74HC00DB,112 datasheet, PDF - EEWORLD Datasheet

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74HC00DB,112: DescriptionLogic Gates QUAD 2-INPUT NAND GATE; Categorylogic logic; File Size792KB，15 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC00DB,112 Overview

Logic Gates QUAD 2-INPUT NAND GATE

74HC00DB,112 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SSOP1
package instruction	5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Contacts	14
Manufacturer packaging code	SOT337-1
Reach Compliance Code	compliant
series	HC/UH
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	6.2 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP14,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Sup	27 ns
propagation delay (tpd)	135 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	2 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5.3 mm
Base Number Matches	1

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74HC00; 74HCT00

Quad 2-input NAND gate

Rev. 7 — 25 November 2015

Product data sheet

1. General description

The 74HC00; 74HCT00 is a quad 2-input NAND gate. Inputs include clamp diodes. This

enables the use of current limiting resistors to interface inputs to voltages in excess of

2. Features and benefits



Input levels:



For 74HC00: CMOS level



For 74HCT00: TTL level



Complies with JEDEC standard no. 7A



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V



Multiple package options



Specified from

40 C

to +85

C

and from

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74HC00D

74HCT00D

74HC00DB

74HCT00DB

74HC00PW

74HCT00PW

74HC00BQ

74HCT00BQ

40 C

to +125

C

DHVQFN14

40 C

to +125

C

TSSOP14

40 C

to +125

C

SSOP14

40 C

to +125

C

Name

SO14

Description

plastic small outline package; 14 leads; body width

3.9 mm

plastic shrink small outline package; 14 leads; body

width 5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT108-1

SOT337-1

SOT402-1

Type number

plastic dual in-line compatible thermal enhanced very SOT762-1

thin quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

74HC00DB,112 Related Products

	74HC00DB,112	74HC00D,652	74HCT00PW	74HCT00D/AUJ	74HCT00D,652	74HCT00N,652	74HC00PW,112	74HC00BQ
Description	Logic Gates QUAD 2-INPUT NAND GATE	Logic Gates QUAD 2-IN NAND GATE	Logic Gates QUAD 2-INPUT NAND GATE	Logic Gates Quad 2-input NAND gate	Logic Gates QUAD 2-INPUT NAND	Logic Gates QUAD 2-IN NAND GATE 2INPUT	Logic Gates QUAD 2-INPUT NAND	Logic Gates
Brand Name	NXP Semiconductor	NXP Semiconductor	-	-	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-
Is it Rohs certified?	conform to	conform to	conform to	-	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	-	NXP	NXP	NXP	NXP
Parts packaging code	SSOP1	SOIC	TSSOP	-	SOIC	DIP	TSSOP	QFN
package instruction	5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14	SOP, SOP14,.25	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	-	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	DIP, DIP14,.3	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Contacts	14	14	14	-	14	14	14	14
Manufacturer packaging code	SOT337-1	SOT108-1	-	-	SOT108-1	SOT27-1	SOT402-1	-
Reach Compliance Code	compliant	compliant	unknown	-	compliant	compliant	compliant	compliant
series	HC/UH	HC/UH	HCT	-	HCT	HCT	HC/UH	HC/UH
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	-	R-PDSO-G14	R-PDIP-T14	R-PDSO-G14	R-PQCC-N14
JESD-609 code	e4	e4	e4	-	e4	-	-	e4
length	6.2 mm	8.65 mm	5 mm	-	8.65 mm	19.025 mm	5 mm	3 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	-	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	-	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A	-	0.004 A	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	1	1	1	-	1	-	1	1
Number of functions	4	4	4	-	4	4	4	4
Number of entries	2	2	2	-	2	2	2	2
Number of terminals	14	14	14	-	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SOP	TSSOP	-	SOP	DIP	TSSOP	HVQCCN
Encapsulate equivalent code	SSOP14,.3	SOP14,.25	TSSOP14,.25	-	SOP14,.25	DIP14,.3	TSSOP14,.25	LCC14,.1X.12,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packing	TUBE	TUBE	TUBE	-	TUBE	TUBE	TUBE	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	260	260	-	260	260	260	260
power supply	2/6 V	2/6 V	5 V	-	5 V	5 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	27 ns	27 ns	29 ns	-	29 ns	29 ns	27 ns	27 ns
propagation delay (tpd)	135 ns	135 ns	29 ns	-	29 ns	29 ns	135 ns	135 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	-	NO	NO	NO	NO
Maximum seat height	2 mm	1.75 mm	1.1 mm	-	1.75 mm	4.2 mm	1.1 mm	1 mm
Maximum supply voltage (Vsup)	6 V	6 V	5.5 V	-	5.5 V	5.5 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	4.5 V	-	4.5 V	4.5 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	-	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	-	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	-	NICKEL PALLADIUM GOLD	NICKEL/PALLADIUM/GOLD (NI/PD/AU)	NICKEL/PALLADIUM/GOLD (NI/PD/AU)	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING	-	GULL WING	THROUGH-HOLE	GULL WING	NO LEAD
Terminal pitch	0.65 mm	1.27 mm	0.65 mm	-	1.27 mm	2.54 mm	0.65 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	30	30	30	-	30	30	30	30
width	5.3 mm	3.9 mm	4.4 mm	-	3.9 mm	7.62 mm	4.4 mm	2.5 mm
Base Number Matches	1	1	1	-	1	1	1	1

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