1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C
2. Irms: DC current for an approximately
∆T
of 40°C without core loss. Derating is necessary for
AC currents. Pad layout, trace thickness and width, airflow, and proximity of other heat generating
components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 155°C under worst case conditions verified in the end application.
3. Peak current for approximately 20% rolloff @20°C
4. Peak current for approximately 30% rolloff @20°C
5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at
operating frequency necessary to generate additional core loss which contributes to the 40°C
temperature rise. De-rating of the I
rms
is required to prevent excessive temperature rise.
The 100% Vμs rating is equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option).
6. Part number definition: HC9-xxx-R
HC9= Product code and size
xxx = Inductance in μH. R = decimal point. If no R is present last character equals number of zeros.
-R suffix = RoHS compliant
Dimensions–mm
HC9-xxx-R
Part marking: HC9= (Product code and size)-xxx=(inductance value
in uH, R= decimal point. If no R is present then last character equals
number of zeros. wwlyly=date code, R=revision level
Tolerances are ±0.2 millimeters unless stated otherwise
Do not route traces or vias underneath the inductor
Packaging information–mm
Supplied in tape and reel packaging, 450 parts per reel, 13” diameter reel.
HC9-xxx-R
2
www.eaton.com/elx
HC9
High current power inductors
Rolloff
Technical Data
DS4312
Effective December 2015
Core loss
www.eaton.com/elx
3
Technical Data
DS4312
Effective December 2015
HC9
High current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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