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97SD3232RPQI

Description
Synchronous DRAM, 32MX32, 6ns, CMOS, PQFP132, QFP-132
Categorystorage   
File Size764KB,39 Pages
ManufacturerMaxwell Technologies Inc.
Download Datasheet Parametric Compare View All

97SD3232RPQI Overview

Synchronous DRAM, 32MX32, 6ns, CMOS, PQFP132, QFP-132

97SD3232RPQI Parametric

Parameter NameAttribute value
MakerMaxwell Technologies Inc.
Parts packaging codeQFP
package instructionQFF,
Contacts132
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeS-PQFP-F132
length34.29 mm
memory density1073741824 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals132
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize32MX32
Package body materialPLASTIC/EPOXY
encapsulated codeQFF
Package shapeSQUARE
Package formFLATPACK
Certification statusNot Qualified
Maximum seat height7.4676 mm
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch0.635 mm
Terminal locationQUAD
width34.29 mm
Base Number Matches1
97SD3232
1 Gb SDRAM
8-Meg X 32 Bit X 4-Banks
Logic Diagram
(One Amplifier)
Memory
F
EATURES
:
• 1 Gigabit ( 8-Meg X 32-Bit X 4-Banks)
• RAD-PAK® radiation-hardened against natural space
radiation
• Total Dose Hardness:
>100 krad (Si), depending upon space mission
• Excellent Single Event Effects:
SEL
TH
> 85 MeV/mg/cm2 @ 25°C
• JEDEC Standard 3.3V Power Supply
• Clock Frequency: 100 MHz Operation
• Operating tremperature: -55 to +125 °C
• Auto Refresh
• Single pulsed RAS
• 2 Burst Sequence variations
Sequential (BL =1/2/4/8)
Interleave (BL = 1/2/4/8)
• Programmable CAS latency: 2/3
• Power Down and Clock Suspend Modes
• LVTTL Compatible Inputs and Outputs
• Package: 132 Lead Quad Stack Pack Flat Package
D
ESCRIPTION
:
Maxwell Technologies’ Synchronous Dynamic Random
Access Memory (SDRAM) is ideally suited for space
applications requiring high performance computing and
high density memory storage. As microprocessors
increase in speed and demand for higher density mem-
ory escalates, SDRAM has proven to be the ultimate
solution by providing bit-counts up to 1 Gigabits and
speeds up to 100 Megahertz. SDRAMs represent a sig-
nificant advantage in memory technology over traditional
DRAMs including the ability to burst data synchronously
at high rates with automatic column-address generation,
the ability to interleave between banks masking pre-
charge time
Maxwell Technologies’ patented R
AD
-P
AK
®
packaging
technology incorporates radiation shielding in the micro-
circuit package. It eliminates the need for box shielding
for a lifetime in orbit or space mission. In a typical GEO
orbit, R
AD
-P
AK
®
provides greater than 100 krads(Si)
radiation dose tolerance. This product is available with
screening up to Maxwell Technologies self-defined Class
K.
All data sheets are subject to change without notice
02.04.05 Rev 3
1
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com
©2005 Maxwell Technologies
All rights reserved.

97SD3232RPQI Related Products

97SD3232RPQI 97SD3232RPQH 97SD3232RPQE 97SD3232RPQK
Description Synchronous DRAM, 32MX32, 6ns, CMOS, PQFP132, QFP-132 Synchronous DRAM, 32MX32, 6ns, CMOS, PQFP132, QFP-132 Synchronous DRAM, 32MX32, 6ns, CMOS, PQFP132, QFP-132 Synchronous DRAM, 32MX32, 6ns, CMOS, PQFP132, QFP-132
Maker Maxwell Technologies Inc. Maxwell Technologies Inc. Maxwell Technologies Inc. Maxwell Technologies Inc.
Parts packaging code QFP QFP QFP QFP
package instruction QFF, QFF, QFF, QFF,
Contacts 132 132 132 132
Reach Compliance Code compliant compliant unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Is Samacsys N N N N
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 6 ns 6 ns 6 ns 6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code S-PQFP-F132 S-PQFP-F132 S-PQFP-F132 S-PQFP-F132
length 34.29 mm 34.29 mm 34.29 mm 34.29 mm
memory density 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 32 32 32 32
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 132 132 132 132
word count 33554432 words 33554432 words 33554432 words 33554432 words
character code 32000000 32000000 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 32MX32 32MX32 32MX32 32MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFF QFF QFF QFF
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 7.4676 mm 7.4676 mm 7.4676 mm 7.4676 mm
self refresh YES YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT FLAT FLAT FLAT
Terminal pitch 0.635 mm 0.635 mm 0.635 mm 0.635 mm
Terminal location QUAD QUAD QUAD QUAD
width 34.29 mm 34.29 mm 34.29 mm 34.29 mm
Base Number Matches 1 1 1 1
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