VS6650
1.0 Megapixel SMIA Camera Module
DATA BRIEF
FEATURES
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1.0 Megapixel resolution (1152H x 864V)
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SMIA
1
1.0 profile 1 compliant imager
CCP 2.0 serial video interface
Two-wire control port (CCI)
On-chip PLL based on 13 MHz system clock
Up to 30 frame per second (fps) progressive
scan, with smooth frame rate control
Horizontal downscale from 1x to 4.5x in 1/16
steps
Operation from 2.4 V analog power supply
Low EMI 1.8 V digital and I/O power supply
30 µW power-down consumption
10-bit on-chip ADC
Small size 1/3 inch lens fixed focus module
Integral EMC shielding
The VS6650 features allow straightforward inte-
gration into mobile phone designs: low EMI video
interface and package/socket shielding, low wire
count (8 total), embedded power management (30
µW power-down) and embedded PLL. A minimal
list of external components is required: supply de-
coupling capacitors, CCI pull-ups and a charge-
pump capacitor.
The VS6650 3-element lens design ensures high
quality image capture while maintaining low mod-
ule height. The overall optical stack, including lens
system, IR filter and sensor optical structures is
developed within ST.
The VS6650 package uses the second generation
of SmOP2 packaging technology. Sensor and lens
are assembled in a fully automated test and focus
process for high volume and low cost production.
This 1.0 Megapixel sensor fits within the SMIA95
form factor (9.5 x 9.5 x 7.6 mm
3
).
APPLICATIONS
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Mobile phone
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DESCRIPTION
The VS6650 is a 1.0 Megapixel camera module for
use across a range of mobile phone platforms.
The camera module, which is SMIA 1.0 profile 1
compliant, can generate 1.0 Megapixel images up
to 30 fps.
Based on the SMIA architectural concepts, the
VS6650 can be used with or without image pro-
cessor (i.e. STV0976 or STV0984). The module is
suitable for performance-driven camera phones
and cost-driven high volume designs. The embed-
ded horizontal scaler typically enables the realiza-
tion of power-efficient viewfinder that uses host
software processing. For performance driven ap-
plications or when a different video interface is re-
quired, the STV0976 mobile imaging processor
ensures state-of-the-art image reconstruction and
compression at up to 15 fps.
PDA
Wireless security camera
Table 1. Order Codes
1.Standard Mobile Imaging Architecture, visit
www.smia-forum.org
Part Number
VS6650S02F/T2
Description
SmOP2 SMIA95 22” tape and reel
Rev. 1
October 2004
1/3
VS6650
Figure 1. Application Diagram
EXTCLK
STV0976
XSHUTDOWN 1.0 Megapixel
SMIA
Mobile
CCI
Imaging
Processor
(optional)
CCP 2.0
Baseband
or
Application
Processor
Table 2. Technical Specifications
Active pixels
1152H x 864V
4.0 µm x 4.0 µm
4.640 mm x 3.488 mm
RGB Bayer
+120 dB
+24 dB (max)
61 dB (typical)
35 dB at 100 lux
5 to 30 Hz (1152H x 864V)
Raw Bayer 10-bit
Raw Bayer 8-bit compressed
CCP 2.0 high-speed serial
390 Mbit/s D/S encoding
1.8 V LVDS
6 to 27 MHz square
13 MHz typ. (on-chip PLL)
2.4 to 2.9 V analog
1.8 V ± 0.1 V digital
1.8 V CMOS levels
Streaming @ 15 fps: 85 mW
max.
Power down: 15µW max.
3-element 50° HFOV f#3.2
50 cm to infinite
<1%
45 % (typical)
SmOP2 SMIA 95
9.5 x 9.5 x 7.6 mm
3
(wlh)
16-pin SMD socket with EMC
shield
Pixel size
Array size
Color filter array
Exposure control
Analog gain
Dynamic range
VS6650
1.0 Megapixel
SMIA Camera
Module
Figure 2. Block Diagram
Signal-to-noise
Ratio
Frame rate
VS6650
EXTCLK
XSHUTDOWN
PLL and Clock Management
Power Mgmt Power-On Reset
CCI
Receiver
Sensor
Control
Registers
1160 x 872
Pixel array
1152 x 864
VDIG
DGND
VCAP
VANA
AGND
Pixel format
Video Interface
SCL
SDA
CLKP
CLKN
DATAP
DATAN
Y Decoder
CCP 2.0
Transmitter
Readout
SMIA
Profile 1
Frame
Formatter
Clock input
Column ADC
X Decoder
Line SRAM
Supply voltage
I/O voltage
Power
consumption
Lens
Depth of field
TV distortion
Relative
illumination
Package type
Package size
System attach
Figure 3. Outline Drawing
Table 3. Temprature Range
Storage
Functional
Normal operating
Optimal operating
Test
-40 to +85°C
-30 to +70°C
-25 to +55 °C
+5 to +30°C
23 ± 2°C
2/3
VS6650
REVISION HISTORY
Table 4. Revision History
Date
October 2004
Revision
1
First Issue
Description of Changes
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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Embedded System
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