346-93-130-41-012000 datasheet, PDF

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346-93-130-41-012000: DescriptionIC & Component Sockets Interconnect Socket; CategoryThe connector socket; File Size409KB，1 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

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346-93-130-41-012000 Overview

IC & Component Sockets Interconnect Socket

346-93-130-41-012000 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	SIP SOCKET
Contact to complete cooperation	GOLD (30) OVER NICKEL (100)
Contact completed and terminated	Tin/Lead (Sn/Pb)
Contact material	NOT SPECIFIED
Device slot type	IC SOCKET
Type of equipment used	SIP30
Shell material	POLYETHYLENE
JESD-609 code	e0
Number of contacts	30
Base Number Matches	1

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INTERCONNECTS

SERIES 304, 346 • .100” GRID SOLDERLESS PRESS

FIT •

SINGLE ROW STRIPS

•

Unique compliant tail pins conform to the

plated through-hole without stressing the

inner layers of a multilayer board

series: .036”-.041” use a 1,1mm drill prior to

plating. Using MM #0477 & #0478 pins. See

page 162 for details

.015-.025

.010 .018

•

Recommended plated through-hole for 304

.175

.102

.110

.150

.044 DIA.

.025 DIA.

.026

.072

.175

•

For 346 series: .040”+.003” nished plated

through-hole. Using MM #4612 & #4613 pins.

See page 162 for details. Patent No. 4,799,904

•

Hi-Rel, 4- nger BeCu #30 contact is rated at

3 amps. See page 253 for details

FIG. 1

.015-.025

.010 .018

•

Insulators are high temperature thermoplastic

ORDERING INFORMATION

Series 304...770

.175

.102

.110

.150

Solderless Press-Fit

For .062” Thick Boards

.044 DIA.

.025 DIA.

.026

.072

.250

FIG. 1

Series 304...780

304 XX 1_ _ 41 770000

Specify number of pins

01-64

Solderless Press-Fit

For .125” Thick Boards

FIG. 2

.015-.025

.010 * .018

.101

.110

.195

FIG. 2

304 XX 1_ _ 41 780000

Specify number of pins

01-64

.150

Mill-Max recommends plating Code 13 for Series 304...770 and 304...780

.173

Series 346...012

Compliant Solderless Press-Fit

346 XX 1_ _ 41 012000

.045 DIA.

.120

.035 DIA.

.018

SLOT

FIG. 3

For .060”-.100” Thick Boards

Specify number of pins

01-64

FIG. 3

.015-.025

.010 * .018

.101

.110

.195

Series 346...013

Compliant Solderless Press-Fit

PAGE 73 | INTERCONNECTS

346 XX 1_ _ 41 013000

FIG. 4

.173

For .090”-.130” Thick Boards

.150

Specify number of pins

RoHS - 2

01-64

For

Electrical, Mechanical

& Enviromental Data,

See page 264

.045 DIA.

.175

2011/65/EU

.035 DIA.

.018

SLOT

XX=Plating Code

See Below

µ”

SPECIFY PLATING CODE XX=

µ”

FIG. 4

Sleeve (Pin)

Contact (Clip)

µ”

200

µ”

Sn/Pb 200

µ”

Sn/Pb 200

µ”

Sn/Pb

200

µ”

Sn 200

µ”

Sn 200

µ”

100

µ”

Sn/Pb

µ”

Au 100

µ”

Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com

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