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DS2165QL/T&R

Description
Audio DSPs
CategoryWireless rf/communication    Telecom circuit   
File Size319KB,17 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

DS2165QL/T&R Overview

Audio DSPs

DS2165QL/T&R Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeQLCC
package instructionQCCJ,
Contacts28
Reach Compliance Codecompliant
Law of compression and extensionA/MU-LAW
filterNO
JESD-30 codeS-PQCC-J28
JESD-609 codee0
length11.5062 mm
Humidity sensitivity level1
Number of functions1
Number of terminals28
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)245
Certification statusNot Qualified
Maximum seat height4.57 mm
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesADPCM CODEC
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.5062 mm
DS2165Q
16/24/32kbps ADPCM Processor
www.maxim-ic.com
FEATURES
§
§
Compresses/expands 64kbps PCM voice
to/from either 32kbps, 24kbps, or 16kbps
Dual fully independent channel architecture;
device can be programmed to perform either:
-
two expansions
-
two compressions
-
one expansion and one compression
Interconnects directly to combo-codec
devices
Input to output delay is less than 375ms
Simple serial port used to configure the
device
On-board time-slot assigner-circuit (TSAC)
function allows data to be input/output at
various time slots
Supports Channel Associated Signaling
Each channel can be independently idled or
placed into bypass
Available hardware mode requires no host
processor; ideal for voice storage
applications
Single +5V supply; low-power CMOS
technology
Available in 28-pin PLCC
3V operation version is available
(DS2165QL)
PIN ASSIGNMENT (Top View)
TM1
TM0
RST
NC
VDD
YIN
CLKY
NC
A0
A1
A2
A3
A4
A5
5
6
7
8
9
10
11
12
13 14
15
16
17
18
4
3
2
1
28
27
26
25
24
23
DS2165Q
22
21
20
19
§
§
§
§
§
§
§
§
§
§
FSY
YOUT
CS
SDI
SCLK
XOUT
NC
DESCRIPTION
The DS2165Q ADPCM processor chip is a dedicated digital-signal-processing (DSP) chip that has been
optimized to perform adaptive-differential pulse-code modulation (ADPCM) speech compression at three
different rates. The chip can be programmed to compress (expand) 64kbps voice data down to (up from)
either 32kbps, 24kbps, or 16kbps. The compression to 32kbps follows the algorithm specified by CCITT
Recommendation G.721 (July 1986) and ANSI document T1.301 (April 1987). The compression to
24kbps follows ANSI document T1.303. The compression to 16kbps follows a proprietary algorithm
developed by Dallas Semiconductor. The DS2165Q can switch compression algorithms on-the-fly. This
allows the user to make maximum use of the available bandwidth on a dynamic basis.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple
revisions of any device may be simultaneously available through various sales channels. For information about device errata,
click here:
http://www.maxim-ic.com/errata.
1 of 17
070802
SPS
MCLK
VSS
NC
XIN
CLKX
FSX
28-Pin PLCC

DS2165QL/T&R Related Products

DS2165QL/T&R DS2165QN/T&R DS2165QL+ DS2165Q+ DS2165QN+T&R DS2165Q+T&R DS2165QL
Description Audio DSPs Audio DSPs 16/24/32kbps ADPCM Processor Audio DSPs Audio DSPs 16/24/32kbps ADPCM Processor Audio DSPs 16/24/32kbps ADPCM Processor Audio DSPs Audio DSPs
Is it Rohs certified? incompatible incompatible conform to conform to conform to conform to incompatible
Maker Maxim Maxim Maxim Maxim Maxim Maxim Maxim
Parts packaging code QLCC QLCC QLCC QLCC QLCC QLCC QLCC
package instruction QCCJ, QCCJ, ROHS COMPLIANT, PLASTIC, LCC-28 QCCJ, QCCJ, QCCJ, PLASTIC, LCC-28
Contacts 28 28 28 28 28 28 28
Reach Compliance Code compliant compliant compliant compliant compliant compliant not_compliant
Law of compression and extension A/MU-LAW A/MU-LAW A/MU-LAW A/MU-LAW A/MU-LAW A/MU-LAW A/MU-LAW
filter NO NO NO NO NO NO NO
JESD-30 code S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-PQCC-J28 S-PQCC-J28
length 11.5062 mm 11.5062 mm 11.505 mm 11.505 mm 11.5062 mm 11.505 mm 11.505 mm
Number of functions 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ QCCJ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) 245 245 NOT SPECIFIED 260 260 260 245
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm 4.57 mm
Nominal supply voltage 3 V 5 V 3 V 5 V 5 V 5 V 3 V
surface mount YES YES YES YES YES YES YES
Telecom integrated circuit types ADPCM CODEC ADPCM CODEC ADPCM CODEC ADPCM CODEC ADPCM CODEC ADPCM CODEC ADPCM CODEC
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal form J BEND J BEND J BEND J BEND J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.5062 mm 11.5062 mm 11.505 mm 11.505 mm 11.5062 mm 11.505 mm 11.505 mm
Is it lead-free? Contains lead Contains lead - Lead free Lead free Lead free Contains lead
JESD-609 code e0 e0 - e3 e3 e3 e0
Humidity sensitivity level 1 1 - 1 1 1 1
technology CMOS - CMOS CMOS - CMOS CMOS
Terminal surface TIN LEAD TIN LEAD - Matte Tin (Sn) MATTE TIN MATTE TIN Tin/Lead (Sn/Pb)

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