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5962F1120201QXA

Description
QDR SRAM, 2MX36, 0.85ns, CMOS, CBGA165, 21 X 25 MM, 2.83 MM HEIGHT, CERAMIC, MO-158BE-1, CGA-165
Categorystorage    storage   
File Size459KB,35 Pages
ManufacturerCypress Semiconductor
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5962F1120201QXA Overview

QDR SRAM, 2MX36, 0.85ns, CMOS, CBGA165, 21 X 25 MM, 2.83 MM HEIGHT, CERAMIC, MO-158BE-1, CGA-165

5962F1120201QXA Parametric

Parameter NameAttribute value
Objectid1288119072
package instructionCGA, CGA165,11X15,50
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time0.85 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)250 MHz
I/O typeSEPARATE
JESD-30 codeR-CBGA-X165
length25 mm
memory density75497472 bit
Memory IC TypeQDR SRAM
memory width36
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2MX36
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeCGA
Encapsulate equivalent codeCGA165,11X15,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply1.8 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.38 mm
Maximum standby current0.66 A
Maximum slew rate1.7 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formUNSPECIFIED
Terminal pitch1.27 mm
Terminal locationBOTTOM
width21 mm
72-Mbit QDR II+ SRAM
Two-Word Burst Architecture
with RadStop™ Technology
72-Mbit QDR
®
II+ SRAM Two-Word Burst Architecture with RadStop™ Technology
CYRS1542AV18
CYRS1544AV18
®
Radiation Performance
Radiation Data
JTAG 1149.1 compatible test access port
DLL for accurate data placement
Total Dose
=300
Krad
Soft error rate (both
Heavy Ion
and proton)
Heavy ions
1 × 10
-10
upsets/bit-day with an external SECDED
EDAC Controller
Neutrons
= 2.0 × 10
14
N/cm
2
Dose rate = 2.0 × 10
9
rad(Si)/sec
Dose rate survivability (rad(Si)/sec) = 1.5 × 10^11 rad(Si)/sec
Latch up immunity = 120 MeV.cm
2
/mg (125 °C)
Configurations
CYRS1542AV18 – 4M × 18
CYRS1544AV18 – 2M × 36
Functional Description
The CYRS1542AV18 and CYRS1544AV18 are synchronous
pipelined SRAMs, equipped with 1.8-V QDR II+ architecture with
RadStop™ technology. Cypress’s state-of-the-art
RadStop
Technology
is radiation hardened through proprietary design and
process hardening techniques.
The QDR II+ architecture consists of two separate ports to
access the memory: the read port and the write port. The read
port has dedicated data output bus to support read operations
and the write port has dedicated data input bus to support write
operations. QDR II+ architecture completely eliminates the need
to “turnaround” the data bus that exists with common I/O devices.
Each port is accessed through a common address bus.
Addresses for read are latched on the rising edges of the input
(K) clock whereas addresses for write are latched on the falling
edges of the input (K) clock. Accesses to the QDR II+ read and
write ports are completely independent of each another. To
maximize data throughput, both read and write ports are
equipped with DDR interfaces. Each address location is
associated with two 18-bit words for CYRS1542AV18, or two
36-bit words for CYRS1544AV18 that burst sequentially into or
out of the device. Since data can be transferred on every rising
edge of both input clocks (K and K#), memory bandwidth is
maximized while simplifying system design by eliminating bus
“turnarounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks as well. Reads and
writes are conducted with on-chip synchronous self-timed
circuitry.
For a complete list of related resources,
click here.
Prototyping Options
Non qualified CYPT1542AV18 and CTPT1544AV18 devices
with same functional and timing characteristics in a
165-ball
Ceramic Column Grid Array
(CCGA) package and Land Grid
Array (LGA) package without solder columns attached.
Features
Separate independent read and write data ports
Supports concurrent transactions
250-MHz clock for high bandwidth
Two-word burst on all accesses
Double data rate (DDR) interfaces on both read and write ports
at 250 MHz (data transferred at 500 MHz)
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR
®
II operates with 2.0 cycle read latency when delay lock
loop (DLL) is enabled
Available in × 18 and × 36 configurations
Full data coherency, providing most current data
Core V
DD
= 1.8 V (±0.1 V); I/O V
DDQ
= 1.4 V to V
DD
Available in 165-ball CCGA (21 × 25 × 2.83 mm)
HSTL inputs and variable drive HSTL output buffers
Selection Guide
Description
Maximum operating frequency
Maximum operating current
(concurrent R/W)
× 18
× 36
250 MHz Unit
250
1700
1700
MHz
mA
Cypress Semiconductor Corporation
Document Number: 001-60006 Rev. *N
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised November 3, 2017

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