SPRING-LOADED
CONNECTORS
SERIES 821 & 823 • .100” GRID THROUGH-HOLE MOUNT •
SINGLE AND DOUBLE ROW STRIPS
• Modular contacts for use on .100” grid, available in five heights from .137” to .236”, supplied
in single and double row contact strips
• Precision-machined piston / base and gold-plated components assure up to 1,000,000
cycle life durability
• Pistons have a long stroke relative to the low profile of the assembly
• Low resistance, high current contacts are rated at 2 amps continuous, 3 amps peak
• High temperature thermoplastic insulators are suitable for surface mount processes
• Both 821 & 823 series contact strips are designed for manual placement into Ø .022±.003”
plated through-holes in the circuit board prior to hand, wave or reflow soldering
SINGLE ROW Series 821
ORDERING INFORMATION
Single Row Series 821
821-22-0XX-10-00X101
Specify number of contacts
02-64
Specify contact style
0-4
Stroke
.042 DIA.
Stroke
B
A
.071
.110
B
A
Double Row Series 823
823-22-0XX-10-00X101
Specify number of contacts
04-72
CONTACT STYLE
0
1
2
3
4
INITIAL HEIGHT A
.137
.177
.197
.217
.236
Specify contact style
0-4
MAX. STROKE B
.039
.045
.055
.055
.055
.016
.069
.017 DIA.
.072 DIA.
Style 0 only
DOUBLE ROW Series 823
B
A
.071
Materials:
Contact piston & base: Machined copper alloy plated 20μ” gold over
100μ” nickel
Spring: Beryllium copper-plated 10μ” gold
Insulator: High temperature thermoplastic, rated UL94 V-0
Mechanical:
Spring force @ initial height (A): 25 grams
Spring force @ mid stroke (B/2): 60 grams
Durability: Up to 1,000,000 cycles
Electrical:
Voltage rating: 100Vrms/150Vdc
Current rating: 2A (continous), 3A (peak) per contact
Contact resistance: 20mW max.
Insulation resistance: 10,000MW min.
Dielectric strength: 700Vrms min.
Capacitance: 1pF max.
Style 0 only
Stroke
.100
.042 DIA.
B
A
.110
.016
.069
.017 DIA.
.072 DIA.
2011/65/EU
RoHS - 2
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
PAGE 13 | SPRING-LOADED CONNECTORS
Stroke
Technical Specifications
Embedded System
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