8V2
BZX84C9V1
BZX84C10
BZX84C11
BZX84C12
BZX84C13
BZX84C15
BZX84C16
BZX84C18
BZX84C20
BZX84C22
BZX84C24
BZX84C27
BZX84C30
BZX84C33
BZX84C36
BZX84C39
BZX84C43
BZX84C47
BZX84C51
Notes:
Zener Voltage
Range
(Note 8)
V
Z
@ I
ZT
Min (V)
2.2
2.5
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28.0
31.0
34.0
37.0
40.0
44.0
48.0
Max (V)
2.6
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32.0
35.0
38.0
41.0
46.0
50.0
54.0
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
I
ZT
(mA)
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
Maximum Zener
Impedance
f = 1KHz
Z
ZT
@ I
ZT
(Ω)
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
30
40
45
55
55
70
80
80
80
90
130
150
170
180
Z
ZK
@ I
ZK
(Ω)
600
600
600
600
600
600
600
500
480
400
150
80
80
80
100
150
150
150
170
200
200
225
225
250
250
300
300
325
350
350
375
375
400
(mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Maximum Reverse
Current
(Note 8)
I
R
(µA)
50
20
10
5.0
5.0
3.0
3.0
3.0
2.0
1.0
3.0
2.0
1.0
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
R
(V)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
30.1
32.9
35.7
Temperature
Coefficient
@ I
ZT
mV/°C
Min
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
9.2
10.4
12.4
14.4
16.4
18.4
21.4
24.4
27.4
30.4
33.4
37.6
42.0
46.6
Max
0
0
0
0
0
0
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
18.0
-
-
-
-
-
-
-
-
-
-
ZB
ZC
ZD
ZE
ZF
ZG
ZH
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
Z9
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
YA
YB
YC
YD
YE
YF
YG
YH
6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
7. Valid provided the terminals are kept at ambient temperature.
8. Short duration pulse test used to minimize self-heating effect.
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
2 of 5
www.diodes.com
February 2014
© Diodes Incorporated
BZX84C2V4 - BZX84C51
500
50
P
D
, POWER DISSIPATION (mW)
400
I
Z
, ZENER CURRENT (mA)
40
300
Note 6
30
200
Note 7
20
100
10
0
0
100
T
A
, Ambient Temperature, (°C)
Fig. 1 Power Derating Curve
200
0
0
3
4
5
6
8
9 10
7
V
Z
, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
T
J
= 25°C
C47
C43
C51
1
2
30
T
j
= 25°C
C10
C12
10
I
Z
, ZENER CURRENT (mA)
20
C15
I
Z
, ZENER CURRENT (mA)
8
6
C18
Test current I
Z
2mA
C27
C33
C36
C39
4
Test Current I
Z
2mA
10
Test current I
Z
5mA
C22
2
0
0
10
20
30
40
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
100
T
J
= 25°C
0
0
20
30
40
50
70
60
V
Z
, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
10
1,000
C
T
, TOTAL CAPACITANCE (pF)
V
R
= 2V
100
V
R
= 1V
C
T
, TOTAL CAPACITANCE (pF)
V
R
= 1V
10
V
R
= 2V
100
10
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage
10
1
100
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage
10
1
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
3 of 5
www.diodes.com
February 2014
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
-
-
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
-
α
All Dimensions in mm
A
B C
H
K
J
F
D
G
L
K1
M
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
Y
Z
C
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
X
E
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
4 of 5
www.diodes.com
February 2014
© Diodes Incorporated
BZX84C2V4 - BZX84C51
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
5 of 5
www.diodes.com
February 2014
© Diodes Incorporated
NXP MCU
京公网安备 11010802033920号
EEWORLD
