Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
1. Do not apply voltages higher than V
DD
or less than GND
potential on any terminal except V
REF
and R
FB
.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods. This is a stress rat-
ing only and functional operation at or above this specifica-
tion is not implied.
ORDERING GUIDE
1
Model
DAC8248AW
2
DAC8248EW
DAC8248GP
DAC8248FW
DAC8248HP
DAC8248FP
DAC8248HS
3
Relative
Accuracy
(+5 V or +15 V)
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
Gain Error
(+5 V or +15 V)
±
1 LSB
±
1 LSB
±
2 LSB
±
4 LSB
±
4 LSB
±
4 LSB
±
4 LSB
Temperature
Range
–55°C to +125°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
Package
Description
24-Pin Cerdip
24-Pin Cerdip
24-Pin Plastic DIP
24-Pin Cerdip
24-Pin Plastic DIP
24-Pin Plastic DIP
24-Pin SOL
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.
2
For devices processed in total compliance to MIL-STD-883, add/883 after part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SO and PLCC packages, contact your local sales office.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8248 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. B
DAC8248
DICE CHARACTERISTICS
11.
12.
13.
14.
15.
16.
17.
18.
19.
10.
11.
12.
AGND
I
OUTA
R
FB A
V
REF A
DGND
DB7(MSB)
DB6
DB5
DB4
DB3
DB2
NC
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
NC
DB1
DB0(LSB)
RESET
LSB/MSB
DAC A/DAC
B
LDAC
WR
V
DD
V
REF B
R
FB B
I
OUT B
SUBSTRATE (DIE BACKSIDE) IS INTERNALLY
CONNECTED TO V
DD
.
Die Size 0.124
×
0.132 inch, 16,368 sq. mils
(3.15
×
3.55 mm, 10.56 sq. mm)
WAFER TEST LIMITS
@ V
Parameter
Relative Accuracy
Differential Nonlinearity
Full-Scale Gain Error
1
Output Leakage
(I
OUT A
, I
OUT B
)
Input Resistance
(V
REF A
, V
REF B
)
V
REF A
, V
REF B
Input
Resistance Match
Digital Input High
Digital Input Low
Digital Input Current
Supply Current
DC Supply Rejection
(∆Gain/∆V
DD
)
DD
= +5 V or +15 V, V
REF A
= V
REF B
= +10 V, V
OUT A
= V
OUT B
= 0 V; AGND = DGND = 0 V; T
A
= 25 C.
Conditions
Endpoint Linearity Error
All Grades are Guaranteed Monotonic
Digital Inputs = 1111 1111 1111
Digital Inputs = 0000 0000 0000
Pads 2 and 24
Pads 4 and 22
DAC8248G
Limit
±
1
±
1
±
4
±
50
8/15
±
1
2.4
13.5
0.8
1.5
±
1
2
0.1
0.002
Units
LSB max
LSB max
LSB max
nA max
kΩ min/kΩ max
% max
V min
V min
V max
V max
µA
max
mA max
mA max
%/% max
Symbol
INL
DNL
G
FSE
I
LKG
R
REF
∆R
REF
R
REF
V
INH
V
INL
I
IN
I
DD
PSR
V
DD
= +5 V
V
DD
= +15 V
V
DD
= +5 V
V
DD
= +15 V
V
IN
= 0 V or V
DD
; V
INL
or V
INH
All Digital Inputs V
INL
or V
INH
All Digital Inputs 0 V or V
DD
∆V
DD
=
±
5%
NOTES
1
Measured using internal R
FB A
and R
FB B
.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
First of all, I would like to thank EEWORLD for the opportunity to learn about such a powerful board as F7. Thanks to @nmg for his supervision and support! As the team leader, I am not very good at it...
Boost Converter simulation using simulink MATLAB / DC-DC step up converter：https://training.eeworld.com.cn/course/4413Boost converter simulation/modelling using simulink MATLAB. A boost converter (ste...
On the occasion of the 75th anniversary of Rohde & Schwarz, you can log on to [url=http://www.rohde-schwarz.com.cn/][color=#000000]http://www.rohde-schwarz.com.cn/[/color][/url] to participate in the ...
I have been looking for a dot matrix generation software for a long time but I can't find it. I need it urgently. If anyone has it, can you help me? Send me an email [email=lijianhuijgsdx@163.com]liji...
I am learning with a development board of STM32F103ZET6. I am currently using the serial port to send and receive data. I suddenly wanted to see how the data is transmitted during the transmission pro...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
Most cameras on the market use chips manufactured by Japanese companies like Sony, Sharp, Panasonic, and LG. South Korea now has the capability to produce chips, but the quality is somewhat inferio...[Details]
Automotive electronics systems are facing a dual challenge of functional safety and cybersecurity.
The NXP
S32K3
series MCUs utilize a deep protection system built with a Hardware Sec...[Details]
Anyone who has driven a pure electric vehicle will find that it starts much faster than a fuel vehicle. So why do pure electric vehicles start so quickly?
We all know that an engine's to...[Details]
With the rapid development of the automotive industry, automotive requirements for control, communication, and network management are becoming increasingly stringent. Hardware platforms based on 32...[Details]
introduction
Whether in the automotive entertainment or home theater system markets, consumers continue to demand more channels and speakers, each capable of handling higher audio po...[Details]
According to reports from Xinhua News Agency, Tianjin University official website and other media, Chinese researchers have recently broken through the bottleneck of energy density and application ...[Details]
Modern automotive electronics have entered a new phase of fundamental change and advancement, evolving from the application of electronic components to in-vehicle electronic systems. Sensors are on...[Details]
Comparison instructions compare two numbers, IN1 and IN2, of the same data type. IN1 and IN2 are located above and below the contact, respectively, and their data types must be the same. Operands c...[Details]
Automotive electronics often involve numerous electronic components, many of which have independent chips and programs that need to be burned. If problems arise during traditional socket burning du...[Details]
The suspension of a car is related to the comfort of driving, and it will also have a direct impact on the vehicle's performance indicators. Both fuel vehicles and electric vehicles use the suspens...[Details]
stm32/stm8
京公网安备 11010802033920号
EEWORLD
