EEWORLDEEWORLDEEWORLD

Part Number

Search

30700-1187

Description
Automotive Connectors HDAC64 DR FEMALE 18 LE 18 CKT GRAY POL 1
CategoryThe connector    The connector   
File Size28KB,1 Pages
ManufacturerMolex
Websitehttps://www.molex.com/molex/home
Environmental Compliance
Download Datasheet Parametric View All

30700-1187 Online Shopping

Suppliers Part Number Price MOQ In stock  
30700-1187 - - View Buy Now

30700-1187 Overview

Automotive Connectors HDAC64 DR FEMALE 18 LE 18 CKT GRAY POL 1

30700-1187 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMolex
Reach Compliance Codecompliant
Other featuresPOLARIZED
Connector typeCOMBINATION LINE CONNECTOR
Contact to complete cooperationNOT SPECIFIED
Contact point genderMALE
Contact materialNOT SPECIFIED
DIN complianceNO
empty shellNO
Filter functionNO
IEC complianceNO
MIL complianceNO
Manufacturer's serial number30700
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation typeBOARD
OptionsGENERAL PURPOSE
Shell materialGLASS FILLED SYNDIOTACTIC POLYSTYRENE
Termination typeSOLDER
Total number of contacts18
Base Number Matches1
This document was generated on 05/16/2018
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0307001187
Active
H-DAC 64™ Dual-Row High Density Automotive Connectors
2.54mm Pitch, 0.64mm Width H-DAC 64 High Density Automotive Connectors, Dual
Row, Female Harness Assembly, 18 Circuits, Polarization Option 1, Gray
Documents:
3D Model
Drawing (PDF)
Product Specification PS-30700-0001-001 (PDF)
Product Specification PS-30968-0001-001 (PDF)
General
Product Family
Series
Application
Comments
Overview
Product Name
UPC
Physical
Circuits (maximum)
Color - Resin
Gender
Glow-Wire Capable
Lock to Mating Part
Material - Resin
Net Weight
Number of Rows
Packaging Type
Panel Mount
Pitch - Mating Interface
Polarized to Mating Part
Stackable
Temperature Range - Operating
Electrical
Current - Maximum per Contact
Solder Process Data
Lead-freeProcess Capability
Material Info
Reference - Drawing Numbers
Application Specification
Packaging Specification
Product Specification
Sales Drawing
Application Specification AS-30700-000-001 (PDF)
Packaging Specification PK-30907-417 (PDF)
RoHS Certificate of Compliance (PDF)
Series image - Reference only
EU ELV
Compliant
EU RoHS
China RoHS
Compliant
REACH SVHC
Not Contained Per
-ED/01/2018 (15
January 2018)
Halogen-Free
Status
Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
China ROHS
ELV
RoHS Phthalates
Green Image
Compliant
Not Contained
Crimp Housings
30700
Power, Wire-to-Board, Wire-to-Wire
Polarization Option 1
H-DAC 64™ Dual-Row High Density Automotive
Connectors
H-DAC 64
822348516391
18
Gray
Receptacle
No
Yes
Modified Polystyrene Alloy, Polyester
4.861/g
2
Bag
No
2.54mm
Yes
No
-40°C to +100°C
7.0A
N/A
Search Parts in this Series
30700 Series
Mates With
H-DAC 64 Header 30700-4184 ,
30700-4187 , 30700-5184 , 30700-5187 ,
Crimp Housing 30968
Use With
Contact Molex for Terminal information.
AS-30700-000-001
PK-30907-417
PS-30700-0001-001, PS-30968-0001-001
SD-30700-120
This document was generated on 05/16/2018
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Learn about MSP430FR5969 remote upgrade
MSP430 remote upgrade function: based on 1. External EEPROM (if the internal flash is large enough, it can also be used) 2. RF communication 3. Host computer software (transfer upgrade files) Summary ...
fish001 Microcontroller MCU
I would like to ask for the analysis of the startup process and memory mapping of ARM9 CPU (taking S3C2440 as an example), thank you!
I am a novice, can I ask you a question: Analysis of the boot process and memory mapping of ARM9 CPU (taking S3C2440 as an example), thanks! Or recommend where there is detailed reference material, th...
bingxue668 ARM Technology
High-speed data acquisition card realizes WLAN baseband transmission module test system
This article describes how to make a wireless local area network (WLAN) baseband transmission module test system using a high-speed data acquisition card with appropriate specifications as an example,...
lorant Test/Measurement
Urgent Purchase
Urgently looking for 28 x86 motherboard CE system industrial computers with wifi and wired network connection. Does anyone have them in stock? Thank you...
gregsh Industrial Control Electronics
Please help me with error C2440: '=' : cannot convert from 'void *' to 'unsigned char *'
pNew = LocalReAlloc ( pPtr, dwSize, LMEM_MOVEABLE); Compiling... Chap10.cpp E:\WORKING\WIN CE\Chap10\Chap10.cpp(219) : error C2440: '=' : cannot convert from 'void *' to 'unsigned char *' Conversion f...
znstchhh Embedded System
[EEWORLD 48th] Community star figures for March 2013 are announced!
[color=#000][font=Helvetica, Arial, sans-serif]Thank you for your attention and support to the forum. Here we have selected the netizens who have made outstanding contributions to the forum in March. ...
EEWORLD社区 Suggestions & Announcements

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2470  2760  2110  1533  1449  50  56  43  31  30 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号