MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Dual 4-Input OR/NOR Gate
ELECTRICAL CHARACTERISTICS
–30°C
Characteristic
Ch
i i
Power Supply Drain Current
Input Current
Switching Times
Propagation Delay
Rise Time, Fall Time
(10% to 90%)
Symbol
S b l
IE
IinH
t+–
t–+
t +, t –
Min
—
—
0.6
0.6
0.6
Max
—
—
1.8
1.6
2.2
+ 25°C
Min
—
—
0.6
0.6
0.6
Max
28
350
1.7
1.5
2.1
+ 85°C
Min
—
—
0.6
0.6
0.6
Max
—
—
1.9
1.7
2.3
ns
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
MC1660
Unit
U i
mAdc
µAdc
ns
LOGIC DIAGRAM
AIN1
AIN2
AIN3
4
5
6
3 AOUT
2 AOUT
VCC1
14 BOUT
15 BOUT
AOUT
AOUT
AIN1
AIN2
OUT = IN1 + IN2 + IN3 + IN4
OUT = IN1 + IN2 + IN3 + IN4
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
AIN3
AIN4
VEE
6
7
8
11
10
9
BIN2
BIN1
NC
1
2
3
4
5
16
15
14
13
12
VCC2
BOUT
BOUT
BIN4
BIN3
PIN ASSIGNMENT
AIN4 7
BIN1 10
BIN2 11
BIN3 12
BIN4 13
tpd = 0.9 ns typ (510 ohm load)
= 1.1 ns typ (50 ohm load)
PD = 120 mW typ/pkg (No load)
Full Load Current, IL = –25 mAdc max
3/93
©
Motorola, Inc. 1996
4–352
REV 5
MC1660
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
9
–A–
16
–B–
1
8
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
–T–
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
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◊
MECL Data
DL122 — Rev 6
4–353
*MC1660/D*
MC1660/D
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