97SD3240RPQH datasheet, PDF - EEWORLD Datasheet

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97SD3240RPQH: DescriptionSynchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132; Categorystorage; File Size601KB，39 Pages; ManufacturerMaxwell Technologies Inc.

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97SD3240RPQH Overview

Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132

97SD3240RPQH Parametric

Parameter Name	Attribute value
Maker	Maxwell Technologies Inc.
Parts packaging code	QFP
package instruction	GQFF,
Contacts	132
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
access mode	FOUR BANK PAGE BURST
Maximum access time	6 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	S-XQFP-F132
length	34.29 mm
memory density	1342177280 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	40
Number of functions	1
Number of ports	1
Number of terminals	132
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32MX40
Package body material	UNSPECIFIED
encapsulated code	GQFF
Package shape	SQUARE
Package form	FLATPACK, GUARD RING
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	QUAD
width	34.29 mm
Base Number Matches	1

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97SD3240

1.25Gb SDRAM

8-Meg X 40-Bit X 4-Banks

Logic Diagram

(One Amplifier)

Memory

EATURES

• 1.25 Gigabit ( 8-Meg X 40-Bit X 4-Banks)

• RAD-PAK® radiation-hardened against natural space

radiation

• Total Dose Hardness:

>100 krad (Si), depending upon space mission

• Excellent Single Event Effects:

SEL

> 85 MeV/mg/cm2 @ 25°C

• JEDEC Standard 3.3V Power Supply

• Clock Frequency: 100 MHz Operation

• Operating tremperature: -55 to +125 °C

• Auto Refresh

• Single pulsed RAS

• 2 Burst Sequence variations

Sequential (BL =1/2/4/8)

Interleave (BL = 1/2/4/8)

• Programmable CAS latency: 2/3

• Power Down and Clock Suspend Modes

• LVTTL Compatible Inputs and Outputs

• Package: 132 Lead Quad Stack Pack Flat Package

ESCRIPTION

Maxwell Technologies’ Synchronous Dynamic Random

Access Memory (SDRAM) is ideally suited for space

applications requiring high performance computing and

high density memory storage. As microprocessors

increase in speed and demand for higher density mem-

ory escalates, SDRAM has proven to be the ultimate

solution by providing bit-counts up to 1.25 Gigabits and

speeds up to 100 Megahertz. SDRAMs represent a sig-

nificant advantage in memory technology over traditional

DRAMs including the ability to burst data synchronously

at high rates with automatic column-address generation,

the ability to interleave between banks masking pre-

charge time

Maxwell Technologies’ patented R

-P

packaging

technology incorporates radiation shielding in the micro-

circuit package. It eliminates the need for box shielding

for a lifetime in orbit or space mission. In a typical GEO

orbit, R

-P

provides greater than 100 krads(Si)

radiation dose tolerance. This product is available with

screening up to Maxwell Technologies self-defined Class

All data sheets are subject to change without notice

10.05.07 Rev 5

(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com

97SD3240RPQH Related Products

	97SD3240RPQH	97SD3240RPQE	97SD3240RPQI	97SD3240RPQK
Description	Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132	Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132	Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132	Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132
Maker	Maxwell Technologies Inc.	Maxwell Technologies Inc.	Maxwell Technologies Inc.	Maxwell Technologies Inc.
Parts packaging code	QFP	QFP	QFP	QFP
package instruction	GQFF,	GQFF,	GQFF,	GQFF,
Contacts	132	132	132	132
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Is Samacsys	N	N	N	N
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	6 ns	6 ns	6 ns	6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	S-XQFP-F132	S-XQFP-F132	S-XQFP-F132	S-XQFP-F132
length	34.29 mm	34.29 mm	34.29 mm	34.29 mm
memory density	1342177280 bit	1342177280 bit	1342177280 bit	1342177280 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	40	40	40	40
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	132	132	132	132
word count	33554432 words	33554432 words	33554432 words	33554432 words
character code	32000000	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	32MX40	32MX40	32MX40	32MX40
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	GQFF	GQFF	GQFF	GQFF
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING	FLATPACK, GUARD RING
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	FLAT	FLAT	FLAT
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
width	34.29 mm	34.29 mm	34.29 mm	34.29 mm
Base Number Matches	1	1	1	1

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