JAN06 (1/5)
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-x2MyyF
1.55
μm
EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
DESCRIPTION
Module type FU-653SEA-x2MyyF is a 1.55μm EA
modulator integrated DFB-LD module with single-
mode optical fiber.
This module is suitable to a light source for use in
10Gb/s digital optical communication systems.
FEATURES
•
Input impedance is 50Ω
•
Electroabsorption Modulator integrated Multi quantum
wells (MQW) DFB Laser Diode
•
Emission wavelength is in full C band
•
Single mode optical fiber pig-tail
•
Built-in optical isolator
•
Built-in thermal electric cooler
•
7-pin Butterfly package with GPO connecto½
•
With photodiode for optical output monitor
•
RoHS (2002/95/EC) complian½
APPLICATION
STM-64, OC192 (10Gb/s)
Dense-WDM systems
ABSOLUTE MAXIMUM RATINGS
(Tld=Tset)
Parameter
Symbol
Conditions
Rating
Unit
Laser diode
Optical output power
Pf
CW
6
mW
Forward current
If
CW
200
mA
Reverse voltage
Vrl
CW
2
V
Modulator
Reverse voltage
Vrm
-
5
V
Forward voltage
Vfm
-
1
V
Photodiode for
Reverse voltage
Vrd
-
20
V
monitoring
Forward current
Ifd
-
2
mA
Thermoelectric
Current
Ipe
-
1.5
A
cooler(Note 1)
Voltage
Vpe
-
3
V
Operating case temperature
Tc
-
-20 to 70
°C
Storage temperature
Tstg
-
-40 to 85
°C
Note 1. Even if the thermoelectric cooler(TEC) is operated within the rated conditions, uncontrolled current loading or
operation without heat sink may easily damage the module by exceeding the storage temperature range.
Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the
catastrophic damage.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
JAN06 (2/5)
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-x2MyyF
1.55
μm
EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
ELECTRICAL/OPTICAL CHARACTERISTICS
(Tc=25°C, Tld=Tset, unless otherwise noted)
Item
Symbol
Condition(Note2)
Min.
Typ.
Max.
Unit
Threshold current
Ith
CW,Vm=0V
5
-
30
mA
Operating current
Iop
CW,Vm=0V
50
70
100
mA
Operating voltage
Vop
CW, If=Iop, Vm=0V
-
-
1.7
V
Input impedance
Zin
If=Iop
-
50
-
Ω
Optical output power Pf
(Note 3,4)
-2
-
-
dBm
from fiber end
Laser
diode Tset
-
15
-
35
°C
temperature
Wavelength
(Note 3,4)
(See teble 1)
nm
λc
Side mode
Sr
(Note 3,4)
35
40
-
dB
suppression ratio
Relative intensity
RIN
CW, If=Iop, Vm=0V,10GHz
-
-
-135
dB/Hz
noise
Power penalty
Pp
(Note 3,4,), 800ps/nm
-
-
2.0
dB
Extinction ratio
Ex
(Note 3,4)
10
-
-
dB
Rise/fall time
tr/tf
(Note 3,4),20-80%
-
-
45
ps
Cutoff frequency
fc
If=Iop,Vm=-1V
11
-
-
GHz
RF return loss
S11
10
15
-
dB
If=Iop,Vm=-1V, f≤5GHz
5
7
-
dB
If=Iop,Vm=-1V, f≤10GHz
Tracking error
Er
-
0.3
0.5
dB
If=Iop,Tc=-20∼70°C, Note 5
Monitor current
Imon
If=Iop,Vrd=-5V
0.1
-
1.5
mA
Dark current(PD)
Id
Vrd=-5V
-
-
0.1
μA
Capacitance(PD)
Ct
Vrd=-5V
-
10
-
pF
Optical isolation
Iso
35
-
-
dB
Tc=25°C
23
-
-
dB
Tc=-20∼70°C
Note 2 : Vm is EAM bias voltage at CW condition, Vpp and Voff are EAM amplitude and EAM high level
offset voltage respectively at modulation condition.
Note 3 : 9.95328Gbps, NRZ, PRBS2^23-1, If=Iop,Vpp=2.5V,Voff=0V to –1V
Note 4 : Optical return loss of the connectors should be greater than 40dB in order to get specified performance.
Note 5 : Er=10×log[Pf(Tc)/Pf(25°C)]
THERMAL CHARACTERISTICS
Parameter
Thermistor resistance
B constant of Rth
Cooling capacity
Cooler current
Cooler voltage
Symbol
Rth
B
ΔT
Ipe
Vpe
Conditions
(Note2)
Min.
9.5
-
55
-
-
Limits
Typ.
10
3950
-
0.6
1.2
Max.
10.5
-
-
1.2
2.5
Unit
Ω
K
°C
A
V
Tc=Tld=25°C,
-
-
If=Iop, Tc=70°C,Tld=25°C
If=Iop, Tc=70°C,Tld=25°C
FIBER PIGTAIL SPECIFICATIONS
Parameter
Type
Mode field diameter
Cladding diameter
Secondary coating outer diameter
Connector
Optical return loss of connector
Specification
SM
9.5±1
125±2
0.9±0.1
See ordering information
40(min)
Unit
-
μm
μm
mm
-
dB
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
JAN06 (5/5)
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-x2MyyF
1.55
μm
EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that
results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended
to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly
observed.
Warning!
1. Eye safety :
Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-
viewer, or other appropriate instruments.
2. Product handling :
The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in
one's mouth or swallow it.
3. Product disposal :
This product must be disposed of as special industrial waste. It is necessary to separate it from general
industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1)
The products described in this specification are designed and manufactured for use in general communication systems or
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2)
When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi
Electric or an authorized distributor.
2. Shipping Conditions:
(1)
During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical
fiber, or other problems.
(2)
Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3)
Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not
taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The
main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over
the following general cautions):
(1)
Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in
case of long-term storage for six months or more.
(2)
The atmosphere should be particularly free from toxic gases and dust.
(3)
Do not apply any load on the product.
(4)
Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead
causing soldering problems in the customer’s assembling process.
(5)
Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for
storing. Temperature in storage locations should be stable.
(6)
When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the
atmosphere.
(7)
Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products
require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1)
Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly
lower the reliability, but also may lead to serious accidents.
(2)
Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested
to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When
handling this product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1)
Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot
plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2)
Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at
work is highly recommended.
(3)
Use conductive materials for this product’s container, etc.
(4)
It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work
area, etc.
(5)
When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),
pay close attention to the static electricity in those parts. ESD may damage the product.
(6)
Humidity in working environment should be controlled to be 40 percent RH or higher.
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
Microcontroller MCU
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