EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AG-00-1003-G

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WBC-B0202AG-00-1003-G Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AG-00-1003-G - - View Buy Now

WBC-B0202AG-00-1003-G Overview

Resistor Networks & Arrays

WBC-B0202AG-00-1003-G Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
An error occurred when compiling make image with uClinux. First aid...
An error occurred while making image. The following is the error prompt: arm-linux-objcopy -O binary --remove-section=.romvec \ --remove-section=.text --remove-section=.ramvec \ --remove-section=.init...
k77777 Linux and Android
I'd like to ask, does anyone use vivado? How is your experience? Are you used to it?
I have always used ISE, and I am not used to Vivado:Cry: eeworldpostqq...
xiefei FPGA/CPLD
Proteus simulation of DS18B20 temperature sensor
The minimum temperature resolution is 0.5 degrees;The display range is -10 degrees to +50 degrees;The current temperature value is displayed with LED;The upper and lower temperature limits can be set ...
historyarea MCU
How to get started with ti CC series RF chips?
How to get started with ti CC series RF chips? I have never been exposed to RF knowledge before, so I have no idea about this. Now I have something related to do, what RF knowledge do I need to master...
楼高独望群 RF/Wirelessly
IWR1642/AWR1642 GPADC Function Introduction and Implementation
The millimeter wave sensor chip of IWR1642 integrates the function of general-purpose ADC (GPADC). Users can use GPADC to monitor external voltages, such as power supply voltage. The ADC sampling rate...
灞波儿奔 DSP and ARM Processors
【Smart Sports Watch】1. Unboxing
I received a express delivery in a big box. I thought it was a big development board, but when I opened it, I found that the box was just big and the board was still very small. The big box and foam b...
hehung onsemi and Avnet IoT Innovation Design Competition

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1783  753  1438  1298  1117  36  16  29  27  23 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号