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CM453232-1R5JL

Description
Fixed Inductors CHIP INDUCTOR SMT 1.5uH
CategoryPassive components    inductor   
File Size308KB,3 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
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CM453232-1R5JL Overview

Fixed Inductors CHIP INDUCTOR SMT 1.5uH

CM453232-1R5JL Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
package instruction1812
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time12 weeks
uppercase and lowercase codes1812
structureRectangular
core materialFERRITE
DC Resistance0.6 Ω
Nominal inductance(L)1.5 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee3
Number of functions1
Number of terminals2
Maximum operating temperature100 °C
Minimum operating temperature-40 °C
Package height3.2 mm
Package length4.5 mm
Package formSMT
Package width3.2 mm
method of packingTR, 7 Inch
Minimum quality factor (at nominal inductance)50
Maximum rated current0.41 A
self resonant frequency70 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceMatte Tin (Sn)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency7.96 MHz
Tolerance5%
Base Number Matches1
PL
IA
NT
Features
n
High resistance to heat and humidity
OM
*R
oH
S
LE
AD
F
RE
E
pressure
n
Accurate dimensions for automatic
surface mounting
n
Wide inductance range (1.0 nH to 1000 µH)
n
RoHS compliant*
n
Resistance to mechanical shock and
C
22
0K
CM45 Series SMT Chip Inductors
General Specifications
Temperature Rise ...................................................................................................................................................................... 20 ˚C max.
Ambient Temperature .............................................................................................................................................................. 100 ˚C max.
Operating Temperature....................................................................................................................................................-40 °C to +125 °C
Storage Temperature .......................................................................................................................................................-40 °C to +125 °C
Resistance to Soldering Heat .........................................................................................................................................260 ˚C, 5 seconds
Materials
Core Material ............................................................................................................................................................................Ferrite Core
Coil Type...................................................................................................................................................................................Copper wire
Enclosure.................................................................................................................................................................................. Epoxy resin
Terminal ...................................................................................................................................................................................................Sn
CM453232
Product Dimensions
Marking
3.2 ± 0.2
(.125 ± .008)
1.9
(.075)
4.5 ± 0.3
(.177 ± .012)
1.2
(.047)
c
a
b
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Recommended Land Pattern Dimensions
3.2 ± 0.2
(.125 ± .008)
1.0
(.039)
1.0
(.039)
1.7 ± 0.2
(.066 ± .008)
a
2.0 to 2.4
(.079 to .094)
b
5.0 to 5.3
(.197 to .209)
c
1.4 to 1.7
(.055 to .067)
DIMENSIONS:
MM
(INCHES)
Soldering Profile
Temperature
Rising Area
Preheat Area
150~200 °C / 60~180 sec.
Reflow Area
Forced Cooling Area
6 °C / sec. max.
250
245
Temperature (°C)
217
200
60 ~ 150 sec.
20 ~ 40 sec.
Peak Temperature:
250 °C max.
Time at Peak
Temperature -5 °C:
20~40 sec. max.
Time Above 217 °C:
60 ~ 150 sec. max.
200 ~ 250 % Average
Ramp-up Rate:
3 °C / sec. max.
150
100
50
0
50
100
150
200
250
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.

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