BR25L160F-WE2 datasheet, PDF - EEWORLD Datasheet

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BR25L160F-WE2: DescriptionEEPROM SPI 16K BIT; Categorystorage storage; File Size731KB，20 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BR25L160F-WE2 Overview

EEPROM SPI 16K BIT

BR25L160F-WE2 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	SOIC
package instruction	LSOP, SOP8,.25
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	5 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e2
length	5 mm
memory density	16384 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Package body material	PLASTIC/EPOXY
encapsulated code	LSOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Serial bus type	SPI
Maximum standby current	0.000002 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN COPPER
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	10
width	4.4 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

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High Reliability Serial EEPROMs

SPI BUS Serial EEPROMs

BR25□□□□family

BR25L010-W series, BR25L020-W series, BR25L040-W series, BR25L080-W series,

BR25L160-W series, BR25L320-W series, BR25L640-W series

Description

BR25L

-W series is a serial EEPROM of SPI BUS interface method.

Features

Page write

Number of

pages

16 Byte

BR25L010-W

32 Byte

BR25L080-W

BR25L160-W

BR25L320-W

BR25L640-W

Product

number

BR25L020-W

BR25L040-W

*1 BR25L080/160-W : SOP8, SOP-J8, SSOP-B8, TSSOP-B8

*2 BR25L320/640-W : SOP8, SOP-J8

BR25L series

Capacity

1Kbit

2Kbit

4Kbit

8Kbit

16Kbit

32Kbit

64Kbit

Bit format

128 X 8

256 X 8

512 X 8

1K X 8

2K X 8

4K X 8

8K X 8

Type

BR25L010-W

BR25L020-W

BR25L040-W

BR25L080-W

BR25L160-W

BR25L320-W

BR25L640-W

Power source

voltage

SOP8

SOP-J8

SSOP-B8

TSSOP-B8

FVT

MSOP8

FVM

TSSOP-B8J

FVJ

1.8 ~ 5.5V

www.rohm.com

1/16

2010.07 -

Rev. B

BR25L160F-WE2 Related Products

	BR25L160F-WE2	BR25L160FV-WE2	BR25L160FVT-WE2	BR25L160FJ-WE2
Description	EEPROM SPI 16K BIT		NTC Thermistors 10Kohms 5%	EEPROM SPI 2048X8 BIT
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor
Parts packaging code	SOIC	SOIC	SOIC	SOIC
package instruction	LSOP, SOP8,.25	LSSOP, TSSOP8,.25	LSSOP, TSSOP8,.25	SOP, SOP8,.25
Contacts	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	5 MHz	5 MHz	5 MHz	5 MHz
Data retention time - minimum	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e2	e2	e2	e2
length	5 mm	4.4 mm	4.4 mm	4.9 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	2KX8	2KX8	2KX8	2KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LSOP	LSSOP	LSSOP	SOP
Encapsulate equivalent code	SOP8,.25	TSSOP8,.25	TSSOP8,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	NOT SPECIFIED	260
power supply	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.25 mm	1.25 mm	1.65 mm
Serial bus type	SPI	SPI	SPI	SPI
Maximum standby current	0.000002 A	0.000002 A	0.000002 A	0.000002 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN COPPER	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)	TIN COPPER
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.65 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	10	10	NOT SPECIFIED	10
width	4.4 mm	3 mm	3 mm	3.9 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Base Number Matches	1	1	-	1

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