1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0. 1Vrms, 0.0 Adc, +25 °C
2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, I
sat
1, +25 °C
3. I
rms
: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 125 °C under worst case operating conditions verified in the end application.
4. I
sat
1: Peak current for approximately 20% rolloff @ +25 °C
5. I
sat
2: Peak current for approximately 20% rolloff @ +125 °C
6. K-factor: Used to determine B
p-p
for core loss (see graph).
B
p-p
= K * L *
∆I
* 10
-3
. B
p-p
:(Gauss), K: (K-factor from table),
L: (Inductance in nH),
∆I
(Peak to peak ripple current in Amps).
7. Part Number Definition: FP0708Rx-Rxx-R
FP0708= Product code and size
Rx= Version indicator
-Rxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: 0708Rx (Rx = version indicator), Rxx = Inductance value in uH, R = decimal point,
wwllyy = date code, R = revision level
Tolerances are ±0.15 millimeters unless stated otherwise
PCB tolerances are ±0.1 millimeters unless stated otherwise
All soldering surface to be coplanar within 0.1016 millimeters
DCR measured between point “a” and point “b”
Do not route traces or vias underneath the inductor
Packaging information (mm)
Supplied in tape and reel packaging , 640 parts per 13” diameter reel
2
www.eaton.com/elx
FP0708
High frequency, high current power inductors
Temperature rise vs. total loss
Technical Data
4334
Effective January 2016
Core loss vs. B
p-p
www.eaton.com/elx
3
Technical Data
4334
Effective January 2016
FP0708
High frequency, high current power inductors
Inductance characteristics
4
www.eaton.com/elx
FP0708
High frequency, high current power inductors
Solder reflow profile
Technical Data
4334
Effective January 2016
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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